摘要:
A recovery phenomenon in which the concentration of a compound to be measured in soil increases again after reducing the concentration is utilized for changing the distribution state of the compound to be measured in soil, whereby the direction of the high-concentration region of the compound to be measured in soil can be detected.
摘要:
A recovery phenomenon in which the concentration of a compound to be measured in soil increases again after reducing the concentration is utilized for changing the distribution state of the compound to be measured in soil, whereby the direction of the high-concentration region of the compound to be measured in soil can be detected.
摘要:
To provide a more reliable semiconductor device including a lower-cost and more reliable capacitor and a method of manufacturing the same. This manufacturing method comprises the steps of: preparing a semiconductor substrate; and forming, over one of the major surfaces of the semiconductor substrate, a first metal electrode including an aluminum layer, a dielectric layer over the first metal electrode, and a second metal electrode over the dielectric layer. In the step of forming the first metal electrode, the aluminum layer is formed so that the surface thereof satisfies a relationship of Rmax
摘要:
Disclosed herein is a micro fluid transferring system that comprises a micropump having a chamber, a first fluid transferring portion connected to the chamber, and a second fluid transferring portion connected to the chamber. This system is characterized in that at least one of the first and second fluid transferring portions comprises a pressure absorbing section for absorbing or alleviating a liquid vibrational pressure therein.
摘要:
The present technology provides an air pre-treatment and monitoring device that includes an inlet port configured to receive an air flow and an outlet port configured to expel the air flow. The illustrative air pre-treatment device further includes a multiple-stage filter arranged between the inlet and outlet ports and that is configured to filter particles from the air flow.
摘要:
An oscillation control device for controlling a frequency of an oscillator located at the remote site from a standard laboratory having a standard oscillator. The control device includes: a comparison section to compare a frequency of the frequency signal synchronized with a radio signal produced by a signal processing section with a frequency of a oscillation signal outputted from an oscillator to be controlled, an acquisition section to obtain, through a communication network, a comparison result which is obtained by a comparison of a frequency of the standard oscillator held by the standard laboratory and a frequency of the radio signal, a calculation section to calculate deviation between the frequency of the oscillator to be controlled and the frequency of the standard oscillator based on their comparison, and a control section to control the frequency of the oscillator to be controlled, based on the deviation calculated.
摘要:
An oscillation control device for controlling a frequency of an oscillator located at the remote site from a standard laboratory having a standard oscillator. The control device includes: a comparison section to compare a frequency of the frequency signal synchronized with a radio signal produced by a signal processing section with a frequency of a oscillation signal outputted from an oscillator to be controlled, an acquisition section to obtain, through a communication network, a comparison result which is obtained by a comparison of a frequency of the standard oscillator held by the standard laboratory and a frequency of the radio signal, a calculation section to calculate deviation between the frequency of the oscillator to be controlled and the frequency of the standard oscillator based on their comparison, and a control section to control the frequency of the oscillator to be controlled, based on the deviation calculated.
摘要:
An interconnection structure includes a lower interconnection layer formed on a substrate and composed of a copper layer, an interlayer insulating layer formed on the lower interconnection layer and having a via reaching the lower interconnection layer, an upper interconnection layer electrically connected to the lower interconnection layer through the via, and composed of a copper layer formed in the interlayer insulating layer, and a barrier metal layer formed between the upper interconnection layer and the interlayer insulating layer. The barrier metal layer has an opening in a bottom portion of the via, and through that opening, the upper interconnection layer comes in direct contact with the lower interconnection layer in the bottom portion of the via. Thus, an interconnection structure suppressing concentration of voids in an interconnection under a via due to stress migration can be attained.
摘要:
A method of producing a semiconductor wafer, which can prevent the breakage of a wafer, and also can reduce the working time in a series of operations attended by back surface grinding of the semiconductor wafer. The method involves producing a semiconductor wafer wherein an adhesive tape is applied on the surface of the semiconductor wafer and, after grinding the back surface of the semiconductor wafer using a grinding machine, the adhesive tape is peeled off, said process comprises using an adhesive tape having heat shrinkability as the adhesive tape, grinding the back surface of the semiconductor wafer and heating the adhesive tape in the grinding machine, thereby peeling off the adhesive tape from the surface of the semiconductor wafer.
摘要:
A method of producing an ink jet print head includes the steps of forming separate ink paths with a predetermined pattern on a head base; fixing a vibration plate to a separate ink path side of the head base; temporarily fixing a piezoelectric element to a dummy substrate; patterning the piezoelectric element in accordance with the pattern of the separate ink paths of the head base to form separate piezoelectric elements: sticking a piezoelectric element side of the dummy substrate to the vibration plate so that the separate piezoelctric elements on the dummy substrate respectively correspond to the separate ink paths of the head base; and removing the dummy substrate.