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公开(公告)号：US07763985B2
公开(公告)日：2010-07-27
申请号：US12257689
申请日：2008-10-24
IPC分类号： H01L23/48
CPC分类号： H01L25/50 , H01L21/563 , H01L24/29 , H01L24/83 , H01L24/94 , H01L25/0657 , H01L2224/05571 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/1134 , H01L2224/131 , H01L2224/13144 , H01L2224/16145 , H01L2224/16225 , H01L2224/274 , H01L2224/2929 , H01L2224/293 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81192 , H01L2224/83102 , H01L2224/83191 , H01L2224/83192 , H01L2224/83851 , H01L2224/92125 , H01L2225/06513 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/014 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： A flip-chip type semiconductor device includes a semiconductor substrate. A plurality of electrode terminals are provided and arranged on a top surface of the semiconductor substrate, a sealing resin layer is formed on the top surface of the semiconductor substrate such that the electrode terminals are completely covered with the sealing resin layer.
摘要翻译： 倒装芯片型半导体器件包括半导体衬底。 多个电极端子设置并布置在半导体衬底的顶表面上，在半导体衬底的顶表面上形成密封树脂层，使得电极端子被密封树脂层完全覆盖。
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公开(公告)号：US20090051029A1
公开(公告)日：2009-02-26
申请号：US12257689
申请日：2008-10-24
IPC分类号： H01L23/488 , H01L21/56 , H01L21/58
CPC分类号： H01L25/50 , H01L21/563 , H01L24/29 , H01L24/83 , H01L24/94 , H01L25/0657 , H01L2224/05571 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/1134 , H01L2224/131 , H01L2224/13144 , H01L2224/16145 , H01L2224/16225 , H01L2224/274 , H01L2224/2929 , H01L2224/293 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81192 , H01L2224/83102 , H01L2224/83191 , H01L2224/83192 , H01L2224/83851 , H01L2224/92125 , H01L2225/06513 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/014 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： A flip-chip type semiconductor device includes a semiconductor substrate. A plurality of electrode terminals are provided and arranged on a top surface of the semiconductor substrate, a sealing resin layer is formed on the top surface of the semiconductor substrate such that the electrode terminals are completely covered with the sealing resin layer.
摘要翻译： 倒装芯片型半导体器件包括半导体衬底。 多个电极端子设置并布置在半导体衬底的顶表面上，在半导体衬底的顶表面上形成密封树脂层，使得电极端子被密封树脂层完全覆盖。
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公开(公告)号：US07554205B2
公开(公告)日：2009-06-30
申请号：US11798224
申请日：2007-05-11
IPC分类号： H01L23/48
CPC分类号： H01L25/50 , H01L21/563 , H01L24/29 , H01L24/83 , H01L24/94 , H01L25/0657 , H01L2224/05571 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/1134 , H01L2224/131 , H01L2224/13144 , H01L2224/16145 , H01L2224/16225 , H01L2224/274 , H01L2224/2929 , H01L2224/293 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81192 , H01L2224/83102 , H01L2224/83191 , H01L2224/83192 , H01L2224/83851 , H01L2224/92125 , H01L2225/06513 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/014 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： A flip-chip type semiconductor device includes a semiconductor substrate. A plurality of electrode terminals are provided and arranged on a top surface of the semiconductor substrate, a sealing resin layer is formed on the top surface of the semiconductor substrate such that the electrode terminals are completely covered with the sealing resin layer.
摘要翻译： 倒装芯片型半导体器件包括半导体衬底。 多个电极端子设置并布置在半导体衬底的顶表面上，在半导体衬底的顶表面上形成密封树脂层，使得电极端子被密封树脂层完全覆盖。
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公开(公告)号：US20070216035A1
公开(公告)日：2007-09-20
申请号：US11798224
申请日：2007-05-11
IPC分类号： H01L29/40
CPC分类号： H01L25/50 , H01L21/563 , H01L24/29 , H01L24/83 , H01L24/94 , H01L25/0657 , H01L2224/05571 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/1134 , H01L2224/131 , H01L2224/13144 , H01L2224/16145 , H01L2224/16225 , H01L2224/274 , H01L2224/2929 , H01L2224/293 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81192 , H01L2224/83102 , H01L2224/83191 , H01L2224/83192 , H01L2224/83851 , H01L2224/92125 , H01L2225/06513 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/014 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： A flip-chip type semiconductor device includes a semiconductor substrate. A plurality of electrode terminals are provided and arranged on a top surface of the semiconductor substrate, a sealing resin layer is formed on the top surface of the semiconductor substrate such that the electrode terminals are completely covered with the sealing resin layer.
摘要翻译： 倒装芯片型半导体器件包括半导体衬底。 多个电极端子设置并布置在半导体衬底的顶表面上，在半导体衬底的顶表面上形成密封树脂层，使得电极端子被密封树脂层完全覆盖。
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5.发明授权Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device 失效倒装芯片型半导体器件，用于制造这种倒装芯片型半导体器件的制造工艺以及使用这种倒装芯片型半导体器件制造电子产品的生产工艺公开(公告)号：US07238548B2
公开(公告)日：2007-07-03
申请号：US10919411
申请日：2004-08-17
CPC分类号： H01L25/50 , H01L21/563 , H01L24/29 , H01L24/83 , H01L24/94 , H01L25/0657 , H01L2224/05571 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/1134 , H01L2224/131 , H01L2224/13144 , H01L2224/16145 , H01L2224/16225 , H01L2224/274 , H01L2224/2929 , H01L2224/293 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81192 , H01L2224/83102 , H01L2224/83191 , H01L2224/83192 , H01L2224/83851 , H01L2224/92125 , H01L2225/06513 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/014 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： A flip-chip type semiconductor device includes a semiconductor substrate. A plurality of electrode terminals are provided and arranged on a top surface of the semiconductor substrate, a sealing resin layer is formed on the top surface of the semiconductor substrate such that the electrode terminals are completely covered with the sealing resin layer.
摘要翻译： 倒装芯片型半导体器件包括半导体衬底。 多个电极端子设置并布置在半导体衬底的顶表面上，在半导体衬底的顶表面上形成密封树脂层，使得电极端子被密封树脂层完全覆盖。
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6.发明申请Flip-chip type semiconductor device, production process for manufacturing such flip-chip type semiconductor device, and production process for manufacturing electronic product using such flip-chip type semiconductor device 失效倒装芯片型半导体器件，用于制造这种倒装芯片型半导体器件的制造工艺以及使用这种倒装芯片型半导体器件制造电子产品的生产工艺公开(公告)号：US20050040541A1
公开(公告)日：2005-02-24
申请号：US10919411
申请日：2004-08-17
IPC分类号： H01L25/18 , H01L21/56 , H01L21/60 , H01L21/98 , H01L23/28 , H01L23/48 , H01L23/50 , H01L25/065 , H01L25/07
CPC分类号： H01L25/50 , H01L21/563 , H01L24/29 , H01L24/83 , H01L24/94 , H01L25/0657 , H01L2224/05571 , H01L2224/05573 , H01L2224/05624 , H01L2224/05644 , H01L2224/05647 , H01L2224/1134 , H01L2224/131 , H01L2224/13144 , H01L2224/16145 , H01L2224/16225 , H01L2224/274 , H01L2224/2929 , H01L2224/293 , H01L2224/32145 , H01L2224/32225 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81192 , H01L2224/83102 , H01L2224/83191 , H01L2224/83192 , H01L2224/83851 , H01L2224/92125 , H01L2225/06513 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15311 , H01L2924/014 , H01L2924/00014 , H01L2224/13099 , H01L2924/00
摘要： A flip-chip type semiconductor device includes a semiconductor substrate. A plurality of electrode terminals are provided and arranged on a top surface of the semiconductor substrate, a sealing resin layer is formed on the top surface of the semiconductor substrate such that the electrode terminals are completely covered with the sealing resin layer.
摘要翻译： 倒装芯片型半导体器件包括半导体衬底。 多个电极端子设置并布置在半导体衬底的顶表面上，在半导体衬底的顶表面上形成密封树脂层，使得电极端子被密封树脂层完全覆盖。
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7.发明授权Image processing device, image processing system, non-transitory computer readable medium, and image processing method 有权图像处理装置，图像处理系统，非暂时性计算机可读介质和图像处理方法公开(公告)号：US09247103B2
公开(公告)日：2016-01-26
申请号：US13559028
申请日：2012-07-26
申请人： Hiroshi Niina , Toshiyuki Yamada , Hiroshi Hayashi , Kenji Ueda , Tatsuya Namiki
发明人： Hiroshi Niina , Toshiyuki Yamada , Hiroshi Hayashi , Kenji Ueda , Tatsuya Namiki
CPC分类号： H04N1/33315 , H04N2201/33335 , H04N2201/33378
摘要： Provided is an image processing device including an image target separating unit that separates a read printed document into image targets, a page aggregation state determining unit that determines a page aggregation state of the read printed document based on a layout of the image targets separated by the image target separating unit, a printing direction determining unit that determines a printing direction of each of pages determined by the page aggregation state determining unit based on a features of each of the image targets separated by the image target separating unit, and a document format converting unit that converts a document format of the read printed document based on the results of the determination by the page aggregation state determining unit and the printing direction determining unit.
摘要翻译： 提供了一种图像处理装置，其包括将读取的打印文档分离成图像目标的图像目标分离单元，基于由所述图像目标分离的图像目标的布局来确定所读取的打印文档的页面聚合状态的页面聚合状态确定单元 图像目标分离单元，打印方向确定单元，其基于由图像目标分离单元分离的每个图像目标的特征来确定由页面聚合状态确定单元确定的每个页面的打印方向，以及文档格式转换 单元，其基于页面聚合状态确定单元和打印方向确定单元的确定结果来转换读取的打印文档的文档格式。
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公开(公告)号：US09108647B2
公开(公告)日：2015-08-18
申请号：US13809994
申请日：2011-07-12
申请人： Makoto Taguchi , Atsushi Sano , Toshiyuki Yamada , Hideki Kumamoto , Seiichiro Yagi , Masayuki Tomizawa
发明人： Makoto Taguchi , Atsushi Sano , Toshiyuki Yamada , Hideki Kumamoto , Seiichiro Yagi , Masayuki Tomizawa
CPC分类号： B61D17/08 , B61D1/00 , B61D17/041 , B61D25/00 , B61D33/00
摘要： A bodyshell structure of a railcar, includes a plurality of side window opening portions formed on a side bodyshell along a railcar longitudinal direction, and the side window opening portions include a plurality of large window opening portions arranged on a railcar-longitudinal-direction center portion of the side bodyshell and a plurality of small window opening portions arranged on both railcar-longitudinal-direction sides of the large window opening portions and each having a smaller opening area than the large window opening portion.
摘要翻译： 轨道车辆的车身结构包括沿着轨道车辆纵向方向形成在侧身体侧壳上的多个侧窗开口部分，并且侧窗口部分包括布置在轨道车纵向中心部分上的多个大窗口部分 和设置在大窗口部的两个轨道车辆纵向侧的多个小窗口部分，并且每个具有比大窗口部分更小的开口面积。
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公开(公告)号：US08831452B2
公开(公告)日：2014-09-09
申请号：US12873686
申请日：2010-09-01
申请人： Toshiyuki Yamada
发明人： Toshiyuki Yamada
CPC分类号： G03G15/1605 , G03G15/1675
摘要： An image forming apparatus includes a photosensitive member; charging device for electrically charging the photosensitive member; an exposure device for exposing to light the photosensitive member to form an electrostatic latent image; a developing device for developing the electrostatic latent image into a toner image; a transfer member for forming a transfer portion at which the toner image is to be transferred from the photosensitive member onto a transfer material; a voltage control portion for controlling a transfer voltage to be applied to the transfer member so that a current passing through the transfer member is constant; and a current setting device for setting a current value in constant current control by the voltage control portion so that the current value is decreased when a ratio of a potential difference between the transfer voltage and a light portion potential provided by the exposure device to a potential difference between the transfer voltage and a dark portion potential provided by the exposure device is decreased and so that the current value is increased when the ratio is increased.
摘要翻译： 图像形成装置包括感光构件; 充电装置，用于对感光构件进行充电; 曝光装置，用于曝光以使感光构件发光以形成静电潜像; 用于将静电潜像显影成调色剂图像的显影装置; 用于形成转印部分的转印部件，其中调色剂图像将从感光部件转印到转印材料上; 电压控制部分，用于控制施加到转印部件的转印电压，使得通过转印部件的电流恒定; 以及电流设定装置，用于通过电压控制部分设定恒定电流控制中的电流值，使得当转印电压和曝光装置提供的光部分电位之间的电位差与电位之间的电位值的比值减小电流值 转印电压和由曝光装置提供的暗部电位之间的差异减小，并且当比率增加时电流值增加。
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10.发明授权Image processing apparatus, image processing method and computer-readable medium 有权图像处理装置，图像处理方法和计算机可读介质公开(公告)号：US08532404B2
公开(公告)日：2013-09-10
申请号：US12568723
申请日：2009-09-29
CPC分类号： H04N19/85 , H04N19/12 , H04N19/172 , H04N19/186 , H04N19/80
摘要： An image processing apparatus includes a plurality of compression units and a switching unit. The plurality of compression units compress image information by different compression methods. The switching unit extracts plural pieces of color information from pieces of color information which constitute the image information in a color space expressing the image information, and selects one of the plurality of compression units in accordance with hue angles of the plural pieces of extracted color information.
摘要翻译： 图像处理装置包括多个压缩单元和切换单元。 多个压缩单元通过不同的压缩方法压缩图像信息。 切换单元从构成图像信息的颜色信息的多个颜色信息中提取表示图像信息的颜色空间中的多个颜色信息，并且根据多个提取的颜色信息的色调角度来选择多个压缩单元中的一个 。
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