公开(公告)号：US20110304857A1

公开(公告)日：2011-12-15

申请号：US12796940

申请日：2010-06-09

申请人： Yong Yu Liu ,  Choon Leong Lou ,  Lai Peng Chew

发明人： Yong Yu Liu ,  Choon Leong Lou ,  Lai Peng Chew

IPC分类号： G01N21/01 ,  G01B11/24 ,  G01N21/55

CPC分类号： G01N21/01 ,  G01N21/9501 ,  G01N21/95607

摘要： One aspect of the present disclosure provides a probing apparatus with on-probe device-mapping function. A probing apparatus according to this aspect of the present disclosure comprises a housing, at least one probe stage positioned on the housing and configured to retain at least one probe, a device holder positioned in the housing and configured to receive at least one semiconductor device under test, and an inspection module having a predetermined field of view configured to capture an image showing at least the semiconductor device, wherein the probe stage includes a driving unit configured to move the probe out of focus of the inspection module in a mapping phase while keeping the device under test in the field of view of the optical inspection module.

摘要翻译： 本公开的一个方面提供了具有探测器设备映射功能的探测设备。 根据本公开的该方面的探测装置包括壳体，至少一个探针台，其定位在壳体上并且被配置为保持至少一个探针，定位在壳体中并被配置为接收至少一个半导体器件的探针台 测试和具有预定视场的检查模块，其被配置为捕获至少显示半导体器件的图像，其中所述探针台包括驱动单元，所述驱动单元被配置为在保持测绘阶段的同时将所述探针离开所述检查模块的焦点 在光学检测模块的视场中被测设备。

公开(公告)号：US08279451B2

公开(公告)日：2012-10-02

申请号：US12796940

申请日：2010-06-09

申请人： Yong Yu Liu ,  Choon Leong Lou ,  Lai Peng Chew

发明人： Yong Yu Liu ,  Choon Leong Lou ,  Lai Peng Chew

IPC分类号： G01B11/24 ,  G01B11/14

CPC分类号： G01N21/01 ,  G01N21/9501 ,  G01N21/95607

摘要： One aspect of the present disclosure provides a probing apparatus with on-probe device-mapping function. A probing apparatus according to this aspect of the present disclosure comprises a housing, at least one probe stage positioned on the housing and configured to retain at least one probe, a device holder positioned in the housing and configured to receive at least one semiconductor device under test, and an inspection module having a predetermined field of view configured to capture an image showing at least the semiconductor device, wherein the probe stage includes a driving unit configured to move the probe out of focus of the inspection module in a mapping phase while keeping the device under test in the field of view of the optical inspection module.

摘要翻译： 本公开的一个方面提供了具有探测器设备映射功能的探测设备。 根据本公开的该方面的探测装置包括壳体，至少一个探针台，其定位在壳体上并且被配置为保持至少一个探针，定位在壳体中并被配置为接收至少一个半导体器件的探针台 测试和具有预定视场的检查模块，其被配置为捕获至少显示半导体器件的图像，其中所述探针台包括驱动单元，所述驱动单元被配置为在保持测绘阶段的同时将所述探针离开所述检查模块的焦点 在光学检测模块的视场中被测设备。

公开(公告)号：US20090128897A1

公开(公告)日：2009-05-21

申请号：US12015775

申请日：2008-01-17

申请人： Yong Yu Liu ,  Choon Leong Lou

发明人： Yong Yu Liu ,  Choon Leong Lou

IPC分类号： G02B21/18 ,  G02B21/06 ,  H04N7/18

CPC分类号： G02B21/18 ,  G02B21/025 ,  G02B21/06 ,  H04N7/183

摘要： A microscope comprises an object splitter and a plurality of image-outputting devices configured to receive object images. The object splitter includes a first beam splitter configured to direct an illumination light to an object, a positive lens configured to collect a reflected light from the object and focus the reflected light on the first beam splitter, a second beam splitter configured to split the reflected light into a plurality of optical paths and a plurality of negative lenses positioned on the optical paths to render object images. A probing apparatus for an integrated circuit device comprises at least one probe pin configured to contact a pad of the integrated circuit device and a microscope including an object splitter and a plurality of image-outputting devices configured to receive images from the object splitter.

摘要翻译： 显微镜包括对象分离器和被配置为接收对象图像的多个图像输出装置。 对象分离器包括：第一分束器，其被配置为将照明光引导到物体;正透镜，被配置为收集来自物体的反射光并将反射光聚焦在第一分束器上;第二分束器，被配置为将反射 将光转换成多个光路和位于光路上的多个负透镜以渲染对象图像。 用于集成电路装置的探测装置包括至少一个探针，其被配置为接触集成电路装置的焊盘和包括对象分离器的显微镜和被配置为从对象分离器接收图像的多个图像输出装置。

公开(公告)号：US08198725B2

公开(公告)日：2012-06-12

申请号：US12651006

申请日：2009-12-31

申请人： Choon Leong Lou

发明人： Choon Leong Lou

IPC分类号： H01L23/34

CPC分类号： H01L23/367 ,  H01L23/13 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An integrated circuit assembly includes a heat sink and a substrate coupled to the heat sink. The heat sink includes a base and a plurality of fins disposed on the base, the base has an intermediate portion and two side portions connected to the intermediate portion, the intermediate portion has a first width and the side portions has a second width larger than the first width, and the fins are disposed on the side portions of the base. The substrate is made of ceramic material and has an upper surface with an opening and a lower surface with a groove, the groove matches the intermediate portion of the heat sink, and the opening is configured to expose a portion of the intermediate portion to receive an integrated circuit package.

摘要翻译： 集成电路组件包括耦合到散热器的散热器和衬底。 散热片包括基部和设置在基座上的多个翅片，基座具有中间部分和与中间部分连接的两个侧部，中间部分具有第一宽度，并且侧部部分具有大于 第一宽度，并且翅片设置在基部的侧部。 衬底由陶瓷材料制成，并且具有开口的上表面和具有凹槽的下表面，凹槽与散热器的中间部分匹配，并且开口构造成暴露中间部分的一部分以接收 集成电路封装。

公开(公告)号：US20120043987A1

公开(公告)日：2012-02-23

申请号：US12861183

申请日：2010-08-23

申请人： Choon Leong Lou ,  Chih Kun Chen

发明人： Choon Leong Lou ,  Chih Kun Chen

IPC分类号： G01R31/00

CPC分类号： G01R1/06716

摘要： A vertical probe for testing semiconductor devices includes a bottom contact and a top contact stacked on the bottom contact in a substantially linear manner. In one embodiment of the present invention, the bottom contact includes a plurality of first wave springs stacked one on top of another in a crest to crest manner, the bottom contact has a bottom opening configured to contact a device under test, and the wave spring is configured to provide a vertical displacement for relieving the stress generated as the vertical probe contacts the device under test, wherein the width of the top contact is greater than the width of the bottom contact.

摘要翻译： 用于测试半导体器件的垂直探针包括以基本线性的方式堆叠在底部触点上的底部触点和顶部触点。 在本发明的一个实施例中，底部触点包括多个以峰顶方式堆叠在另一个顶部上的第一波形弹簧，底部触点具有被配置为接触被测器件的底部开口和波形弹簧 被配置为提供垂直位移，用于消除当垂直探针接触被测器件时产生的应力，其中顶部触点的宽度大于底部触点的宽度。

公开(公告)号：US08035405B2

公开(公告)日：2011-10-11

申请号：US12401908

申请日：2009-03-11

申请人： Choon Leong Lou

发明人： Choon Leong Lou

IPC分类号： G01R31/00

CPC分类号： G01R31/2874

摘要： A probing apparatus includes a housing, a device holder positioned in the housing and configured to receive a device under test, a temperature-controller positioned in the device holder, a platen positioned on the housing and configured to retain at least one probe, and a flow line positioned in the platen, wherein the flow line is configured to flow a fluid therein to adjust the temperature of the platen.

摘要翻译： 探测装置包括壳体，设置在壳体中并被配置为接收被测设备的设备保持器，定位在设备保持器中的温度控制器，定位在壳体上并被配置为保持至少一个探针的压板，以及 流动管线定位在压板中，其中流动管线被配置为在其中流动流体以调节压板的温度。

公开(公告)号：US20110063608A1

公开(公告)日：2011-03-17

申请号：US12857036

申请日：2010-08-16

申请人： Choon Leong Lou ,  Li Min Wang ,  Yi Ming Lau ,  Ho Yeh Chen

发明人： Choon Leong Lou ,  Li Min Wang ,  Yi Ming Lau ,  Ho Yeh Chen

IPC分类号： G01N21/01

CPC分类号： G01J1/02 ,  G01J1/0271 ,  G01J1/04 ,  G01J1/0403 ,  G01J1/0407 ,  G01J1/0414 ,  G01J1/0425 ,  G01J3/505

摘要： A sensing module for light-emitting devices includes a substrate having at least one first hole and at least one second hole connected to the first hole, an optical device positioned in the first hole and configured to collect emitting lights from the light-emitting device to the first hole, a light-guiding device positioned in the second hole, a reflector positioned in the first hole and configured to reflect the emitting lights from the light-emitting device to the light-guiding device, and an optical coupler positioned at a front end of the substrate and coupled with the light-guiding device.

摘要翻译： 一种用于发光器件的感测模块包括具有至少一个第一孔和连接到第一孔的至少一个第二孔的衬底，位于第一孔中的光学器件，其被配置成将从发光器件发出的光聚集到 所述第一孔，定位在所述第二孔中的导光装置，位于所述第一孔中的反射器，其被配置为将所述发光装置从所述发光装置反射到所述导光装置;以及光耦合器， 并且与导光装置耦合。

公开(公告)号：US09329205B2

公开(公告)日：2016-05-03

申请号：US13425170

申请日：2012-03-20

申请人： Choon Leong Lou ,  Ho Yeh Chen ,  Hsiao Ting Tseng

发明人： Choon Leong Lou ,  Ho Yeh Chen ,  Hsiao Ting Tseng

IPC分类号： G01R1/067 ,  G01R1/073 ,  G01R31/28

CPC分类号： G01R1/07342 ,  G01R1/06727 ,  G01R1/07357 ,  G01R31/2891

摘要： A high precision semiconductor probing system includes a probe head, a circuit board positioned above the probe head, and an optical microscope, wherein the probe head has a plurality of vertical probes and at least one cantilever probe having a vertical body positioned therein. The cantilever probe is disposed close to an edge of the probe head and extends laterally out from the probe head, in order to facilitate the visual alignment viewing from top of the probing apparatus. The optical microscope is positioned on top of the probing apparatus and is configured to have a line of sight directed to the tip of the cantilever probe.

摘要翻译： 高精度半导体探测系统包括探针头，位于探针头上方的电路板和光学显微镜，其中探头具有多个垂直探针和至少一个垂直体定位在其中的悬臂探头。 悬臂探头靠近探头的边缘设置，并从探针头侧向伸出，以便于从探测装置的顶部观察视觉对准。 光学显微镜位于探测装置的顶部，并被配置成具有指向悬臂探针的尖端的视线。

公开(公告)号：US08692570B2

公开(公告)日：2014-04-08

申请号：US13105321

申请日：2011-05-11

申请人： Choon Leong Lou ,  Chih Kun Chen

发明人： Choon Leong Lou ,  Chih Kun Chen

IPC分类号： G01R31/00

CPC分类号： G01R1/06772 ,  G01R1/06727 ,  G01R1/07342

摘要： A probe card includes a circuit board, a flexible substrate, and a plurality of probes. The flexible substrate includes a plurality of arrayed conductive strips. The plurality of conductive strips is electrically connected to the printed circuit board. The plurality of probes is fixed to the printed circuit board, and the end of each probe is attached to one corresponding conductive strip.

摘要翻译： 探针卡包括电路板，柔性基板和多个探针。 柔性基板包括多个排列的导电条。 多个导电带电连接到印刷电路板。 多个探针固定在印刷电路板上，每个探针的端部连接到一个对应的导电条上。

公开(公告)号：US08188758B2

公开(公告)日：2012-05-29

申请号：US12552029

申请日：2009-09-01

申请人： Choon Leong Lou

发明人： Choon Leong Lou

IPC分类号： G01R1/067

CPC分类号： G01R31/2886 ,  G01R1/07392

摘要： An enclosed probe station comprises a chuck assembly, a supporting member and an enclosure. The chuck assembly is configured to support a device under test. The supporting member is configured to secure a probe used to contact the device under test. The enclosure forms an interior space in which the chuck assembly and the supporting member are disposed.

摘要翻译： 封闭的探针台包括卡盘组件，支撑构件和外壳。 卡盘组件被配置成支撑被测设备。 支撑构件被配置为固定用于接触被测设备的探针。 外壳形成内部空间，卡盘组件和支撑构件设置在内部空间中。