Abstract:
A method for manufacturing a semiconductor optical device includes forming a BDR (Band Discontinuity Reduction) layer of a first conductivity type doped with an impurity, depositing a contact layer of the first conductivity type in contact with the BDR layer after forming the BDR layer, the contact layer being doped with the same impurity as the BDR layer and used to form an electrode, and heat treating after forming the contact layer.
Abstract:
A semiconductor optical element having a includes an n-type GaAs buffer layer, an n-type AlGaInP cladding layer, a first InGaAsP (including zero As content) guide layer without added dopant impurities, an InGaAsP (including zero In content) active layer, a second InGaAsP (including zero As content) guide layer without added dopant impurities, a p-type AlGaInP cladding layer, a p-type band discontinuity reduction layer, and a p-type GaAs contact layer sequentially laminated on an n-type GaAs substrate C or Mg is the dopant impurity in the p-type-GaAs contact layer, the p-type band discontinuity reduction layer, and the p-type AlGaInP cladding layer.
Abstract:
A waveguide semiconductor optical device has a pin junction on a semi-insulating substrate. The pin junction consists of an n-type cladding layer, an i-type absorption layer, and a p-type cladding layer. The waveguide semiconductor optical device includes a dopant impurity concentration not higher than 1016 cm-3 in the i-type absorption layer.
Abstract translation:波导半导体光学器件在半绝缘衬底上具有pin结。 pin结由n型包覆层,i型吸收层和p型覆层组成。 该波导半导体光学器件包括在i型吸收层中不高于10 16 cm -3的掺杂剂杂质浓度。
Abstract:
In a semiconductor light-emitting device, an active layer has a multi quantum well structure (MQW) barrier layers and quantum well layers alternately arranged. Each of the cladding layers has a multi quantum barrier structure (MQB) including barrier layers and well layers alternately arranged. The multi quantum barrier (MQB) of each of the cladding layers varies in a graded or stepwise form. Thus, charge carriers are prevented from overflowing from the active layer, preventing cut-off of a guided wave mode, increasing reflectance of electrons entering the energy barriers, and improving temperature characteristics.
Abstract:
A semiconductor optical device with improved optical gain and enhanced switching characteristics. The semiconductor optical device includes positive and negative electrodes for providing holes and electrons, respectively. The semiconductor optical device also includes an active layer between the positive and negative electrodes. The active layer includes a multiple quantum well structure having p-type quantum well layers and barrier layers. The quantum well layers are doped with an impurity that diffuses less than zinc so that trapping holes are produced and excessive electrons contributing no light emission are quenched by the trapping holes. The impurity can be beryllium, magnesium, or carbon.
Abstract:
A method for manufacturing a semiconductor optical device includes: forming a p-type cladding layer; forming a capping layer on the p-type cladding layer the capping layer being selectively etchable relative to the p-type cladding layer; forming a through film on the capping layer; forming a window structure by in implantation; removing the through film after the ion implantation; and selectively removing the capping layer using a chemical solution.
Abstract:
A method of manufacturing a semiconductor film including a setting a substrate on a satellite; and a forming an alloy semiconductor thin film containing at least two different group V elements or group IV elements on the substrate by metal organic chemical vapor deposition while supplying thermal energy to the substrate through the satellite. The satellite comprises a flat satellite body on which the substrate is placed and a perimeter fixing section which fixes the perimeter of the substrate. The perimeter fixing section contacts only part of the perimeter of the substrate, instead of the entire perimeter of the substrate.
Abstract:
In an optical semiconductor device including, at least, an n-type semiconductor layer having n-type conductivity, an active layer, a p-type semiconductor layer having p-type conductivity, current blocking layers doped with Fe are located on opposite sides of the p-type semiconductor layer. Fe and Be are simultaneously supplied as dopants when forming the p-type semiconductor layer. In this event, the flow rates of source materials supplying the respective elements are adjusted so that the p-type semiconductor layer has a hole concentration of about 1.0×1018/cm3 and an Fe concentration of about 2×1016 to 8×1016/cm3.
Abstract:
A distributed feedback laser device includes a semiconductor base having a ridge waveguide structure projecting from its principal plane. The ridge waveguide structure extends with a predetermined width from one edge of the semiconductor base to an opposite edge. A diffraction grating layer is confined within the ridge structure. The ridge waveguide structure is formed by etching using an SiO2 film and a resist film as masks so that the diffraction grating layer is produced with substantially the same width as, or a less width than, the width of the ridge waveguide structure. A &lgr;/4 shift diffraction grating or a chirped diffraction grating is preferably employed.
Abstract:
A method for manufacturing a semiconductor optical device includes forming a BDR (Band Discontinuity Reduction) layer of a first conductivity type doped with an impurity, depositing a contact layer of the first conductivity type in contact with the BDR layer after forming the the BDR layer, the contact layer being doped with the same impurity as the BDR layer and used to form an electrode, and heat treating after forming the contact layer.