公开(公告)号：US20110013342A1

公开(公告)日：2011-01-20

申请号：US12933924

申请日：2009-03-13

申请人： Yasushi Idemoto ,  Naoto Kitamura ,  Akira Ichiryu ,  Naohiko Abe

发明人： Yasushi Idemoto ,  Naoto Kitamura ,  Akira Ichiryu ,  Naohiko Abe

IPC分类号： H01G4/10 ,  C25D15/02

CPC分类号： C25D13/02 ,  C25D5/50 ,  C25D13/22 ,  H01G4/06 ,  H01G4/1227 ,  H01G13/00

摘要： An object of the present invention is to provide a method for producing a dielectric film excellent in the deposition stability in forming a high-density dielectric film by an electrophoresis method using a dielectric particle-dispersed slurry in which dielectric particles are dispersed. In order to achieve the object, a method for producing a dielectric film using an electrophoresis method comprising arranging a cathode electrode and an anode electrode in a dielectric particle-dispersed slurry in which the dielectric particles are dispersed and carrying out electrolysis to form a dielectric film on one of the electrodes, wherein the dielectric particles contained in the dielectric particle-dispersed slurry are the calcined dielectric particles.

摘要翻译： 本发明的目的是提供一种通过使用其中分散有电介质颗粒的电介质颗粒分散浆料的电泳方法，在形成高密度电介质膜时沉积稳定性优异的电介质膜的制造方法。 为了达到上述目的，本发明提供一种电泳法的制造方法，其特征在于，在分散有电介质粒子的电介质粒子分散浆料中配置阴极电极和阳极电极，进行电解而形成电介质膜 在其中一个电极上，其中包含在电介质颗粒分散浆料中的电介质颗粒是煅烧介电颗粒。

公开(公告)号：US20120141777A1

公开(公告)日：2012-06-07

申请号：US13375296

申请日：2010-04-20

申请人： Yasushi Idemoto ,  Ryuichi Sato ,  Naohiko Abe

发明人： Yasushi Idemoto ,  Ryuichi Sato ,  Naohiko Abe

IPC分类号： B32B18/00 ,  C25D13/02 ,  B05D3/02 ,  B32B15/04

CPC分类号： H05K1/162 ,  C23C18/1208 ,  C23C18/1254 ,  C25D13/02 ,  H05K1/0306 ,  H05K3/022 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2203/135 ,  Y10T428/252 ,  Y10T428/265 ,  Y10T428/31678

摘要： The object of the present invention is to provide a metal layer with an insulating layer which is uniform and thin and can be produced in low cost. To achieve the object, a laminate composed of a ceramic insulating layer and a metal layer characterized in that the ceramic insulating layer has a binder provided among ceramic particles constituting a ceramic particle film formed by electrophoretic deposition of the ceramic particles is employed. The laminate can be suitably used as a base material for production of various types of electronic devices, the circuit formation of printed wiring boards, semiconductor circuits and circuits including semiconductor circuits, and capacitors utilizing dielectric performance of the ceramic insulating layer.

摘要翻译： 本发明的目的是提供一种具有均匀且薄而可以以低成本制造的绝缘层的金属层。 为了实现该目的，采用由陶瓷绝缘层和金属层组成的层压体，其特征在于，陶瓷绝缘层具有在构成通过陶瓷颗粒的电泳沉积形成的陶瓷颗粒膜的陶瓷颗粒中提供的粘合剂。 该层压体可以适合用作生产各种类型的电子器件的基材，印刷电路板的电路形成，半导体电路和包括半导体电路的电路，以及利用陶瓷绝缘层的介电性能的电容器。

公开(公告)号：US07430106B2

公开(公告)日：2008-09-30

申请号：US11662402

申请日：2005-09-09

申请人： Akiko Sugioka ,  Naohiko Abe

发明人： Akiko Sugioka ,  Naohiko Abe

IPC分类号： H01G4/008 ,  H01G4/005 ,  H05K1/18

CPC分类号： H05K1/162 ,  H05K1/167 ,  H05K3/244 ,  H05K2201/09509

摘要： The object is to provide a material for forming a capacitor layer which is excellent in adhesion within a dielectric layer and a bottom electrode of a capacitor circuit. And to provide a material for forming a capacitor layer which has a new conductive layer for forming a bottom electrode capable of being used as an electrode serving also as a resistance circuit and the like. To solve the problem, the invention provides a conductive layer in which a pure nickel layer and a nickel-phosphorus alloy layer are deposited in order on a surface of a copper layer or a nickel-phosphorus alloy layer, a pure nickel layer and a nickel-phosphorus alloy layer are deposited in order on a surface of a copper layer, to assure excellent adhesion within the bottom electrode of a capacitor circuit and the dielectric layer in a printed wiring board having a dielectric layer between an top electrode and a bottom electrode.

摘要翻译： 本发明的目的是提供一种用于形成电容器层的材料，该电容器层在电介质层和电容器电路的底部电极中的粘合性优异。 并且提供一种用于形成电容器层的材料，其具有用于形成能够用作电阻电路等的电极的底部电极的新的导电层。 为了解决该问题，本发明提供一种导电层，其中纯镍层和镍 - 磷合金层依次沉积在铜层或镍 - 磷合金层，纯镍层和镍 磷合金层依次沉积在铜层的表面上，以确保在电容器电路的底部电极和具有在顶部电极和底部电极之间的电介质层的印刷线路板中的电介质层的优异粘合性。

公开(公告)号：US20110005817A1

公开(公告)日：2011-01-13

申请号：US12933261

申请日：2009-02-04

申请人： Ayumi Ito ,  Akihiro Kanno ,  Naohiko Abe ,  Akiko Sugioka

发明人： Ayumi Ito ,  Akihiro Kanno ,  Naohiko Abe ,  Akiko Sugioka

IPC分类号： H05K1/09 ,  H01G4/30 ,  H01R43/00

CPC分类号： H01G4/30 ,  H01G4/005 ,  H01G4/1227 ,  H01G4/33 ,  H05K1/162 ,  H05K3/388 ,  H05K2201/0175 ,  H05K2201/0355 ,  H05K2201/2063 ,  H05K2203/0315 ,  Y10T29/49117

摘要： An object of the present invention is to provide a capacitor-forming material having a stable adhesion between a dielectric layer and an electrode-forming layer. To achieve the object, the capacitor-forming material in which an oxides dielectric layer is provided between a top-electrode-forming layer and a bottom-electrode-forming layer, wherein at least one of the top-electrode-forming layer and the bottom-electrode-forming layer has a two-layer construction constituted with a bulk-metal layer and a composite layer composed of metal and metal oxide which is made to contact with the oxides dielectric layer. In particular, it is preferable to employ a capacitor-forming material having the top-electrode-forming layer which has two-layer construction constituted with the bulk-metal layer and the composite layer composed of metal and metal oxide, and has a layer construction in which the bulk-metal layer and the composite layer composed of metal and metal oxide are stacked to make the composite layer composed of metal and metal oxide contact with the oxides dielectric layer.

摘要翻译： 本发明的目的是提供一种在电介质层和电极形成层之间具有稳定粘附性的电容器形成材料。 为了实现该目的，在顶电极形成层和底电极形成层之间设置有氧化物电介质层的电容器形成材料，其中顶电极形成层和底电极形成层中的至少一个 电极形成层具有由本体金属层和与氧化物介电层接触的金属和金属氧化物构成的复合层构成的双层结构。 特别地，优选采用具有由主体金属层和由金属和金属氧化物构成的复合层构成的两层结构的顶部电极形成层的电容器形成材料，并且具有层结构 其中层叠金属和金属氧化物的体金属层和复合层，使得由金属和金属氧化物构成的复合层与氧化物介电层接触。

公开(公告)号：US20080257588A1

公开(公告)日：2008-10-23

申请号：US11814129

申请日：2006-01-17

申请人： Naohiko Abe ,  Akiko Sugioka ,  Akihiro Kanno

发明人： Naohiko Abe ,  Akiko Sugioka ,  Akihiro Kanno

IPC分类号： H05K1/00 ,  H01G9/00

CPC分类号： H01G4/33 ,  H05K1/09 ,  H05K1/162 ,  H05K2201/0175 ,  H05K2201/0266 ,  H05K2201/0355

摘要： A capacitor layer forming material that consists of a dielectric film making use of the sol-gel process excelling in production cost merit, being capable of producing a capacitor circuit of prolonged life having a nonconventional high electric capacity. There is provided capacitor layer forming material (1) having dielectric layer (4) interposed between first conductive layer (2) for formation of an upper electrode and second conductive layer (3) for formation of a lower electrode, characterized in that the dielectric layer (4) consists of an oxide dielectric film produced by the sol-gel process containing an oxide crystal structure of 50 to 300 nm grain diameter (major axis) being a coarse crystal structure having grown in the thickness direction and plane direction of the dielectric layer. Further, there is provided a process for efficiently producing this capacitor layer forming material.

摘要翻译： 一种电容器层形成材料，其由使用优异的制造成本优点的溶胶 - 凝胶法制成的电介质膜构成，能够制造具有非常规高电容的长寿命的电容器电路。 提供电容器层形成材料（1），其具有插入用于形成上电极的第一导电层（2）和用于形成下电极的第二导电层（3）之间的介电层（4），其特征在于，介电层 （4）由通过溶胶 - 凝胶法制造的氧化物介电膜构成，该氧化物电介质膜含有在厚度方向和电介质层的平面方向上生长的粗晶体结构的长径为50〜300nm 。 此外，提供了一种用于有效地制造该电容器层形成材料的方法。

公开(公告)号：US20130069042A1

公开(公告)日：2013-03-21

申请号：US13515416

申请日：2011-03-01

申请人： Yoshinori Matsuura ,  Nozomu Kitajima ,  Naohiko Abe

发明人： Yoshinori Matsuura ,  Nozomu Kitajima ,  Naohiko Abe

IPC分类号： H05B33/26 ,  H01B1/02 ,  H01L51/44

CPC分类号： H01L51/441 ,  H01B1/026 ,  H01L27/288 ,  H01L51/44 ,  H01L51/5218 ,  H01L51/5231 ,  H01L51/529 ,  H05B33/26 ,  Y02E10/549 ,  Y02P70/521 ,  Y10T428/12438 ,  Y10T428/12986

摘要： There are provided an electrode foil which has both the functions of a supporting base material and a reflective electrode and also has a superior thermal conductivity; and an organic device using the same. The electrode foil comprises a metal foil and a reflective layer provided directly on the metal foil.

摘要翻译： 提供了具有支撑基材和反射电极的功能的电极箔，并且还具有优异的导热性; 和使用其的有机装置。 电极箔包括金属箔和直接设置在金属箔上的反射层。

公开(公告)号：US20080283283A1

公开(公告)日：2008-11-20

申请号：US11912716

申请日：2006-04-28

申请人： Naohiko Abe ,  Akiko Sugioka ,  Akihiro Kanno ,  Hirotake Nakashima

发明人： Naohiko Abe ,  Akiko Sugioka ,  Akihiro Kanno ,  Hirotake Nakashima

IPC分类号： H05K1/18 ,  B05D5/12

CPC分类号： H05K1/162 ,  H01G4/1209 ,  H01G4/206 ,  H01G4/33 ,  H05K2201/0175 ,  H05K2203/1147 ,  Y10T428/265 ,  Y10T428/266

摘要： An object of the present invention is to provide a material for forming a capacitor layer comprising a dielectric layer formed by any one of a sol-gel method, an MOCVD method, and a sputtering deposition method. The material can reduce a leakage current of a capacitor circuit. In order to achieve the object, a material for forming a capacitor layer comprising a dielectric layer between a first conductive layer to be used for forming a top electrode and a second conductive layer to be used for forming a bottom electrode, characterized in that the dielectric layer is a dielectric oxide film formed by any one of a sol-gel method, an MOCVD method, and a sputtering deposition method; and particles constituting the dielectric oxide film are impregnated with a resin component is employed. In addition, a manufacturing method characterized in that the dielectric oxide film is formed on the surface of a material to be the bottom electrode by any one of a sol-gel method, an MOCVD method, and a sputtering deposition method; a resin varnish is impregnated into a surface of the dielectric oxide film; the resin is dried and cured to form the dielectric layer; and then a top electrode constituting layer is provided on the dielectric layer is employed.

摘要翻译： 本发明的目的是提供一种用于形成电容器层的材料，其包括通过溶胶 - 凝胶法，MOCVD法和溅射沉积法中的任何一种形成的电介质层。 该材料可以减少电容器电路的漏电流。 为了实现该目的，用于形成电容器层的材料包括用于形成顶部电极的第一导电层和用于形成底部电极的第二导电层之间的电介质层，其特征在于，所述电介质层 层是通过溶胶 - 凝胶法，MOCVD法和溅射沉积法中的任一种形成的电介质氧化物膜; 并且使用构成电介质氧化膜的颗粒用树脂组分浸渍。 另外，一种制造方法，其特征在于，通过溶胶 - 凝胶法，MOCVD法和溅射沉积法中的任何一种形成在作为底部电极的材料的表面上的电介质氧化膜; 将树脂清漆浸渍在电介质氧化膜的表面上; 将树脂干燥并固化以形成介电层; 然后在电介质层上设置顶电极构成层。

公开(公告)号：US20080310073A1

公开(公告)日：2008-12-18

申请号：US11912559

申请日：2006-04-28

申请人： Akihiro Kanno ,  Akiko Sugioka ,  Naohiko Abe ,  Hirotake Nakashima

发明人： Akihiro Kanno ,  Akiko Sugioka ,  Naohiko Abe ,  Hirotake Nakashima

IPC分类号： H01G4/018 ,  B29C71/02

CPC分类号： H05K1/162 ,  C04B35/4682 ,  C04B35/47 ,  C04B35/624 ,  C04B2235/3213 ,  C04B2235/3215 ,  C04B2235/658 ,  C04B2235/661 ,  C23C18/06 ,  C23C18/1216 ,  C23C18/1241 ,  C23C18/1254 ,  C23C18/1275 ,  C23C18/1279 ,  C23C18/1283 ,  H01G4/1209 ,  H01G4/33 ,  H01G13/00 ,  H05K3/4652 ,  H05K2201/0175 ,  H05K2201/0355 ,  H05K2201/09509

摘要： The present invention has an object to provide a method for forming an oxide dielectric layer, which dielectric layer is formed by applying the sol-gel method, and is hardly damaged by an etching solution and excellent in dielectric characteristics such as a large electric capacitance. To achieve the object, the forming method of an oxide dielectric layer by applying a sol-gel method characterized by being provided with the following processes (a) to (c) is employed. Process (a): A solution preparing process of preparing a sol-gel solution for manufacturing an aiming oxide dielectric layer. Process (b): A coating process wherein stages of the sol-gel solution coating on the surface of a metal substrate followed by drying in an oxygen-containing atmosphere followed by pyrolysis in an oxygen-containing atmosphere sequentially is made one unit step; the one unit step is repeated twice or more times; and a pre-baking stage at 550-deg.C to 1000-deg.C in an inert gas-substituted atmosphere or the like is provided optionally between the one unit step and the next one unit step to control the film thickness. Process (c): A baking process of finally subjecting the coated metal substrate to a baking process at 550-deg.C to 1000-deg.C in an inert gas-substituted atmosphere or the like to finish the dielectric layer.

摘要翻译： 本发明的目的是提供一种形成氧化物电介质层的方法，该电介质层通过施加溶胶 - 凝胶法形成，并且几乎不被蚀刻溶液损坏，并且具有优异的诸如大电容的介电特性。 为了达到上述目的，采用以下工序（a）〜（c）为特征的溶胶 - 凝胶法的氧化物介电层的形成方法。 方法（a）：制备用于制造瞄准氧化物介电层的溶胶 - 凝胶溶液的溶液制备方法。 方法（b）：其中在金属基材表面上涂覆溶胶 - 凝胶溶液的阶段，然后在含氧气氛中干燥，然后依次在含氧气氛中热解的步骤为一个单位步骤; 一个单位步骤重复两次或更多次; 并且在惰性气体取代气氛等中在550℃〜1000℃的预烘烤阶段可选地设置在一个单元步骤和下一个单元步骤之间，以控制膜厚度。 方法（c）：在惰性气体取代气氛等中，在550℃〜1000℃下对经涂布的金属基材进行烘烤处理的烧成工序，以完成电介质层。

公开(公告)号：US20080130196A1

公开(公告)日：2008-06-05

申请号：US11744250

申请日：2007-05-04

申请人： Akihiro Kanno ,  Naohiko Abe ,  Akiko Sugioka ,  Yasuaki Mashiko

发明人： Akihiro Kanno ,  Naohiko Abe ,  Akiko Sugioka ,  Yasuaki Mashiko

IPC分类号： H01G4/008 ,  B32B15/04

CPC分类号： H01G4/228 ,  H01G4/008 ,  H01G4/12 ,  H05K1/09 ,  H05K1/162 ,  H05K3/4641 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2201/09509 ,  Y10T428/26 ,  Y10T428/31678

摘要： It is an object of the present invention to provide a capacitor layer forming material which is applicable to printed wiring boards manufactured through a high-temperature processing of 300° C. to 400° C. of a fluorine-contained resin substrate, a liquid crystal polymer and the like, and exhibits no deterioration of the strength after a high-temperature heating. In order to achieve the object, a capacitor layer forming material for a printed wiring board which comprises a first conductive layer used for forming a top electrode, a second conductive layer used for forming a bottom electrode and a dielectric layer between the first and second conductive layers, characterized in that for the second conductive layer, a nickel layer or a nickel alloy layer is employed. The nickel layer or the nickel alloy layer as the second conductive layer preferably has a thickness of 10 micron meter to 100 micron meter. Further, the sol-gel method is suitably employed to form the dielectric layer on the nickel layer or the nickel alloy layer constituting the second conductive layer.

摘要翻译： 本发明的目的是提供一种电容器层形成材料，其适用于通过含氟树脂基板的300℃至400℃的高温加工制造的印刷线路板，液晶 聚合物等，并且在高温加热后表现出强度的劣化。 为了实现该目的，用于印刷电路板的电容器层形成材料包括用于形成顶部电极的第一导电层，用于形成底部电极的第二导电层和介于第一和第二导电层之间的介电层 层，其特征在于，对于第二导电层，采用镍层或镍合金层。 作为第二导电层的镍层或镍合金层优选具有10微米至100微米的厚度。 此外，溶胶 - 凝胶法适合用于在构成第二导电层的镍层或镍合金层上形成电介质层。

公开(公告)号：US20070263339A1

公开(公告)日：2007-11-15

申请号：US11662402

申请日：2005-09-09

申请人： Akiko Sugioka ,  Naohiko Abe

发明人： Akiko Sugioka ,  Naohiko Abe

IPC分类号： H01G4/008 ,  H05K1/18

CPC分类号： H05K1/162 ,  H05K1/167 ,  H05K3/244 ,  H05K2201/09509

摘要： The object is to provide a material for forming a capacitor layer which is excellent in adhesion within a dielectric layer and a bottom electrode of a capacitor circuit. And to provide a material for forming a capacitor layer which has a new conductive layer for forming a bottom electrode capable of being used as an electrode serving also as a resistance circuit and the like. To solve the problem, the invention provides a conductive layer in which a pure nickel layer and a nickel-phosphorus alloy layer are deposited in order on a surface of a copper layer or a nickel-phosphorus alloy layer, a pure nickel layer and a nickel-phosphorus alloy layer are deposited in order on a surface of a copper layer, to assure excellent adhesion within the bottom electrode of a capacitor circuit and the dielectric layer in a printed wiring board having a dielectric layer between an top electrode and a bottom electrode.

摘要翻译： 本发明的目的是提供一种用于形成电容器层的材料，该电容器层在电介质层和电容器电路的底部电极中的粘合性优异。 并且提供一种用于形成电容器层的材料，其具有用于形成能够用作电阻电路等的电极的底部电极的新的导电层。 为了解决该问题，本发明提供一种导电层，其中纯镍层和镍 - 磷合金层依次沉积在铜层或镍 - 磷合金层，纯镍层和镍 磷合金层依次沉积在铜层的表面上，以确保在电容器电路的底部电极和具有在顶部电极和底部电极之间的电介质层的印刷线路板中的电介质层的优异粘合性。