公开(公告)号：US06720077B2

公开(公告)日：2004-04-13

申请号：US10073309

申请日：2002-02-13

申请人： Yasuyuki Hirai ,  Hironori Suzuki ,  Yoshiyuki Takeda ,  Kenichi Oohori ,  Shinichi Kamoshida ,  Minoru Kakitani ,  Norihiro Abe

发明人： Yasuyuki Hirai ,  Hironori Suzuki ,  Yoshiyuki Takeda ,  Kenichi Oohori ,  Shinichi Kamoshida ,  Minoru Kakitani ,  Norihiro Abe

IPC分类号： B32B2738

CPC分类号： B32B15/08 ,  B32B27/04 ,  B32B27/38 ,  B32B2307/206 ,  B32B2457/08 ,  C08K5/3155 ,  C08K5/5313 ,  C09K21/12 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  Y10S428/901 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529 ,  C08L63/00

摘要： The present invention relates to a resin composition containing an epoxy resin, an amine-type curing agent, an organophosphorus compound having a structure represented by formula 1 and an organic solvent, wherein the epoxy resin and the organophosphorus compound has been compounded at a temperature of 50° C. or lower. The resin composition has enough flame retardancy without containing any halogen-containing flame retarder, has good heat resistance and good chemical resistance, and causes no problems with respect to reaction stability or curability caused by consumption of an epoxy resin through a reaction occurring during compounding of the resin composition.

摘要翻译： 本发明涉及含有环氧树脂，胺型固化剂，具有式1所示结构的有机磷化合物和有机溶剂的树脂组合物，其中环氧树脂和有机磷化合物在 50℃以下。 该树脂组合物具有足够的阻燃性，不含任何含卤素阻燃剂，具有良好的耐热性和良好的耐化学性，并且对于通过在配混期间发生的反应而消耗环氧树脂引起的反应稳定性或固化性没有引起任何问题 树脂组合物。

公开(公告)号：US20060008632A1

公开(公告)日：2006-01-12

申请号：US11219821

申请日：2005-09-07

申请人： Kenichi Oohori ,  Yoshihiro Nakamura ,  Hikari Murai ,  Yoshiyuki Takeda ,  Yasuyuki Hirai ,  Shinichi Kamoshida ,  Minoru Kakitani ,  Norihiro Abe ,  Syunichi Numata ,  Teruki Aizawa ,  Ken Nanaumi

发明人： Kenichi Oohori ,  Yoshihiro Nakamura ,  Hikari Murai ,  Yoshiyuki Takeda ,  Yasuyuki Hirai ,  Shinichi Kamoshida ,  Minoru Kakitani ,  Norihiro Abe ,  Syunichi Numata ,  Teruki Aizawa ,  Ken Nanaumi

IPC分类号： B32B27/38 ,  B32B15/08 ,  C08L63/00 ,  B32B27/04

CPC分类号： C08L61/34 ,  B32B27/00 ,  B32B27/04 ,  C08G59/226 ,  C08L63/00 ,  C08L2205/02 ,  C08L2205/03 ,  H05K1/0326 ,  Y10T428/24636 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529 ,  C08L2666/02 ,  C08L2666/16 ,  C08L2666/14 ,  C08L2666/22

摘要： The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a hydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight-average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.

摘要翻译： 本发明公开了一种热固性树脂组合物，其包含（A）35〜75重量份的含有以苯并恶嗪环作为主成分的化合物的热固性树脂，（B）10〜25重量份的缩聚产物 苯酚，具有三嗪环的化合物和醛，和（C）10至45重量份的环氧树脂，基于组分（A），（B）的有机固体组分的总量100重量份， 和（C），和（i）重均分子量为1,000〜3000的双酚F环氧树脂，或（ii）双酚F环氧树脂和双酚A环氧树脂的混合环氧树脂，其重均分子量 （C）中含有0〜100重量％的组分（C）; 以及预浸料，布线板用层叠板和使用该预浸料的布线基板。

公开(公告)号：US07538150B2

公开(公告)日：2009-05-26

申请号：US11219821

申请日：2005-09-07

申请人： Kenichi Oohori ,  Yoshihiro Nakamura ,  Hikari Murai ,  Yoshiyuki Takeda ,  Yasuyuki Hirai ,  Shinichi Kamoshida ,  Minoru Kakitani ,  Norihiro Abe ,  Syunichi Numata ,  Teruki Aizawa ,  Ken Nanaumi

发明人： Kenichi Oohori ,  Yoshihiro Nakamura ,  Hikari Murai ,  Yoshiyuki Takeda ,  Yasuyuki Hirai ,  Shinichi Kamoshida ,  Minoru Kakitani ,  Norihiro Abe ,  Syunichi Numata ,  Teruki Aizawa ,  Ken Nanaumi

IPC分类号： B32B15/08 ,  B32B27/04 ,  B32B27/28 ,  C08K5/521 ,  C08L61/08 ,  C08L63/02 ,  H05K1/05

CPC分类号： C08L61/34 ,  B32B27/00 ,  B32B27/04 ,  C08G59/226 ,  C08L63/00 ,  C08L2205/02 ,  C08L2205/03 ,  H05K1/0326 ,  Y10T428/24636 ,  Y10T428/24917 ,  Y10T428/24994 ,  Y10T428/31511 ,  Y10T428/31515 ,  Y10T428/31522 ,  Y10T428/31529 ,  C08L2666/02 ,  C08L2666/16 ,  C08L2666/14 ,  C08L2666/22

摘要： The present invention discloses a thermosetting resin composition which comprises (A) 35 to 75 parts by weight of a thermosetting resin comprising a compound having a hydrobenzoxazine ring as a main component, (B) 10 to 25 parts by weight of a polycondensation product of a phenol, a compound having a triazine ring and an aldehyde, and (C) 10 to 45 parts by weight of an epoxy resin, based on 100 parts by weight of the total amount of organic solid components of Components (A), (B) and (C), and (i) a bisphenol F epoxy resin having a weight-average molecular weight of 1,000 to 3,000, or (ii) a mixed epoxy resin of bisphenol F epoxy resin and bisphenol A epoxy resin having a weight average molecular weight of 1,000 to 3,000, is contained in Component (C) in an amount of 0 to 100% by weight of Component (C); and a prepreg, a laminated board for a wiring board and a wiring board using the same.

摘要翻译： 本发明公开了一种热固性树脂组合物，其包含（A）35〜75重量份的含有以苯并恶嗪环作为主成分的化合物的热固性树脂，（B）10〜25重量份的缩聚产物 苯酚，具有三嗪环的化合物和醛，和（C）10至45重量份的环氧树脂，基于组分（A），（B）的有机固体组分的总量100重量份， 和（C），和（i）重均分子量为1,000〜3000的双酚F环氧树脂，或（ii）双酚F环氧树脂和双酚A环氧树脂的混合环氧树脂，其重均分子量 （C）中含有0〜100重量％的组分（C）; 以及预浸料，布线板用层叠板和使用该预浸料的布线基板。