公开(公告)号：US20090154104A1

公开(公告)日：2009-06-18

申请号：US12328967

申请日：2008-12-05

申请人： Yoshihiro Kondo ,  Akio Idei ,  Shigeyasu Tsubaki ,  Hitoshi Matsushima ,  Tadakatsu Nakajima ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Tatsuya Saito ,  Takeshi Kato ,  Kenji Ogiro

发明人： Yoshihiro Kondo ,  Akio Idei ,  Shigeyasu Tsubaki ,  Hitoshi Matsushima ,  Tadakatsu Nakajima ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Tatsuya Saito ,  Takeshi Kato ,  Kenji Ogiro

IPC分类号： H05K7/20

CPC分类号： H05K7/20809 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20781

摘要： It is an object to provide a cooling device for optimally cooling a semiconductor device on a CPU blade which is detachable with respect to an electronic apparatus using the cooling device with compact structure for reducing power consumption. A cooling device for cooling a semiconductor device disposed on an electronic circuit substrate in a casing of an electronic apparatus, comprising a first cooling unit comprising a first heat absorbing portion and a first heat releasing portion, and a second cooling unit comprising a second heat absorbing portion and a second heat releasing portion, wherein the first heat absorbing portion is disposed in contact with the semiconductor device, the second heat absorbing portion is detachably disposed in contact with the first heat releasing portion, a phase-change refrigerant is contained in the first cooling unit, and the second heat releasing portion is disposed outside the casing.

摘要翻译： 本发明的目的是提供一种用于最佳地冷却CPU刀片上的半导体器件的冷却装置，该刀片使用具有紧凑结构的冷却装置相对于电子设备可拆卸，以降低功耗。 一种用于冷却设置在电子设备的壳体中的电子电路基板上的半导体器件的冷却装置，包括：第一冷却单元，包括第一吸热部分和第一放热部分;第二冷却单元，包括第二吸热部分 部分和第二散热部分，其中第一吸热部分设置成与半导体器件接触，第二吸热部分可拆卸地设置成与第一散热部分接触，相变制冷剂包含在第一散热部分中 冷却单元，第二散热部设置在壳体的外部。

公开(公告)号：US07913507B2

公开(公告)日：2011-03-29

申请号：US12137659

申请日：2008-06-12

申请人： Yoshihiro Kondo ,  Tatsuya Saito ,  Takeshi Kato ,  Kenji Ogiro

发明人： Yoshihiro Kondo ,  Tatsuya Saito ,  Takeshi Kato ,  Kenji Ogiro

IPC分类号： F25D23/12

CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28D15/046 ,  F28F3/12 ,  F28F13/187 ,  H01L2924/0002 ,  H01L2924/00

摘要： An electronic equipment cooling system of the invention comprises: a heat receiver; a closed refrigerant circulation path (including: the heat receiver; a refrigerant condenser; a refrigerant pump; and a refrigerant tank); and a closed gas circulation path (including: the heat receiver; the refrigerant condenser; and a blower). The heat receiver includes: a heat receiver base contacting a heat generating component; a box; a gas flow space surrounded by the heat receiver base and box; a refrigerant inlet through which a liquid refrigerant dribbles down along an internal surface of the heat receiver base; a liquid refrigerant spreader used for spreading the liquid refrigerant thereacross and having a mesh portion with an opening for passing a vapor of the refrigerant into the gas flow space; a gas inlet through which a gas is fed from the blower; and a gas outlet for venting the gas containing the vapor of the refrigerant.

摘要翻译： 本发明的电子设备冷却系统包括：热接收器; 封闭的制冷剂循环路径（包括：受热器;制冷剂冷凝器;制冷剂泵;和制冷剂罐）; 和封闭的气体循环路径（包括：热接收器;制冷剂冷凝器;以及鼓风机）。 热接收器包括：接收发热部件的热接收器底座; 一个盒子; 由受热器底座和箱体包围的气流空间; 制冷剂入口，其中液体制冷剂沿着所述受热器基座的内表面向下运动; 用于在其间铺展液体制冷剂的液体制冷剂撒布机，并具有网孔部分，该开口用于使制冷剂的蒸汽通入气体流通空间; 气体从鼓风机供给气体的气体入口; 以及用于排出含有制冷剂的蒸气的气体的气体出口。

公开(公告)号：US07826217B2

公开(公告)日：2010-11-02

申请号：US12328967

申请日：2008-12-05

申请人： Yoshihiro Kondo ,  Akio Idei ,  Shigeyasu Tsubaki ,  Hitoshi Matsushima ,  Tadakatsu Nakajima ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Tatsuya Saito ,  Takeshi Kato ,  Kenji Ogiro

发明人： Yoshihiro Kondo ,  Akio Idei ,  Shigeyasu Tsubaki ,  Hitoshi Matsushima ,  Tadakatsu Nakajima ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Tatsuya Saito ,  Takeshi Kato ,  Kenji Ogiro

IPC分类号： H05K7/20

CPC分类号： H05K7/20809 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20781

摘要： It is an object to provide a cooling device for optimally cooling a semiconductor device on a CPU blade which is detachable with respect to an electronic apparatus using the cooling device with compact structure for reducing power consumption. A cooling device for cooling a semiconductor device disposed on an electronic circuit substrate in a casing of an electronic apparatus, comprising a first cooling unit comprising a first heat absorbing portion and a first heat releasing portion, and a second cooling unit comprising a second heat absorbing portion and a second heat releasing portion, wherein the first heat absorbing portion is disposed in contact with the semiconductor device, the second heat absorbing portion is detachably disposed in contact with the first heat releasing portion, a phase-change refrigerant is contained in the first cooling unit, and the second heat releasing portion is disposed outside the casing.

摘要翻译： 本发明的目的是提供一种用于最佳地冷却CPU刀片上的半导体器件的冷却装置，该刀片使用具有紧凑结构的冷却装置相对于电子设备可拆卸，以降低功耗。 一种用于冷却设置在电子设备的壳体中的电子电路基板上的半导体器件的冷却装置，包括：第一冷却单元，包括第一吸热部分和第一放热部分;第二冷却单元，包括第二吸热部分 部分和第二散热部分，其中第一吸热部分设置成与半导体器件接触，第二吸热部分可拆卸地设置成与第一散热部分接触，相变制冷剂包含在第一散热部分中 冷却单元，第二散热部设置在壳体的外部。

公开(公告)号：US20090000332A1

公开(公告)日：2009-01-01

申请号：US12137659

申请日：2008-06-12

申请人： Yoshihiro Kondo ,  Tatsuya Saito ,  Takeshi Kato ,  Kenji Ogiro

发明人： Yoshihiro Kondo ,  Tatsuya Saito ,  Takeshi Kato ,  Kenji Ogiro

IPC分类号： F25B39/04

CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28D15/046 ,  F28F3/12 ,  F28F13/187 ,  H01L2924/0002 ,  H01L2924/00

摘要： An electronic equipment cooling system of the invention comprises: a heat receiver; a closed refrigerant circulation path (including: the heat receiver; a refrigerant condenser; a refrigerant pump; and a refrigerant tank); and a closed gas circulation path (including: the heat receiver; the refrigerant condenser; and a blower). The heat receiver includes: a heat receiver base contacting a heat generating component; a box; a gas flow space surrounded by the heat receiver base and box; a refrigerant inlet through which a liquid refrigerant dribbles down along an internal surface of the heat receiver base; a liquid refrigerant spreader used for spreading the liquid refrigerant thereacross and having a mesh portion with an opening for passing a vapor of the refrigerant into the gas flow space; a gas inlet through which a gas is fed from the blower; and a gas outlet for venting the gas containing the vapor of the refrigerant.

摘要翻译： 本发明的电子设备冷却系统包括：热接收器; 封闭的制冷剂循环路径（包括：受热器;制冷剂冷凝器;制冷剂泵;和制冷剂罐）; 和封闭的气体循环路径（包括：热接收器;制冷剂冷凝器;以及鼓风机）。 热接收器包括：接收发热部件的热接收器底座; 一个盒子; 由受热器底座和箱体包围的气流空间; 制冷剂入口，其中液体制冷剂沿着所述受热器基座的内表面向下运动; 用于在其间铺展液体制冷剂的液体制冷剂撒布机，并具有网孔部分，该开口用于使制冷剂的蒸汽通入气体流通空间; 气体从鼓风机供给气体的气体入口; 以及用于排出含有制冷剂的蒸气的气体的气体出口。

公开(公告)号：US08650420B2

公开(公告)日：2014-02-11

申请号：US13395070

申请日：2009-09-09

申请人： Takeshi Kato ,  Tatsuya Saito ,  Jun Okitsu ,  Yoko Shiga ,  Tadakatsu Nakajima ,  Yoshihiro Kondo

发明人： Takeshi Kato ,  Tatsuya Saito ,  Jun Okitsu ,  Yoko Shiga ,  Tadakatsu Nakajima ,  Yoshihiro Kondo

IPC分类号： G06F1/26

CPC分类号： G06F1/20 ,  G06F1/3203 ,  H02J3/005 ,  H02J3/14 ,  Y02B70/3225 ,  Y04S20/222 ,  Y04S20/224

摘要： In an information processing system comprising an information processing equipment group and a facility equipment group, both an increase in performance and a reduction in power consumption are obtained, thereby achieving an efficient and flexible operational management. The plurality of information processing equipments are divided into a plurality of groups, each of which includes power feed equipments and cooling equipments. The operation management method for the information processing system includes: a procedure for acquiring, from each of the groups, operating information indicating the performances and the power consumptions of the information processing equipments, the power feed equipments, and the cooling equipments included in each of the groups; and another procedure for controlling, based on the operating information, the information processing equipments, the power feed equipments, and the cooling equipments included in each of the groups so that the performances with respect to the power consumptions become large.

摘要翻译： 在包括信息处理设备组和设备设备组的信息处理系统中，获得了性能的提高和功耗的降低，从而实现了高效且灵活的操作管理。 多个信息处理设备被分成多个组，每个组包括供电设备和冷却设备。 信息处理系统的操作管理方法包括：从各组中获取表示信息处理设备的性能和功耗的操作信息的步骤，供电设备和包括在每个 团体 以及用于基于操作信息控制包括在每个组中的信息处理设备，供电设备和冷却设备的另一过程，使得相对于功耗的性能变大。

公开(公告)号：US20120198253A1

公开(公告)日：2012-08-02

申请号：US13395070

申请日：2009-09-09

申请人： Takeshi Kato ,  Tatsuya Saito ,  Jun Okitsu ,  Yoko Shiga ,  Tadakatsu Nakajima ,  Yoshihiro Kondo

发明人： Takeshi Kato ,  Tatsuya Saito ,  Jun Okitsu ,  Yoko Shiga ,  Tadakatsu Nakajima ,  Yoshihiro Kondo

IPC分类号： G06F1/32 ,  G06F1/20 ,  G06F1/26

CPC分类号： G06F1/20 ,  G06F1/3203 ,  H02J3/005 ,  H02J3/14 ,  Y02B70/3225 ,  Y04S20/222 ,  Y04S20/224

摘要： In an information processing system comprising an information processing equipment group and a facility equipment group, both an increase in performance and a reduction in power consumption are obtained, thereby achieving an efficient and flexible operational management. The plurality of information processing equipments are divided into a plurality of groups, each of which includes power feed equipments and cooling equipments. The operation management method for the information processing system includes: a procedure for acquiring, from each of the groups, operating information indicating the performances and the power consumptions of the information processing equipments, the power feed equipments, and the cooling equipments included in each of the groups; and another procedure for controlling, based on the operating information, the information processing equipments, the power feed equipments, and the cooling equipments included in each of the groups so that the performances with respect to the power consumptions become large.

摘要翻译： 在包括信息处理设备组和设备设备组的信息处理系统中，获得了性能的提高和功耗的降低，从而实现了高效且灵活的操作管理。 多个信息处理设备被分成多个组，每个组包括供电设备和冷却设备。 信息处理系统的操作管理方法包括：从各组中获取表示信息处理设备的性能和功耗的操作信息的步骤，供电设备和包括在每个 团体 以及用于基于操作信息控制包括在每个组中的信息处理设备，供电设备和冷却设备的另一过程，使得相对于功耗的性能变大。

公开(公告)号：US20080302505A1

公开(公告)日：2008-12-11

申请号：US12155614

申请日：2008-06-06

申请人： Takeshi Kato ,  Yoshihiro Kondo ,  Tatsuya Saito ,  Naoki Hamanaka

发明人： Takeshi Kato ,  Yoshihiro Kondo ,  Tatsuya Saito ,  Naoki Hamanaka

IPC分类号： F25B29/00 ,  F28D15/00 ,  F28D15/04 ,  F28F13/06

CPC分类号： F28D15/0266 ,  B60K2001/003 ,  F25B23/006 ,  F25B25/005 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20809 ,  H01L2924/00

摘要： The evaporative cooling system comprises: evaporative cooling modules, a liquid supply system which comprises a liquid supply pump and a tube, and which supplies a refrigerant liquid to the evaporative cooling modules; an air supply system which comprises air supply tubes, and which supplies warm air to the evaporative cooling modules; an exhaust system which comprises an exhaust pump and a tube, and which exhausts air containing a refrigerant vapor from the evaporative cooling modules; a reflux system which comprises a primary heat exchanger and a reflux tube, and which condenses the refrigerant vapor to return the condensed refrigerant liquid to the liquid supply system; and a heat exhaust system which comprises a secondary heat exchanger and tubes, and which discharges heat absorbed from the primary heat exchanger.

摘要翻译： 蒸发冷却系统包括：蒸发冷却模块，包括液体供应泵和管的液体供应系统，并将冷却剂液体供应到蒸发冷却模块; 空气供应系统，其包括空气供应管，并且向蒸发冷却模块供应暖空气; 排气系统，其包括排气泵和管，并且从所述蒸发冷却模块排出含有制冷剂蒸汽的空气; 回流系统，其包括主热交换器和回流管，并且冷凝制冷剂蒸气以将冷凝的制冷剂液体返回到液体供应系统; 以及包括二次热交换器和管子并且排出从主热交换器吸收的热量的排热系统。

公开(公告)号：US20150085442A1

公开(公告)日：2015-03-26

申请号：US14394906

申请日：2012-04-19

申请人： Yoshihiro Kondo ,  Takayuki Fujimoto ,  Fumio Takeda ,  Takeshi Kato

发明人： Yoshihiro Kondo ,  Takayuki Fujimoto ,  Fumio Takeda ,  Takeshi Kato

IPC分类号： G06F1/20 ,  H05K1/02 ,  H05K7/20

CPC分类号： G06F1/20 ,  H01L23/427 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K7/2039 ,  H05K7/20809 ,  H05K2201/2072 ,  H01L2924/00

摘要： The computer having a module board with semiconductor elements mounted on both sides thereof, a motherboard on which a plurality of units of the module board are mounted, and a rack cabinet on which a plurality of units of the motherboard are mounted includes a thermo-siphon that is thermally connected to the semiconductor elements mounted on one side of the module board, a metal plate that is thermally connected to the semiconductor elements mounted on one side of the module board, a thermally-conductive member that transfers the heat of the metal plate to the thermo-siphon in a situation where the heat of the semiconductor elements mounted on one side of the module board is transferred to the metal plate, and a pressing member that presses the thermo-siphon and the metal plate against the semiconductor elements mounted on the module board.

摘要翻译： 所述计算机具有安装在其两侧的半导体元件的模块板，安装有所述模块板的多个单元的主板和安装有所述母板的多个单元的机架柜，所述主板包括热虹吸管 热连接到安装在模块板一侧上的半导体元件，与安装在模块板一侧的半导体元件热连接的金属板，传导金属板的热量的导热构件 在将安装在模块板的一侧的半导体元件的热量转移到金属板的情况下，将热虹吸管和压电元件按压在安装在金属板上的半导体元件的按压部件上 模块板。

公开(公告)号：US09348378B2

公开(公告)日：2016-05-24

申请号：US14394906

申请日：2012-04-19

申请人： Yoshihiro Kondo ,  Takayuki Fujimoto ,  Fumio Takeda ,  Takeshi Kato

发明人： Yoshihiro Kondo ,  Takayuki Fujimoto ,  Fumio Takeda ,  Takeshi Kato

IPC分类号： H05K7/20 ,  H01L23/427 ,  G06F1/20 ,  H05K1/02

CPC分类号： G06F1/20 ,  H01L23/427 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K7/2039 ,  H05K7/20809 ,  H05K2201/2072 ,  H01L2924/00

摘要： The computer having a module board with semiconductor elements mounted on both sides thereof, a motherboard on which a plurality of units of the module board are mounted, and a rack cabinet on which a plurality of units of the motherboard are mounted includes a thermo-siphon that is thermally connected to the semiconductor elements mounted on one side of the module board, a metal plate that is thermally connected to the semiconductor elements mounted on one side of the module board, a thermally-conductive member that transfers the heat of the metal plate to the thermo-siphon in a situation where the heat of the semiconductor elements mounted on one side of the module board is transferred to the metal plate, and a pressing member that presses the thermo-siphon and the metal plate against the semiconductor elements mounted on the module board.

摘要翻译： 所述计算机具有安装在其两侧的半导体元件的模块板，安装有所述模块板的多个单元的主板和安装有所述母板的多个单元的机架柜，所述主板包括热虹吸管 热连接到安装在模块板一侧上的半导体元件，与安装在模块板一侧的半导体元件热连接的金属板，传导金属板的热量的导热构件 在将安装在模块板的一侧的半导体元件的热量转移到金属板的情况下，将热虹吸管和压电元件按压在安装在金属板上的半导体元件的按压部件上 模块板。

公开(公告)号：US07839640B2

公开(公告)日：2010-11-23

申请号：US12544137

申请日：2009-08-19

申请人： Tomoo Hayashi ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Akio Idei ,  Shigeyasu Tsubaki

发明人： Tomoo Hayashi ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Akio Idei ,  Shigeyasu Tsubaki

IPC分类号： H05K7/20

CPC分类号： G06F1/185 ,  G06F1/20 ,  H05K7/20772

摘要： An electronic device comprises: a housing; blades each of which is detachable from the housing and on each of which at least CPU and a memory are mounted; first cooling devices each of that takes out heat generated in the blade outside the blade, each of said first cooling device having a heat release part in the form of an elongate column to be fixed to the blade; second cooling devices fixed to the housing to discharge heat transported from the first cooling devices outside the housing, each of said second cooling devices having a heat absorbing part, which is capable of containing the heat release part of the first cooling device; medium reservoirs each of which is put in fluid communication with a clearance, which is formed between the heat release part and the heat absorbing part when the heat release part is inserted into the heat absorbing part; a heat conducting medium stored in each of the medium reservoirs; pressurizing devices for pressurizing the heat conducting medium to supply the heat conducting medium to the clearance, and a detachable connecting part formed between the heat release part and the heat absorbing part.

摘要翻译： 电子设备包括：壳体; 叶片，其每一个都可从壳体拆卸，并且至少安装有CPU和存储器; 第一冷却装置，每个冷却装置取出在叶片外部的叶片中产生的热量，所述第一冷却装置中的每一个具有固定到叶片的细长柱形式的散热部分; 第二冷却装置固定到壳体以排出从壳体外部的第一冷却装置输送的热量，每个所述第二冷却装置具有能够容纳第一冷却装置的散热部分的吸热部分; 当散热部分插入到吸热部分中时，形成在散热部和吸热部之间的间隙流体连通的中间容器; 存储在每个介质储存器中的导热介质; 用于对导热介质加压以将导热介质供应到间隙的加压装置，以及形成在散热部分和吸热部分之间的可拆卸连接部分。