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    DC POWER CABLE WITH SPACE CHARGE REDUCING EFFECT
    3.
    发明申请
    DC POWER CABLE WITH SPACE CHARGE REDUCING EFFECT 有权
    直流电源线，带空电充电效果

    公开(公告)号：US20120012362A1

    公开(公告)日：2012-01-19

    申请号：US12886972

    申请日：2010-09-21

    申请人： Yoon-Jin KIM ,  Jin-Ho Nam ,  Ho-Souk Cho ,  Young-Ho Park ,  Son Tung Ha

    发明人： Yoon-Jin KIM ,  Jin-Ho Nam ,  Ho-Souk Cho ,  Young-Ho Park ,  Son Tung Ha

    IPC分类号： H01B7/00

    CPC分类号： H01B3/004 ,  H01B3/441 ,  H01B9/027

    摘要： Provided is a DC power cable including a conductor, an inner semiconductive layer, an insulation and an outer semiconductive layer. In particular, the inner semiconductive layer or the outer semiconductive layer may be formed from a semiconductive composition containing a polypropylene base resin or a low-density polyethylene base resin and carbon nano tubes; and the insulation may be formed from an insulation composition containing a polypropylene base resin or a low-density polyethylene base resin and inorganic nano particles. The resulting power cable may have improved properties such as volume resistivity, hot set, and so on, and excellent space charge reducing effect.

    摘要翻译： 提供一种包括导体，内部半导体层，绝缘体和外部半导体层的DC电力电缆。 特别地，内部半导体层或外部半导体层可以由含有聚丙烯基础树脂或低密度聚乙烯基础树脂和碳纳米管的半导体组合物形成; 并且绝缘体可以由包含聚丙烯基础树脂或低密度聚乙烯基础树脂和无机纳米颗粒的绝缘组合物形成。 所得到的电力电缆可能具有改进的性能，例如体积电阻率，热定型等，并且具有优异的空间电荷减少效果。

    DC power cable with space charge reducing effect
    4.
    发明授权
    DC power cable with space charge reducing effect 有权
    直流电源线具有空间充电效果

    公开(公告)号：US09076566B2

    公开(公告)日：2015-07-07

    申请号：US12886972

    申请日：2010-09-21

    申请人： Yoon-Jin Kim ,  Jin-Ho Nam ,  Ho-Souk Cho ,  Young-Ho Park ,  Son Tung Ha

    发明人： Yoon-Jin Kim ,  Jin-Ho Nam ,  Ho-Souk Cho ,  Young-Ho Park ,  Son Tung Ha

    IPC分类号： H01B3/30 ,  H01B3/44 ,  H01B7/295 ,  H01B7/00 ,  H01B3/00 ,  H01B9/02

    CPC分类号： H01B3/004 ,  H01B3/441 ,  H01B9/027

    摘要： Provided is a DC power cable including a conductor, an inner semiconductive layer, an insulation and an outer semiconductive layer. In particular, the inner semiconductive layer or the outer semiconductive layer may be formed from a semiconductive composition containing a polypropylene base resin or a low-density polyethylene base resin and carbon nano tubes; and the insulation may be formed from an insulation composition containing a polypropylene base resin or a low-density polyethylene base resin and inorganic nano particles. The resulting power cable may have improved properties such as volume resistivity, hot set, and so on, and excellent space charge reducing effect.

    摘要翻译： 提供一种包括导体，内部半导体层，绝缘体和外部半导体层的DC电力电缆。 特别地，内部半导体层或外部半导体层可以由含有聚丙烯基础树脂或低密度聚乙烯基础树脂和碳纳米管的半导体组合物形成; 并且绝缘体可以由包含聚丙烯基础树脂或低密度聚乙烯基础树脂和无机纳米颗粒的绝缘组合物形成。 所得到的电力电缆可能具有改进的性能，例如体积电阻率，热定型等，并且具有优异的空间电荷减少效果。

    Conductive paste and conductive circuit board produced therewith
    5.
    发明授权
    Conductive paste and conductive circuit board produced therewith 有权
    导电膏和导电电路板

    公开(公告)号：US08545731B2

    公开(公告)日：2013-10-01

    申请号：US13155367

    申请日：2011-06-07

    申请人： Yoon-Jin Kim ,  Chang-Mo Ko ,  Ho-Souk Cho

    发明人： Yoon-Jin Kim ,  Chang-Mo Ko ,  Ho-Souk Cho

    IPC分类号： H01B1/04 ,  H01B1/22 ,  H01B1/02 ,  H05K1/00

    CPC分类号： H01B1/22 ,  B82Y10/00 ,  C09D11/52 ,  H05K1/095 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0323

    摘要： A conductive paste containing silver nanoparticles and a conductive circuit board provided therewith are provided. The conductive paste containing silver nanoparticles includes 15 to 50 weight % of silver nanoparticles based on a total weight of the conductive paste, the silver nanoparticles having an average particle size of 1 to 100 nm; 0.1 to 2.5 weight % of carbon nanotubes based on the total weight of the conductive paste, the carbon nanotubes having an average diameter of 2 to 40 nm; 1 to 15 weight % of a binder based on the total weight of the conductive paste; and a solvent.

    摘要翻译： 提供含有银纳米颗粒的导电糊料和设置有导电电路板的导电电路板。 含有银纳米颗粒的导电糊料包含基于导电浆料的总重量的15至50重量％的银纳米颗粒，银纳米颗粒具有1至100nm的平均粒径; 0.1至2.5重量％的碳纳米管，基于导电浆料的总重量，碳纳米管的平均直径为2至40nm; 1〜15重量％的粘合剂，基于导电浆料的总重量; 和溶剂。

    CONDUCTIVE PASTE AND CONDUCTIVE CIRCUIT BOARD PRODUCED THEREWITH
    6.
    发明申请
    CONDUCTIVE PASTE AND CONDUCTIVE CIRCUIT BOARD PRODUCED THEREWITH 有权
    导电胶和导电电路板生产

    公开(公告)号：US20110260115A1

    公开(公告)日：2011-10-27

    申请号：US13155367

    申请日：2011-06-07

    申请人： Yoon-Jin Kim ,  Chang-Mo Ko ,  Ho-Souk Cho

    发明人： Yoon-Jin Kim ,  Chang-Mo Ko ,  Ho-Souk Cho

    IPC分类号： H01B1/24 ,  H01B1/22 ,  B82Y99/00

    CPC分类号： H01B1/22 ,  B82Y10/00 ,  C09D11/52 ,  H05K1/095 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0323

    摘要： A conductive paste containing silver nanoparticles and a conductive circuit board provided therewith are provided. The conductive paste containing silver nanoparticles includes 15 to 50 weight % of silver nanoparticles based on a total weight of the conductive paste, the silver nanoparticles having an average particle size of 1 to 100 nm; 0.1 to 2.5 weight % of carbon nanotubes based on the total weight of the conductive paste, the carbon nanotubes having an average diameter of 2 to 40 nm; 1 to 15 weight % of a binder based on the total weight of the conductive paste; and a solvent.

    摘要翻译： 提供含有银纳米颗粒的导电糊料和设置有导电电路板的导电电路板。 含有银纳米颗粒的导电糊料包含基于导电浆料的总重量的15至50重量％的银纳米颗粒，银纳米颗粒具有1至100nm的平均粒径; 0.1至2.5重量％的碳纳米管，基于导电浆料的总重量，碳纳米管的平均直径为2至40nm; 1〜15重量％的粘合剂，基于导电浆料的总重量; 和溶剂。