公开(公告)号：US06798048B2

公开(公告)日：2004-09-28

申请号：US10129923

申请日：2002-05-13

申请人： Akira Ichiryu ,  Tatsuo Kataoka ,  Hirokazu Kawamura ,  Katsuhiko Hayashi ,  Masahito Ishii

发明人： Akira Ichiryu ,  Tatsuo Kataoka ,  Hirokazu Kawamura ,  Katsuhiko Hayashi ,  Masahito Ishii

IPC分类号： H01L2352

CPC分类号： H01L21/4839 ,  H01L23/4985 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K3/0008 ,  H05K3/0082 ,  H05K3/0097 ,  H05K3/4046 ,  H05K2201/09063 ,  H05K2203/1545 ,  H05K2203/1572 ,  H05K2203/167 ,  Y10T428/24917 ,  Y10T428/24997 ,  H01L2924/00

摘要： A 2-metal layer TAB and a both-sided CSP.BGA tape having an insulating substrate and a wiring layer provided on at least both sides of the substrate, the substrate having evenly spaced sprocket holes on both width direction edges in the longitudinal direction thereof and also having through-holes formed with a punching press, and the through-holes being filled with a conductor by means of a punching press such that the conductor and the wiring layers are electrically connected, which is characterized by having round pilot holes between the sprocket holes formed in the longitudinal direction thereof; and a process of producing the same.

摘要翻译： 一种双金属层TAB和双面CSP.BGA带，其具有设置在基板的至少两侧的绝缘基板和布线层，该基板在其长度方向的两个宽度方向边缘上具有均匀间隔的链轮孔 并且还具有形成有冲压机的通孔，并且所述通孔用冲压机填充导体，使得所述导体和所述布线层电连接，其特征在于，在所述导孔之间具有圆形导向孔 沿其长度方向形成的链轮孔; 及其制造方法。

公开(公告)号：US07178233B2

公开(公告)日：2007-02-20

申请号：US10728177

申请日：2003-12-04

申请人： Toshiyuki Nakamura ,  Hideto Tanaka ,  Akira Ichiryu ,  Motonobu Takahashi ,  Masahito Ishii ,  Daisuke Arai

发明人： Toshiyuki Nakamura ,  Hideto Tanaka ,  Akira Ichiryu ,  Motonobu Takahashi ,  Masahito Ishii ,  Daisuke Arai

IPC分类号： H01K3/10

CPC分类号： H05K3/4614 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H05K3/4038 ,  H05K3/4046 ,  H05K3/4617 ,  H05K3/462 ,  H05K2201/0385 ,  H05K2201/10378 ,  H05K2203/1189 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/4916 ,  Y10T29/49165

摘要： A process for producing a printed wiring board-forming sheet comprising a resin sheet having a through hole in the thickness direction and a metal chip inserted in the through hole. The sheet is produced by placing a resin sheet and conductive metal sheet in this order on a die base having a die hole, performing punching from the conductive metal sheet side to form a punched hole in the conductive metal sheet and to form a punched hole in the resin sheet and inserting the punched conductive metal chip in the through hole of the resin sheet whereby the front and back surfaces of the sheet can be electrically connected to each other. If the conductive metal chip is so inserted that its tip protrudes from the surface of the sheet, and if a large number of such substrates are laminated, electrical connection in the thickness direction can readily be made by virtue of the protruded conductive metal chips and a multi-layer board can be readily produced.

摘要翻译： 一种印刷线路板形成用片材的制造方法，其特征在于，具有在厚度方向上具有通孔的树脂片和插入所述通孔的金属片。 该片材通过将树脂片和导电金属片依次放置在具有模孔的模座上，从导电金属片侧进行冲压以在导电金属片中形成冲孔并在 树脂片，并将穿孔的导电金属芯片插入树脂片的通孔中，由此片材的前表面和后表面可以彼此电连接。 如果导电金属芯片如此插入，使得其尖端从片材的表面突出，并且如果大量这样的衬底被层压，则厚度方向上的电连接可以容易地由于突出的导电金属片和 多层板可以很容易地生产。

公开(公告)号：US20110013342A1

公开(公告)日：2011-01-20

申请号：US12933924

申请日：2009-03-13

申请人： Yasushi Idemoto ,  Naoto Kitamura ,  Akira Ichiryu ,  Naohiko Abe

发明人： Yasushi Idemoto ,  Naoto Kitamura ,  Akira Ichiryu ,  Naohiko Abe

IPC分类号： H01G4/10 ,  C25D15/02

CPC分类号： C25D13/02 ,  C25D5/50 ,  C25D13/22 ,  H01G4/06 ,  H01G4/1227 ,  H01G13/00

摘要： An object of the present invention is to provide a method for producing a dielectric film excellent in the deposition stability in forming a high-density dielectric film by an electrophoresis method using a dielectric particle-dispersed slurry in which dielectric particles are dispersed. In order to achieve the object, a method for producing a dielectric film using an electrophoresis method comprising arranging a cathode electrode and an anode electrode in a dielectric particle-dispersed slurry in which the dielectric particles are dispersed and carrying out electrolysis to form a dielectric film on one of the electrodes, wherein the dielectric particles contained in the dielectric particle-dispersed slurry are the calcined dielectric particles.

摘要翻译： 本发明的目的是提供一种通过使用其中分散有电介质颗粒的电介质颗粒分散浆料的电泳方法，在形成高密度电介质膜时沉积稳定性优异的电介质膜的制造方法。 为了达到上述目的，本发明提供一种电泳法的制造方法，其特征在于，在分散有电介质粒子的电介质粒子分散浆料中配置阴极电极和阳极电极，进行电解而形成电介质膜 在其中一个电极上，其中包含在电介质颗粒分散浆料中的电介质颗粒是煅烧介电颗粒。

公开(公告)号：US06905757B2

公开(公告)日：2005-06-14

申请号：US10478419

申请日：2003-04-01

申请人： Toshifumi Matsushima ,  Hideaki Miwa ,  Akira Ichiryu ,  Kazuhiro Yamazaki ,  Tetsuro Sato ,  Fujio Kuwako

发明人： Toshifumi Matsushima ,  Hideaki Miwa ,  Akira Ichiryu ,  Kazuhiro Yamazaki ,  Tetsuro Sato ,  Fujio Kuwako

IPC分类号： B32B15/08 ,  B32B27/18 ,  B32B27/34 ,  B32B27/38 ,  C08K7/00 ,  C08K7/16 ,  C08L63/00 ,  C08L77/00 ,  C08L77/10 ,  H01L23/12 ,  H05K1/16 ,  H05K3/38 ,  B32B3/00

CPC分类号： H05K1/162 ,  C08K7/00 ,  C08L63/00 ,  C08L77/00 ,  C08L77/10 ,  H05K3/384 ,  H05K2201/0209 ,  H05K2201/0355 ,  H05K2201/09309 ,  H05K2203/1476 ,  Y10T428/24917 ,  Y10T428/25 ,  C08L2666/20

摘要： An object is to provide a dielectric layer of a double-sided copper clad laminate, for use in formation of a built-in capacitor layer, which can be formed in an optional thickness without using a skeletal material and is provided with a high strength. For the purpose of achieving the object, “a dielectric filler containing resin for use in formation of the built-in capacitor layer of a printed wiring board obtained by mixing a binder resin comprising 20 to 80 parts by weight of epoxy resin (inclusive of a curing agent), 20 to 80 parts by weight of a solvent soluble aromatic polyamide resin polymer, and a curing accelerator added in an appropriate amount according to need; and a dielectric filler which is a nearly spherical dielectric powder having perovskite structure which is 0.1 to 1.0 μm in the average particle size DIA, 0.2 to 2.0 μm in the weight cumulative particle size D50 based on the laser diffraction scattering particle size distribution measurement method, and 4.5 or less in the coagulation degree represented by D50/DIA where the weight cumulative particle size D50 and the average particle size DIA obtained by the image analysis”; and the like are used.

摘要翻译： 本发明的目的是提供一种用于形成内置电容器层的双面覆铜层压板的介电层，其可以在不使用骨架材料的情况下以可选择的厚度形成并且具有高强度。 为了实现该目的，“用于形成印刷线路板的内置电容器层的电介质填充剂含有树脂，其通过将包含20至80重量份的环氧树脂（包括 固化剂），20〜80重量份溶剂可溶性芳族聚酰胺树脂聚合物和根据需要加入适量的固化促进剂;以及介电填料，其为具有钙钛矿结构的近似球形的电介质粉末，其为0.1〜 基于激光衍射散射粒度分布测量方法，平均颗粒尺寸D IA IA为1.0μm，重量累积粒径D <50 <0.2的2.0-2.0μm，4.5 以下的重量累积粒度D 50和平均粒径D IA 通过图像分析获得“; 等等。