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    BIOMARKER FOR AMYLOID-B-RELATED NEUROLOGICAL DISORDERS
    3.
    发明申请
    BIOMARKER FOR AMYLOID-B-RELATED NEUROLOGICAL DISORDERS 审中-公开
    生物标记物与AMYLOID-B相关的神经疾病

    公开(公告)号：US20130302838A1

    公开(公告)日：2013-11-14

    申请号：US13994313

    申请日：2011-12-05

    申请人： Yasuo Kokai ,  Hitoshi Sohma ,  Shinichi Imai ,  Kayo Matsumoto ,  Michitoshi Kimura

    发明人： Yasuo Kokai ,  Hitoshi Sohma ,  Shinichi Imai ,  Kayo Matsumoto ,  Michitoshi Kimura

    IPC分类号： G01N33/68

    CPC分类号： G01N33/6896 ,  G01N33/6812 ,  G01N2333/4709 ,  G01N2800/2821

    摘要： A novel biomarker for diagnosing amyloid β-related neuropathy such as Alzheimer's disease is provided. Disclosed is a method for diagnosing Alzheimer's disease comprising measuring the level of a MFG-E8 protein in a blood, serum or plasma sample obtained from a human or animal subject, wherein the measured value is used as a marker for diagnosis of Alzheimer's disease. The MFG-E8 protein is found to bind to phosphatidylserine in a Ca2+ dependent manner in a culture supernatant of mouse brain nerve cells, which are a dementia model stimulated with Aβ42. It is also found that the level of the MFG-E8 protein is increased in patients with Alzheimer's disease.

    摘要翻译： 提供了用于诊断淀粉样蛋白β相关神经病如阿尔茨海默氏病的新型生物标志物。 公开了一种用于诊断阿尔茨海默病的方法，包括测量从人或动物受试者获得的血液，血清或血浆样品中的MFG-E8蛋白的水平，其中所述测量值用作阿尔茨海默氏病的诊断标记。 发现MFG-E8蛋白以Ca2 +依赖的方式与小鼠脑神经细胞的培养上清结合，磷脂酰丝氨酸是Abeta42刺激的痴呆模型。 还发现，阿尔茨海默病患者的MFG-E8蛋白水平升高。

    NONVOLATILE STORAGE ELEMENT AND METHOD OF MANUFACTURING THEREOF
    5.
    发明申请
    NONVOLATILE STORAGE ELEMENT AND METHOD OF MANUFACTURING THEREOF 有权
    非易失存储元件及其制造方法

    公开(公告)号：US20140024197A1

    公开(公告)日：2014-01-23

    申请号：US14110163

    申请日：2012-04-11

    申请人： Yoshio Kawashima ,  Takumi Mikawa ,  Shinichi Imai

    发明人： Yoshio Kawashima ,  Takumi Mikawa ,  Shinichi Imai

    IPC分类号： H01L45/00

    CPC分类号： H01L45/1675 ,  H01L27/2436 ,  H01L45/04 ,  H01L45/08 ,  H01L45/1233 ,  H01L45/146

    摘要： A method of manufacturing a variable resistance nonvolatile memory element includes: forming a lower electrode layer above a substrate; forming, on the lower electrode layer, a variable resistance layer including an oxygen-deficient transition metal oxide; forming an upper electrode layer on the variable resistance layer; and forming a patterned mask on the upper electrode layer and etching the upper electrode layer, the variable resistance layer, and the lower electrode layer using the patterned mask, wherein in the etching, at least the variable resistance layer is etched using an etching gas containing bromine.

    摘要翻译： 一种制造可变电阻非易失性存储元件的方法包括：在衬底上形成下电极层; 在下电极层上形成包含缺氧过渡金属氧化物的可变电阻层; 在所述可变电阻层上形成上电极层; 以及在所述上电极层上形成图案化掩模，并使用所述图案掩模蚀刻所述上电极层，所述可变电阻层和所述下电极层，其中在所述蚀刻中，至少所述可变电阻层使用含有 溴。

    Molded Hook and Loop Fastener
    6.
    发明申请
    Molded Hook and Loop Fastener 有权
    成型钩环紧固件

    公开(公告)号：US20130340214A1

    公开(公告)日：2013-12-26

    申请号：US14002773

    申请日：2011-03-07

    申请人： Mineto Terada ,  Shinichi Imai

    发明人： Mineto Terada ,  Shinichi Imai

    IPC分类号： A44B18/00

    CPC分类号： A44B18/0069 ,  A44B18/0049 ,  A44B18/0076 ,  Y10T24/27 ,  Y10T24/2725 ,  Y10T24/2792

    摘要： The molded hook and loop fastener comprises multiple hook and loop fastener parts on which multiple engaging elements are disposed, and a connection member for connecting the hook and loop fastener parts. The hook and loop fastener parts comprise fixing parts which fix the connection member to backings. The backings comprise forward and rearward extensions that extend in the longitudinal direction from the positions where the fixing parts are disposed. The dimension in the longitudinal direction of the connection member at a connection part is set to be longer than the minimum interval between adjacent hook and loop fastener parts, thereby allowing the molded hook and loop fastener to be bent easily in the width direction, and allowing the forward and rearward extensions to prevent foam resin material from directly hitting the lateral walls.

    摘要翻译： 模制的钩和环紧固件包括多个钩环紧固件部件，多个接合元件设置在该钩环部件上，以及用于连接钩环部件的连接部件。 钩和环紧固件部件包括将连接件固定到背衬上的固定部件。 背衬包括从设置有固定部件的位置沿纵向方向延伸的前后延伸部。 连接部件的连接部件的长度方向的尺寸被设定为比相邻的钩环部件之间的最小间隔长，从而允许成型的钩环紧固件在宽度方向上容易弯曲，并且允许 向前和向后延伸以防止泡沫树脂材料直接撞击侧壁。

    Molded male surface fastener
    7.
    发明授权
    Molded male surface fastener 有权
    模制的阳表面紧固件

    公开(公告)号：US08512845B2

    公开(公告)日：2013-08-20

    申请号：US13124879

    申请日：2008-11-06

    申请人： Mineto Terada ,  Shinichi Imai ,  Kenji Okuda

    发明人： Mineto Terada ,  Shinichi Imai ,  Kenji Okuda

    IPC分类号： A44B18/00

    CPC分类号： A44B18/0076 ,  A44B18/0049 ,  A44B18/0065 ,  B29C43/222 ,  B29C43/28 ,  B29L2031/729 ,  Y10T24/27 ,  Y10T428/24008 ,  Y10T428/24017 ,  Y10T428/24174 ,  Y10T428/24182

    摘要： A molded male surface fastener includes resin invasion preventing walls, which prevent an invasion of a molding foamable resin material of a cushion body, on right and left edge portions along a longitudinal direction of a surface of a flat base member made of a thermoplastic resin, a plurality of engaging elements provided between left and right resin invasion preventing walls, and a linear sealing body that is continuously disposed in the longitudinal direction of the base member along a peripheral portion of a top portion of each resin invasion preventing wall. When an engaging element forming surface of the surface fastener is placed on a concavo-convex surface of foaming body molding cavities of a foaming mold, if the mold has the same magnetic force as that in the related art, the linear sealing body is well adhered along the concavo-convex surface.

    摘要翻译： 模制的阳表面紧固件包括树脂侵入防止壁，其防止沿着由热塑性树脂制成的扁平基底的表面的纵向的左右边缘部分侵入缓冲体的模制发泡树脂材料， 设置在左右树脂防侵入壁之间的多个接合元件，以及沿着每个树脂侵入防止壁的顶部的周边部分沿基体的纵向方向连续设置的线性密封体。 当表面紧固件的接合元件形成表面放置在发泡模具的发泡体模制腔的凹凸表面上时，如果模具具有与现有技术相同的磁力，则线密封体良好地粘附 沿着凹凸表面。

    Method for manufacturing semiconductor device
    10.
    发明授权
    Method for manufacturing semiconductor device 有权
    制造半导体器件的方法

    公开(公告)号：US07324866B2

    公开(公告)日：2008-01-29

    申请号：US11305074

    申请日：2005-12-19

    申请人： Shinichi Imai

    发明人： Shinichi Imai

    IPC分类号： G06F19/00

    CPC分类号： G05B19/41835 ,  G05B2219/32057 ,  G05B2219/32058 ,  G05B2219/32096 ,  G05B2219/32135 ,  G05B2219/32198 ,  G05B2219/37224 ,  Y02P90/12 ,  Y02P90/18 ,  Y02P90/185 ,  Y02P90/20 ,  Y02P90/22

    摘要： A method for manufacturing a semiconductor device is provided in which it is possible to perform process control taking account of wafer information and to deal with the process control in which a recipe is change from one wafer to another. The method comprises steps of inserting a process control system into the path of a network where a manufacturing execution system (MES) and a manufacturing apparatus are connected with each other by using a LAN, obtaining a process result on the lot of the wafers at a previous step through the use of the process control system to rewrite the process recipe, and transmitting the rewritten process recipe from the process control system to the manufacturing apparatus. Since the method includes the step of obtaining the process result on the lot effected at the previous step as wafer information, it is possible to calculate a control parameter taking account of the state of the wafers. Also, since a process control (APC) system is inserted between the MES and the apparatus, there is no communication between the MES and the APC system, so that a communication burden is reduced, thereby the process control can be performed from one wafer to another.

    摘要翻译： 提供一种制造半导体器件的方法，其中可以考虑晶片信息进行处理控制，并且处理其中配方从一个晶片改变到另一个晶片的处理控制。 该方法包括以下步骤：通过使用LAN将制造执行系统（MES）和制造装置彼此连接的网络的路径插入到步骤S中，从而获得晶片批次的处理结果 上一步通过使用过程控制系统重写过程配方，并将重写过程配方从过程控制系统传送到制造设备。 由于该方法包括以上述步骤获得作为晶片信息的批次的处理结果的步骤，因此可以考虑晶片的状态来计算控制参数。 另外，由于在MES和装置之间插入了过程控制（APC）系统，所以在MES和APC系统之间不存在通信，从而减少了通信负担，从而可以从一个晶片到 另一个。