Doping of semiconductor fin devices
    1.
    发明授权
    Doping of semiconductor fin devices 有权
    掺杂半导体鳍片器件

    公开(公告)号:US08790970B2

    公开(公告)日:2014-07-29

    申请号:US11446697

    申请日:2006-06-05

    IPC分类号: H01L21/84

    摘要: A semiconductor structure includes of a plurality of semiconductor fins overlying an insulator layer, a gate dielectric overlying a portion of said semiconductor fin, and a gate electrode overlying the gate dielectric. Each of the semiconductor fins has a top surface, a first sidewall surface, and a second sidewall surface. Dopant ions are implanted at a first angle (e.g., greater than about 7°) with respect to the normal of the top surface of the semiconductor fin to dope the first sidewall surface and the top surface. Further dopant ions are implanted with respect to the normal of the top surface of the semiconductor fin to dope the second sidewall surface and the top surface.

    摘要翻译: 半导体结构包括覆盖绝缘体层的多个半导体鳍片,覆盖所述半导体鳍片的一部分的栅极电介质和覆盖栅极电介质的栅电极。 每个半导体翅片具有顶表面,第一侧壁表面和第二侧壁表面。 掺杂离子相对于半导体鳍片的顶表面的法线以第一角度(例如,大于约7°)注入,以掺杂第一侧壁表面和顶表面。 相对于半导体鳍片的顶表面的法线注入另外的掺杂剂离子以掺杂第二侧壁表面和顶表面。

    Strained silicon-on-insulator transistors with mesa isolation
    2.
    发明授权
    Strained silicon-on-insulator transistors with mesa isolation 有权
    应变硅绝缘体上的晶体管与台面隔离

    公开(公告)号:US07892901B2

    公开(公告)日:2011-02-22

    申请号:US11604161

    申请日:2006-11-25

    IPC分类号: H01L21/00 H01L21/84

    摘要: A silicon-on-insulator semiconductor device which includes a substrate; an insulator layer overlying the substrate; a plurality of strained silicon islands overlying the insulator layer, the strained silicon islands are isolated from each other by mesa isolation; and a plurality of transistors formed on the strained silicon islands. A method for fabricating the silicon-on-insulator semiconductor device is further disclosed.

    摘要翻译: 一种绝缘体上硅半导体器件,包括:衬底; 覆盖衬底的绝缘体层; 多个跨越绝缘体层的应变硅岛,应变硅岛通过台面隔离相互隔离; 以及形成在应变硅岛上的多个晶体管。 进一步公开了一种制造绝缘体上硅半导体器件的方法。

    Capacitor that includes high permittivity capacitor dielectric
    3.
    发明授权
    Capacitor that includes high permittivity capacitor dielectric 有权
    包括高介电常数电容器电容器的电容器

    公开(公告)号:US07745279B2

    公开(公告)日:2010-06-29

    申请号:US11331703

    申请日:2006-01-13

    IPC分类号: H01L21/8242

    摘要: A decoupling capacitor is formed on a semiconductor substrate that includes a silicon surface layer. A substantially flat bottom electrode is formed in a portion of the semiconductor surface layer. A capacitor dielectric overlies the bottom electrode. The capacitor dielectric is formed from a high permittivity dielectric with a relative permittivity, preferably greater than about 5. The capacitor also includes a substantially flat top electrode that overlies the capacitor dielectric. In the preferred application, the top electrode is connected to a first reference voltage line and the bottom electrode is connected to a second reference voltage line.

    摘要翻译: 在包括硅表面层的半导体衬底上形成去耦电容器。 在半导体表面层的一部分中形成基本平坦的底部电极。 电容器电介质覆盖在底部电极上。 电容器电介质由具有相对介电常数(优选大于约5)的高介电常数电介质形成。电容器还包括覆盖在电容器电介质上的基本平坦的顶部电极。 在优选的应用中,顶部电极连接到第一参考电压线,底部电极连接到第二参考电压线。

    SOI chip with recess-resistant buried insulator and method of manufacturing the same
    4.
    发明授权
    SOI chip with recess-resistant buried insulator and method of manufacturing the same 有权
    具有耐凹陷绝缘体的SOI芯片及其制造方法

    公开(公告)号:US07372107B2

    公开(公告)日:2008-05-13

    申请号:US11207681

    申请日:2005-08-19

    IPC分类号: H01L23/62

    摘要: A semiconductor-on-insulator structure includes a substrate and a buried insulator stack overlying the substrate. The buried insulator stack includes a first dielectric layer and a recess-resistant layer overlying the first dielectric layer. A second dielectric layer can overlie the recess-resistant layer. A semiconductor layer overlying the buried insulator stack. Active devices, such as transistors and diodes, can be formed in the semiconductor layer.

    摘要翻译: 绝缘体上半导体结构包括衬底和覆盖衬底的掩埋绝缘体堆叠。 掩埋绝缘体堆叠包括覆盖第一介电层的第一介电层和凹陷层。 第二电介质层可以覆盖在耐凹陷层上。 覆盖埋层绝缘体叠层的半导体层。 可以在半导体层中形成有源器件,例如晶体管和二极管。

    Gate electrode for a semiconductor fin device
    7.
    发明申请
    Gate electrode for a semiconductor fin device 有权
    用于半导体鳍片器件的栅电极

    公开(公告)号:US20070111454A1

    公开(公告)日:2007-05-17

    申请号:US11649453

    申请日:2007-01-03

    IPC分类号: H01L21/336

    CPC分类号: H01L29/785 H01L29/66795

    摘要: A method for forming a gate electrode for a multiple gate transistor provides a doped, planarized gate electrode material which may be patterned using conventional methods to produce a gate electrode that straddles the active area of the multiple gate transistor and has a constant transistor gate length. The method includes forming a layer of gate electrode material having a non-planar top surface, over a semiconductor fin. The method further includes planarizing and doping the gate electrode material, without doping the source/drain active areas, then patterning the gate electrode material. Planarization of the gate electrode material may take place prior to the introduction and activation of dopant impurities or it may follow the introduction arid activation of dopant impurities. After the gate electrode is patterned, dopant impurities are selectively introduced to the semiconductor fin to form source/drain regions.

    摘要翻译: 用于形成多栅极晶体管的栅电极的方法提供掺杂的平面化栅电极材料,其可以使用常规方法进行图案化以产生跨越多栅极晶体管的有源区并具有恒定晶体管栅极长度的栅电极。 该方法包括在半导体鳍上形成具有非平面顶表面的栅电极材料层。 该方法还包括对栅电极材料进行平面化和掺杂,而不掺杂源极/漏极有源区,然后对栅电极材料进行构图。 栅电极材料的平面化可以在引入和激活掺杂剂杂质之前进行,或者可以引入和掺杂杂质的激活。 在栅电极被图案化之后,掺杂剂杂质被选择性地引入半导体鳍片以形成源极/漏极区域。

    CMOS inverters configured using multiple-gate transistors
    8.
    发明授权
    CMOS inverters configured using multiple-gate transistors 有权
    使用多栅极晶体管配置的CMOS反相器

    公开(公告)号:US07214991B2

    公开(公告)日:2007-05-08

    申请号:US10313887

    申请日:2002-12-06

    IPC分类号: H01L29/76

    摘要: An inverter that includes a first multiple-gate transistor including a source connected to a power supply, a drain connected to an output terminal, and a gate electrode; a second multiple-gate transistor including a source connected to a ground, a drain connected to the output terminal, and a gate electrode; and an input terminal connected to the gate electrodes of the first and second multiple-gate transistors. Each of the first and second multiple-gate transistors may further include a semiconductor fin formed vertically on an insulating layer on top of a substrate, a gate dielectric layer overlying the semiconductor fin, and a gate electrode wrapping around the semiconductor fin separating the source and drain regions.

    摘要翻译: 一种逆变器,包括:第一多栅极晶体管,其包括连接到电源的源极,连接到输出端子的漏极和栅极电极; 第二多栅极晶体管,其包括连接到地的源极,连接到输出端子的漏极和栅极电极; 以及连接到第一和第二多栅极晶体管的栅电极的输入端子。 第一和第二多栅极晶体管中的每一个还可以包括在衬底顶部的绝缘层上垂直形成的半导体鳍片,覆盖在半导体鳍片上的栅极电介质层,以及围绕分离源极的半导体鳍状物包围的栅电极,以及 漏区。

    Doping of semiconductor fin devices

    公开(公告)号:US20060220133A1

    公开(公告)日:2006-10-05

    申请号:US11446890

    申请日:2006-06-05

    IPC分类号: H01L27/12

    摘要: A semiconductor structure includes of a plurality of semiconductor fins overlying an insulator layer, a gate dielectric overlying a portion of said semiconductor fin, and a gate electrode overlying the gate dielectric. Each of the semiconductor fins has a top surface, a first sidewall surface, and a second sidewall surface. Dopant ions are implanted at a first angle (e.g., greater than about 7°) with respect to the normal of the top surface of the semiconductor fin to dope the first sidewall surface and the top surface. Further dopant ions are implanted with respect to the normal of the top surface of the semiconductor fin to dope the second sidewall surface and the top surface.