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1.发明授权Laser diode array, laser device, wave-coupling laser source, and exposure device 失效激光二极管阵列，激光器件，波耦合激光源和曝光装置公开(公告)号：US06975659B2
公开(公告)日：2005-12-13
申请号：US10237687
申请日：2002-09-10
IPC分类号： G02B6/42 , G02B27/09 , H01S5/02 , H01S5/022 , H01S5/10 , H01S5/323 , H01S5/40 , H01S3/04 , H01S000/91
CPC分类号： G02B6/4206 , G02B27/09 , H01L2224/48091 , H01S5/02216 , H01S5/02236 , H01S5/0224 , H01S5/02252 , H01S5/02284 , H01S5/02469 , H01S5/32341 , H01S5/4031 , H01S5/4043 , H01L2924/00014
摘要： A plurality of multi-cavity laser diode chips, each having a plurality of light emitting points, are fixed side by side and form a laser diode array.
摘要翻译： 多个具有多个发光点的多腔激光二极管芯片并排固定并形成激光二极管阵列。
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公开(公告)号：US07301975B2
公开(公告)日：2007-11-27
申请号：US10954244
申请日：2004-10-01
IPC分类号： H01S3/04
CPC分类号： G02B6/4206 , G02B6/4248
摘要： In a laser module comprising a hermetically sealed container having inside a semiconductor laser device whose emission wavelength is 350˜450 nm, generation of organic volatile gas is suppressed in the container and life of the module is prolonged. In a laser module comprising a hermetically sealed container having inside a semiconductor laser device whose emission wavelength is 350˜450 nm and whose life is 5500 hours or more, optical components whose organic volatile gas generation measured by GC/MS is 10 μg/g or less at 150° C. are positioned in the container. In addition, as an organic adhesive to fix the optical components such as a collimating lens is used an organic adhesive whose organic volatile gas generation measured by GC/MS is 300 μg/g or less at 15° C.
摘要翻译： 在包含发光波长为350〜450nm的半导体激光装置的内部的气密密封容器的激光模块中，在容器中抑制有机挥发性气体的产生，延长了模块的使用寿命。 在发光波长为350〜450nm，寿命为5500小时以上的半导体激光装置的内部的气密密封容器的激光组件中，通过GC / MS测定的有机挥发性气体产生量为10mug / g， 在150℃下较少位于容器中。 此外，作为用于固定准直透镜等光学部件的有机粘合剂，使用通过GC / MS测定的有机挥发性气体产生在15℃下为300mug / g以下的有机粘合剂。
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公开(公告)号：US07110425B2
公开(公告)日：2006-09-19
申请号：US10405931
申请日：2003-04-03
CPC分类号： H01S5/4012 , H01L2224/48091 , H01S5/0021 , H01S5/02212 , H01S5/0222 , H01S5/02284 , H01S5/32341 , H01S5/4031 , H01L2924/00014
摘要： In a disclosed laser module, a usage amount of organic adhesive is set to no more than 1.0 g/ml. Thus, an equilibrium density of outgas components from the adhesive after an air removal treatment is less than 1000 ppm. In another laser module, a heat sink at which a semiconductor laser element is adhered on a submount, an electrode terminal wire-connected with the laser element, a photodiode wire-connected with the electrode terminal, and a zeolite adsorbent are fixedly provided on a stem. These are ring-welded in a container in a dry air atmosphere (80% nitrogen, 20% oxygen). In still another laser module, sixteen multiplexed lasers are disposed in a container. The container is connected with an air circulation apparatus, which is provided with a filter for removing contaminants, a rotary pump for circulating inert gas, and a valve for controlling replenishment of the gas.
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4.发明授权Laser apparatus in which laser diodes and corresponding collimator lenses are fixed to block, and fiber module in which laser apparatus is coupled to optical fiber 有权其中将激光二极管和相应的准直透镜固定在其上的激光装置和激光装置耦合到光纤的光纤模块公开(公告)号：US07830945B2
公开(公告)日：2010-11-09
申请号：US10616227
申请日：2003-07-10
申请人： Kazuhiko Nagano , Yoji Okazaki , Teruhiko Kuramachi , Takashi Yoshida , Satoshi Mino , Eiji Suzuki
发明人： Kazuhiko Nagano , Yoji Okazaki , Teruhiko Kuramachi , Takashi Yoshida , Satoshi Mino , Eiji Suzuki
IPC分类号： H01S3/08
CPC分类号： H01S5/4012 , G02B6/4206 , G02B6/424 , G02B6/4249 , G02B6/4251 , G02B6/4267 , H01S5/0224 , H01S5/02252 , H01S5/02284 , H01S5/4031 , H01S5/405 , H01S2301/04
摘要： A laser apparatus includes: a plurality of laser diodes respectively having light-emission points and being fixed to a block so that the light-emission points are aligned along a direction; and a collimator-lens array integrally formed to contain a plurality of collimator lenses which are arranged along a direction and respectively collimate laser beams emitted from the plurality of laser diodes. The block has a lens-setting surface which is flat, perpendicular to optical axes of the plurality of laser diodes, and located on the forward side of the plurality of laser diodes at a predetermined distance from the light-emission points, and the collimator-lens array is fixed to the block so that an end surface of the collimator-lens array is in contact with the lens-setting surface.
摘要翻译： 激光装置包括：多个激光二极管，分别具有发光点并被固定到块，使得发光点沿着一个方向排列; 以及整体形成为容纳多个准直透镜的准直透镜阵列，所述准直透镜沿着一个方向排列并且分别准直从所述多个激光二极管发射的激光束。 该块具有与多个激光二极管的光轴垂直且平行的透镜设置表面，并且位于距离发光点预定距离的多个激光二极管的前侧，并且准直器 - 透镜阵列固定在块上，使得准直透镜阵列的端面与透镜设置表面接触。
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5.发明授权Laser apparatus having protection member at light-emission end of multimode optical fiber 有权具有多模光纤的发光端的保护部件的激光装置公开(公告)号：US07101094B2
公开(公告)日：2006-09-05
申请号：US10670473
申请日：2003-09-26
IPC分类号： G02B6/36
CPC分类号： G02B6/4201 , G02B6/4206 , G02B6/424 , G02B6/4249 , G02B6/4254 , G02B6/4257 , G02B6/4273
摘要： In a laser apparatus, a plurality of semiconductor laser elements respectively emit laser beams; a multimode optical fiber has a light-entrance end and a light-emission end; an optical condensing system collects the laser beams emitted from the plurality of semiconductor laser elements, and couples the collected laser beams to the light-entrance end of the multimode optical fiber; and a protection member is arranged at the light-emission end of the multimode optical fiber, protects the light-emission end from the atmosphere, and has a light-emission window located at at least a predetermined distance from the light-emission end.
摘要翻译： 在激光装置中，多个半导体激光元件分别发射激光束; 多模光纤具有光入射端和发光端; 聚光系统收集从多个半导体激光元件发射的激光束，并将收集的激光束耦合到多模光纤的光入射端; 并且在多模光纤的发光端设置保护部件，将发光端保护于大气，并且具有位于与发光端至少预定距离的发光窗口。
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公开(公告)号：US07068690B2
公开(公告)日：2006-06-27
申请号：US10615937
申请日：2003-07-10
IPC分类号： H01S3/04
CPC分类号： H01S5/4031 , H01L2224/48091 , H01S5/005 , H01S5/0224 , H01S5/02248 , H01S5/02272 , H01S5/02284 , H01S5/02407 , H01S5/02476 , H01S5/32341 , H01S5/4012 , H01S5/405 , H01L2924/00014
摘要： In a laser-light source: submounts each being made of a material having a thermal expansion coefficient of 3.5 to 6.0×10−6/° C. and having a thickness of 200 to 400 micrometers are separately formed on a heat-dissipation block made of copper or copper alloy; a single-cavity nitride-based semiconductor laser chips are respectively mounted junction-side-down on the corresponding submounts; an optical condenser system collects laser beams emitted from the semiconductor laser chips, and couples the collected laser beams to a multimode optical fiber. A bonding surface of each semiconductor laser chip is bonded to a bonding surface of a corresponding submount through a metalization layer and an Au—Sn eutectic solder layer each of which is divided into areas.
摘要翻译： 在激光光源中，各自由热膨胀系数为3.5〜6.0×10 -6 /℃的材料制成的厚度为200〜400微米的基板分开形成在 由铜或铜合金制成的散热块; 单腔氮化物基半导体激光器芯片分别安装在相应的底座上并排安装; 光聚光系统收集从半导体激光芯片发射的激光束，并将收集的激光束耦合到多模光纤。 每个半导体激光器芯片的接合表面通过金属化层和Au-Sn共晶焊料层分别结合到相应的基座的接合表面上，每个区域分开。
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公开(公告)号：US20050058167A1
公开(公告)日：2005-03-17
申请号：US10954244
申请日：2004-10-01
CPC分类号： G02B6/4206 , G02B6/4248
摘要： In a laser module comprising a hermetically sealed container having inside a semiconductor laser device whose emission wavelength is 350˜450 nm, generation of organic volatile gas is suppressed in the container and life of the module is prolonged. In a laser module comprising a hermetically sealed container having inside a semiconductor laser device whose emission wavelength is 350˜450 nm and whose life is 5500 hours or more, optical components whose organic volatile gas generation measured by GC/MS is 10 μg/g or less at 150° C. are positioned in the container. In addition, as an organic adhesive to fix the optical components such as a collimating lens is used an organic adhesive whose organic volatile gas generation measured by GC/MS is 300 μg/g or less at 15° C.
摘要翻译： 在包含发光波长为350〜450nm的半导体激光装置的内部的气密密封容器的激光模块中，在容器中抑制有机挥发性气体的产生，延长了模块的使用寿命。 在发光波长为350〜450nm，寿命为5500小时以上的半导体激光装置的内部的气密密封容器的激光组件中，通过GC / MS测定的有机挥发性气体产生量为10mug / g， 在150℃下较少位于容器中。 此外，作为用于固定准直透镜等光学部件的有机粘合剂，使用通过GC / MS测定的有机挥发性气体产生在15℃下为300mug / g以下的有机粘合剂。
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公开(公告)号：US07369586B2
公开(公告)日：2008-05-06
申请号：US10954245
申请日：2004-10-01
IPC分类号： H01S3/13
CPC分类号： G02B6/4206 , G02B6/4239 , H01L2224/48091 , H01L2924/12044 , H01S5/005 , H01S5/0222 , H01S5/02248 , H01S5/02284 , H01S5/4012 , H01S5/4031 , H01L2924/00014 , H01L2924/00
摘要： In a laser module comprising a hermetically sealed container having inside a semiconductor laser device whose emission wavelength is 350˜450 nm, generation of organic volatile gas is suppressed in the container and life of the module is prolonged. In a laser module comprising a hermetically sealed container having inside a semiconductor laser device whose emission wavelength is 350˜450 nm, optical components whose organic volatile gas generation measured by GC/MS is 10 μg/g or less at 150° C. are positioned in the container. In addition, as an organic adhesive to fix the optical components such as a collimating lens is used an organic adhesive whose organic volatile gas generation measured by GC/MS is 100 μg/g or less at 150° C.
摘要翻译： 在包含发光波长为350〜450nm的半导体激光装置的内部的气密密封容器的激光模块中，在容器中抑制有机挥发性气体的产生，延长了模块的使用寿命。 在包括发光波长为350〜450nm的半导体激光装置的内部的气密密封容器的激光模块中，通过GC / MS测定的有机挥发性气体的产生在150℃下为10mug / g以下的光学部件被定位 在容器中 此外，作为用于固定准直透镜等光学部件的有机粘合剂，使用通过GC / MS测定的有机挥发性气体产生在150℃下为100mug / g以下的有机粘合剂。
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公开(公告)号：US20050074039A1
公开(公告)日：2005-04-07
申请号：US10954245
申请日：2004-10-01
IPC分类号： G02B6/42 , C09J11/04 , C09J11/06 , C09J163/00 , C09J171/02 , C09J201/00 , H01S3/10 , H01S5/00 , H01S5/02 , H01S5/022 , H01S5/024 , H01S5/40
CPC分类号： G02B6/4206 , G02B6/4239 , H01L2224/48091 , H01L2924/12044 , H01S5/005 , H01S5/0222 , H01S5/02248 , H01S5/02284 , H01S5/4012 , H01S5/4031 , H01L2924/00014 , H01L2924/00
摘要： In a laser module comprising a hermetically sealed container having inside a semiconductor laser device whose emission wavelength is 350˜450 nm, generation of organic volatile gas is suppressed in the container and life of the module is prolonged. In a laser module comprising a hermetically sealed container having inside a semiconductor laser device whose emission wavelength is 350˜450 nm, optical components whose organic volatile gas generation measured by GC/MS is 10 μg/g or less at 150° C. are positioned in the container. In addition, as an organic adhesive to fix the optical components such as a collimating lens is used an organic adhesive whose organic volatile gas generation measured by GC/MS is 100 μg/g or less at 150° C.
摘要翻译： 在包含发光波长为350〜450nm的半导体激光装置的内部的气密密封容器的激光模块中，在容器中抑制有机挥发性气体的产生，延长了模块的使用寿命。 在包括发光波长为350〜450nm的半导体激光装置的内部的气密密封容器的激光模块中，通过GC / MS测定的有机挥发性气体的产生在150℃下为10mug / g以下的光学部件被定位 在容器中 此外，作为用于固定准直透镜等光学部件的有机粘合剂，使用通过GC / MS测定的有机挥发性气体产生在150℃下为100mug / g以下的有机粘合剂。
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10.发明授权Optical wiring substrate fabrication process and optical wiring substrate device 有权光布线基板制造工艺和光布线基板装置公开(公告)号：US07197201B2
公开(公告)日：2007-03-27
申请号：US10456965
申请日：2003-06-09
IPC分类号： G02B6/12
CPC分类号： G03F7/7005 , G02B6/136 , G02B6/138 , G02B2006/12104 , G03F7/70291 , G03F7/70391
摘要： An optical wiring substrate fabrication method capable of simple formation, by maskless exposure, of an inclined face shape at an end portion of a core layer structuring an optical waveguide. Using an exposure apparatus, image exposure is carried out with a light beam which is modulated by a spatial modulation element in accordance with image information. A predetermined area of a photosensitive material (a photoresist), which is coated on the core layer which is a material of the optical wiring substrate, is exposed by a light beam (UV) and patterned to form an etching mask. A region corresponding to the inclined face, which is to be formed at the end portion of the core layer, is exposed and patterned by the light beam, exposure amounts of which are controlled in accordance with the inclined form of the inclined face, such that an end portion of the etching mask has an inclined face structure. When the core layer is worked by etching using this etching mask, working of the core layer at the end portion of the core layer progresses in proportion to film thickness of the etching mask, and the inclined face is formed.
摘要翻译： 一种光学布线基板的制造方法，其能够通过无掩模地曝光在构成光波导的芯层的端部处形成倾斜的表面形状。 使用曝光装置，利用由空间调制元件根据图像信息调制的光束进行图像曝光。 通过光束（UV）对作为光布线基板的材料的芯层上涂布的感光材料（光致抗蚀剂）的预定区域进行曝光并图案化以形成蚀刻掩模。 对应于要形成在芯层的端部的倾斜面的区域被光束曝光和图案化，其曝光量根据倾斜面的倾斜形式被控制，使得 蚀刻掩模的端部具有倾斜面结构。 当通过使用该蚀刻掩模的蚀刻加工芯层时，芯层的端部的芯层的加工与蚀刻掩模的膜厚度成比例地进行，并且形成倾斜面。
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