摘要:
A lamp positioning structure is disclosed. The lamp positioning structure is assembled on a display device and includes a fastening element mounted on a side plate of a rear plate. The lamp is curve-line-shaped and is mounted over the rear plate. Moreover, the lamp includes at least a curved section. Also, a display panel having a display area is assembled over the rear plate to cover the lamp. The curved section of the lamp is arranged in the display area without damaging the brightness uniformity nearby. In addition, two elastic arms are disposed on both lateral sides of the fastening element to abut against the curved section. Through the arrangement of the positioning structure, the breakage and the displacement of the lamp can be reduced or even prevented. The brightness of the curved section corresponding to the fastening element becomes more uniform and without definite dark spots.
摘要:
A lamp positioning structure is disclosed. The lamp positioning structure is assembled on a display device and includes a fastening element mounted on a side plate of a rear plate. The lamp is curve-line-shaped and is mounted over the rear plate. Moreover, the lamp includes at least a curved section. Also, a display panel having a display area is assembled over the rear plate to cover the lamp. The curved section of the lamp is arranged in the display area without damaging the brightness uniformity nearby. In addition, two elastic arms are disposed on both lateral sides of the fastening element to abut against the curved section. Through the arrangement of the positioning structure, the breakage and the displacement of the lamp can be reduced or even prevented. The brightness of the curved section corresponding to the fastening element becomes more uniform and without definite dark spots.
摘要:
A cover structure is disposed at the electronic device. The electronic device includes a frame with an opening and a power supply. The cover structure includes a cover and a pivotal portion. The cover includes an inner surface, an outer surface, and a touch portion. The pivotal portion includes a pivotal part and a trigger. The pivotal part is located on the inner surface. The trigger is located at the opening of the frame and connected with the pivotal part. The touch portion corresponds to the opening. When the touch portion is pressed, the pivotal part drives the trigger to trigger the power supply to drive the electronic device.
摘要:
A hydrocyclonic apparatus has been designed to separate a less dense dispersed phase (either liquid or solid) from a more dense liquid phase. The cyclone separator consists of two generally cylindrical portions positioned around the longitudinal axis in a `piggyback` manner. A vortex finder with an orifice plate captures the dispersed particles entrained in a local secondary flow established by the unique operating and design parameters of the device. Clear fluid is removed from the apparatus through an underflow tube opposite the vortex finder tube. The liquid feed containing dispersed particles is introduced into the primary cyclone around the vortex finder as a swirling annular jet. Another stream, containing no dispersed phase, is introduced as a tangential flow surrounding the annular jet. A polymer stream is injected into the core of the vortex flow of the primary cyclone to increase the stability of the vortex core and to moderate the turbulence.
摘要:
A printer may include a printhead assembly a clutch assembly, and/or a printer ribbon transport assembly. The printhead assembly may include a printhead biasing assembly defining a biasing ramp which may be configured to apply a biasing force to a printhead support bracket so as to at least partially counteract a ribbon force. The clutch assembly may be configured to supply or take-up a printer ribbon with first and second spool engagement members of different diameters that frictionally engage first and second friction members. The printer ribbon transport assembly may include a rotation lock mechanism configured to prevent rotation of a ribbon take-up core when the take-up core is disengaged from a drive assembly so as to prevent a loss in ribbon tension.
摘要:
Methods of manufacturing semiconductor devices are disclosed. In one embodiment, a method of manufacturing a semiconductor device includes providing a workpiece, and forming a protective material over a bottom surface and edges of the workpiece. A top surface of the workpiece is processed. The protective material protects the edges and the bottom surface of the workpiece during the processing of the top surface of the workpiece.
摘要:
A wheel assembly having a motor attached to a hub within the wheel assembly such that the motor powers the wheel assembly to rotate about an axle once the motor receives a predetermined amount of power. A battery system is configured to deliver power to said motor, the battery system is arranged to rotate with the wheel assembly. A sensor system within the wheel assembly provides data related to velocity and angle of orientation of the assembly. A control system within the wheel assembly receives data related to velocity and angle of orientation of the wheel assembly from the sensor system, with the control system having at least one output to from the battery system indicative of an amount of power that is delivered to the motor.
摘要:
A method is disclosed for etching an integrated circuit structure within a trench. A layer to be etched is applied over the structure and within the trench. A CF-based polymer is deposited over the layer to be etched followed by deposition of a capping layer of SiOCl-based polymer. The CF-based polymer reduces the width of the trench to such an extent that little or no SiOCl-based polymer is deposited at the bottom of the trench. An O2 plasma etch is performed to etch through the CF-based polymer at the bottom of the trench. The O2 plasma etch has little effect on the SiOCl-based polymer, the thus the upper surfaces of the structure remain covered with polymer. Thus, these upper surfaces remain fully protected during subsequent etching of the layer to be etched.
摘要:
A method includes forming a hard mask over a substrate, patterning the hard mask to form a first plurality of trenches, and filling a dielectric material into the first plurality of trenches to form a plurality of dielectric regions. The hard mask is removed from between the plurality of dielectric regions, wherein a second plurality of trenches is left by the removed hard mask. An epitaxy step is performed to grow a semiconductor material in the second plurality of trenches.
摘要:
A printer with replaceable modules has a printer and an electronic expansion device. The printer has an operating panel mounted on a top thereof, a connecting mechanism formed on a bottom thereof, and at least one connector mounted on the bottom thereof. The electronic expansion device has a mating connecting mechanism removably assembled on the bottom of the printer, and a mating connector connecting with the connector on the bottom of the printer. The printer has an identification interface electrically connecting with the connector for identifying the electronic expansion device. The electronic expansion device can be a scanner, an entertainment device, a data-access device, or a battery.