公开(公告)号：US08650420B2

公开(公告)日：2014-02-11

申请号：US13395070

申请日：2009-09-09

申请人： Takeshi Kato ,  Tatsuya Saito ,  Jun Okitsu ,  Yoko Shiga ,  Tadakatsu Nakajima ,  Yoshihiro Kondo

发明人： Takeshi Kato ,  Tatsuya Saito ,  Jun Okitsu ,  Yoko Shiga ,  Tadakatsu Nakajima ,  Yoshihiro Kondo

IPC分类号： G06F1/26

CPC分类号： G06F1/20 ,  G06F1/3203 ,  H02J3/005 ,  H02J3/14 ,  Y02B70/3225 ,  Y04S20/222 ,  Y04S20/224

摘要： In an information processing system comprising an information processing equipment group and a facility equipment group, both an increase in performance and a reduction in power consumption are obtained, thereby achieving an efficient and flexible operational management. The plurality of information processing equipments are divided into a plurality of groups, each of which includes power feed equipments and cooling equipments. The operation management method for the information processing system includes: a procedure for acquiring, from each of the groups, operating information indicating the performances and the power consumptions of the information processing equipments, the power feed equipments, and the cooling equipments included in each of the groups; and another procedure for controlling, based on the operating information, the information processing equipments, the power feed equipments, and the cooling equipments included in each of the groups so that the performances with respect to the power consumptions become large.

摘要翻译： 在包括信息处理设备组和设备设备组的信息处理系统中，获得了性能的提高和功耗的降低，从而实现了高效且灵活的操作管理。 多个信息处理设备被分成多个组，每个组包括供电设备和冷却设备。 信息处理系统的操作管理方法包括：从各组中获取表示信息处理设备的性能和功耗的操作信息的步骤，供电设备和包括在每个 团体 以及用于基于操作信息控制包括在每个组中的信息处理设备，供电设备和冷却设备的另一过程，使得相对于功耗的性能变大。

公开(公告)号：US20120198253A1

公开(公告)日：2012-08-02

申请号：US13395070

申请日：2009-09-09

申请人： Takeshi Kato ,  Tatsuya Saito ,  Jun Okitsu ,  Yoko Shiga ,  Tadakatsu Nakajima ,  Yoshihiro Kondo

发明人： Takeshi Kato ,  Tatsuya Saito ,  Jun Okitsu ,  Yoko Shiga ,  Tadakatsu Nakajima ,  Yoshihiro Kondo

IPC分类号： G06F1/32 ,  G06F1/20 ,  G06F1/26

CPC分类号： G06F1/20 ,  G06F1/3203 ,  H02J3/005 ,  H02J3/14 ,  Y02B70/3225 ,  Y04S20/222 ,  Y04S20/224

摘要： In an information processing system comprising an information processing equipment group and a facility equipment group, both an increase in performance and a reduction in power consumption are obtained, thereby achieving an efficient and flexible operational management. The plurality of information processing equipments are divided into a plurality of groups, each of which includes power feed equipments and cooling equipments. The operation management method for the information processing system includes: a procedure for acquiring, from each of the groups, operating information indicating the performances and the power consumptions of the information processing equipments, the power feed equipments, and the cooling equipments included in each of the groups; and another procedure for controlling, based on the operating information, the information processing equipments, the power feed equipments, and the cooling equipments included in each of the groups so that the performances with respect to the power consumptions become large.

摘要翻译： 在包括信息处理设备组和设备设备组的信息处理系统中，获得了性能的提高和功耗的降低，从而实现了高效且灵活的操作管理。 多个信息处理设备被分成多个组，每个组包括供电设备和冷却设备。 信息处理系统的操作管理方法包括：从各组中获取表示信息处理设备的性能和功耗的操作信息的步骤，供电设备和包括在每个 团体 以及用于基于操作信息控制包括在每个组中的信息处理设备，供电设备和冷却设备的另一过程，使得相对于功耗的性能变大。

公开(公告)号：US20090154104A1

公开(公告)日：2009-06-18

申请号：US12328967

申请日：2008-12-05

申请人： Yoshihiro Kondo ,  Akio Idei ,  Shigeyasu Tsubaki ,  Hitoshi Matsushima ,  Tadakatsu Nakajima ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Tatsuya Saito ,  Takeshi Kato ,  Kenji Ogiro

发明人： Yoshihiro Kondo ,  Akio Idei ,  Shigeyasu Tsubaki ,  Hitoshi Matsushima ,  Tadakatsu Nakajima ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Tatsuya Saito ,  Takeshi Kato ,  Kenji Ogiro

IPC分类号： H05K7/20

CPC分类号： H05K7/20809 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20781

摘要： It is an object to provide a cooling device for optimally cooling a semiconductor device on a CPU blade which is detachable with respect to an electronic apparatus using the cooling device with compact structure for reducing power consumption. A cooling device for cooling a semiconductor device disposed on an electronic circuit substrate in a casing of an electronic apparatus, comprising a first cooling unit comprising a first heat absorbing portion and a first heat releasing portion, and a second cooling unit comprising a second heat absorbing portion and a second heat releasing portion, wherein the first heat absorbing portion is disposed in contact with the semiconductor device, the second heat absorbing portion is detachably disposed in contact with the first heat releasing portion, a phase-change refrigerant is contained in the first cooling unit, and the second heat releasing portion is disposed outside the casing.

摘要翻译： 本发明的目的是提供一种用于最佳地冷却CPU刀片上的半导体器件的冷却装置，该刀片使用具有紧凑结构的冷却装置相对于电子设备可拆卸，以降低功耗。 一种用于冷却设置在电子设备的壳体中的电子电路基板上的半导体器件的冷却装置，包括：第一冷却单元，包括第一吸热部分和第一放热部分;第二冷却单元，包括第二吸热部分 部分和第二散热部分，其中第一吸热部分设置成与半导体器件接触，第二吸热部分可拆卸地设置成与第一散热部分接触，相变制冷剂包含在第一散热部分中 冷却单元，第二散热部设置在壳体的外部。

公开(公告)号：US07826217B2

公开(公告)日：2010-11-02

申请号：US12328967

申请日：2008-12-05

申请人： Yoshihiro Kondo ,  Akio Idei ,  Shigeyasu Tsubaki ,  Hitoshi Matsushima ,  Tadakatsu Nakajima ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Tatsuya Saito ,  Takeshi Kato ,  Kenji Ogiro

发明人： Yoshihiro Kondo ,  Akio Idei ,  Shigeyasu Tsubaki ,  Hitoshi Matsushima ,  Tadakatsu Nakajima ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Tatsuya Saito ,  Takeshi Kato ,  Kenji Ogiro

IPC分类号： H05K7/20

CPC分类号： H05K7/20809 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/20781

摘要： It is an object to provide a cooling device for optimally cooling a semiconductor device on a CPU blade which is detachable with respect to an electronic apparatus using the cooling device with compact structure for reducing power consumption. A cooling device for cooling a semiconductor device disposed on an electronic circuit substrate in a casing of an electronic apparatus, comprising a first cooling unit comprising a first heat absorbing portion and a first heat releasing portion, and a second cooling unit comprising a second heat absorbing portion and a second heat releasing portion, wherein the first heat absorbing portion is disposed in contact with the semiconductor device, the second heat absorbing portion is detachably disposed in contact with the first heat releasing portion, a phase-change refrigerant is contained in the first cooling unit, and the second heat releasing portion is disposed outside the casing.

摘要翻译： 本发明的目的是提供一种用于最佳地冷却CPU刀片上的半导体器件的冷却装置，该刀片使用具有紧凑结构的冷却装置相对于电子设备可拆卸，以降低功耗。 一种用于冷却设置在电子设备的壳体中的电子电路基板上的半导体器件的冷却装置，包括：第一冷却单元，包括第一吸热部分和第一放热部分;第二冷却单元，包括第二吸热部分 部分和第二散热部分，其中第一吸热部分设置成与半导体器件接触，第二吸热部分可拆卸地设置成与第一散热部分接触，相变制冷剂包含在第一散热部分中 冷却单元，第二散热部设置在壳体的外部。

公开(公告)号：US07913507B2

公开(公告)日：2011-03-29

申请号：US12137659

申请日：2008-06-12

申请人： Yoshihiro Kondo ,  Tatsuya Saito ,  Takeshi Kato ,  Kenji Ogiro

发明人： Yoshihiro Kondo ,  Tatsuya Saito ,  Takeshi Kato ,  Kenji Ogiro

IPC分类号： F25D23/12

CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28D15/046 ,  F28F3/12 ,  F28F13/187 ,  H01L2924/0002 ,  H01L2924/00

摘要： An electronic equipment cooling system of the invention comprises: a heat receiver; a closed refrigerant circulation path (including: the heat receiver; a refrigerant condenser; a refrigerant pump; and a refrigerant tank); and a closed gas circulation path (including: the heat receiver; the refrigerant condenser; and a blower). The heat receiver includes: a heat receiver base contacting a heat generating component; a box; a gas flow space surrounded by the heat receiver base and box; a refrigerant inlet through which a liquid refrigerant dribbles down along an internal surface of the heat receiver base; a liquid refrigerant spreader used for spreading the liquid refrigerant thereacross and having a mesh portion with an opening for passing a vapor of the refrigerant into the gas flow space; a gas inlet through which a gas is fed from the blower; and a gas outlet for venting the gas containing the vapor of the refrigerant.

摘要翻译： 本发明的电子设备冷却系统包括：热接收器; 封闭的制冷剂循环路径（包括：受热器;制冷剂冷凝器;制冷剂泵;和制冷剂罐）; 和封闭的气体循环路径（包括：热接收器;制冷剂冷凝器;以及鼓风机）。 热接收器包括：接收发热部件的热接收器底座; 一个盒子; 由受热器底座和箱体包围的气流空间; 制冷剂入口，其中液体制冷剂沿着所述受热器基座的内表面向下运动; 用于在其间铺展液体制冷剂的液体制冷剂撒布机，并具有网孔部分，该开口用于使制冷剂的蒸汽通入气体流通空间; 气体从鼓风机供给气体的气体入口; 以及用于排出含有制冷剂的蒸气的气体的气体出口。

公开(公告)号：US20090000332A1

公开(公告)日：2009-01-01

申请号：US12137659

申请日：2008-06-12

申请人： Yoshihiro Kondo ,  Tatsuya Saito ,  Takeshi Kato ,  Kenji Ogiro

发明人： Yoshihiro Kondo ,  Tatsuya Saito ,  Takeshi Kato ,  Kenji Ogiro

IPC分类号： F25B39/04

CPC分类号： H01L23/427 ,  F28D15/0266 ,  F28D15/046 ,  F28F3/12 ,  F28F13/187 ,  H01L2924/0002 ,  H01L2924/00

摘要： An electronic equipment cooling system of the invention comprises: a heat receiver; a closed refrigerant circulation path (including: the heat receiver; a refrigerant condenser; a refrigerant pump; and a refrigerant tank); and a closed gas circulation path (including: the heat receiver; the refrigerant condenser; and a blower). The heat receiver includes: a heat receiver base contacting a heat generating component; a box; a gas flow space surrounded by the heat receiver base and box; a refrigerant inlet through which a liquid refrigerant dribbles down along an internal surface of the heat receiver base; a liquid refrigerant spreader used for spreading the liquid refrigerant thereacross and having a mesh portion with an opening for passing a vapor of the refrigerant into the gas flow space; a gas inlet through which a gas is fed from the blower; and a gas outlet for venting the gas containing the vapor of the refrigerant.

摘要翻译： 本发明的电子设备冷却系统包括：热接收器; 封闭的制冷剂循环路径（包括：受热器;制冷剂冷凝器;制冷剂泵;和制冷剂罐）; 和封闭的气体循环路径（包括：热接收器;制冷剂冷凝器;以及鼓风机）。 热接收器包括：接收发热部件的热接收器底座; 一个盒子; 由受热器底座和箱体包围的气流空间; 制冷剂入口，其中液体制冷剂沿着所述受热器基座的内表面向下运动; 用于在其间铺展液体制冷剂的液体制冷剂撒布机，并具有网孔部分，该开口用于使制冷剂的蒸汽通入气体流通空间; 气体从鼓风机供给气体的气体入口; 以及用于排出含有制冷剂的蒸气的气体的气体出口。

公开(公告)号：US20080302505A1

公开(公告)日：2008-12-11

申请号：US12155614

申请日：2008-06-06

申请人： Takeshi Kato ,  Yoshihiro Kondo ,  Tatsuya Saito ,  Naoki Hamanaka

发明人： Takeshi Kato ,  Yoshihiro Kondo ,  Tatsuya Saito ,  Naoki Hamanaka

IPC分类号： F25B29/00 ,  F28D15/00 ,  F28D15/04 ,  F28F13/06

CPC分类号： F28D15/0266 ,  B60K2001/003 ,  F25B23/006 ,  F25B25/005 ,  H01L23/427 ,  H01L2924/0002 ,  H05K7/20809 ,  H01L2924/00

摘要： The evaporative cooling system comprises: evaporative cooling modules, a liquid supply system which comprises a liquid supply pump and a tube, and which supplies a refrigerant liquid to the evaporative cooling modules; an air supply system which comprises air supply tubes, and which supplies warm air to the evaporative cooling modules; an exhaust system which comprises an exhaust pump and a tube, and which exhausts air containing a refrigerant vapor from the evaporative cooling modules; a reflux system which comprises a primary heat exchanger and a reflux tube, and which condenses the refrigerant vapor to return the condensed refrigerant liquid to the liquid supply system; and a heat exhaust system which comprises a secondary heat exchanger and tubes, and which discharges heat absorbed from the primary heat exchanger.

摘要翻译： 蒸发冷却系统包括：蒸发冷却模块，包括液体供应泵和管的液体供应系统，并将冷却剂液体供应到蒸发冷却模块; 空气供应系统，其包括空气供应管，并且向蒸发冷却模块供应暖空气; 排气系统，其包括排气泵和管，并且从所述蒸发冷却模块排出含有制冷剂蒸汽的空气; 回流系统，其包括主热交换器和回流管，并且冷凝制冷剂蒸气以将冷凝的制冷剂液体返回到液体供应系统; 以及包括二次热交换器和管子并且排出从主热交换器吸收的热量的排热系统。

公开(公告)号：US08345425B2

公开(公告)日：2013-01-01

申请号：US12852556

申请日：2010-08-09

申请人： Hiroyuki Toyoda ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Shigeyuki Sasaki ,  Akio Idei ,  Shigemasa Satoh

发明人： Hiroyuki Toyoda ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Shigeyuki Sasaki ,  Akio Idei ,  Shigemasa Satoh

IPC分类号： H05K7/20

CPC分类号： F28D15/0266 ,  F28D1/05366 ,  F28D15/046 ,  F28F1/325 ,  F28F13/187 ,  F28F2215/12 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A cooling system for cooling a CPU 200 mounted on a printed circuit board 100 within a housing thereof, has a heat-receiving jacket 310, being thermally connected with a surface of the CPU generating heat therein, and for evaporating liquid refrigerant stored in a pressure-reduced inner space with heat generation thereof. A condenser 320 receives refrigerant vapor from the heat-receiving jacket for condensing the refrigerant vapor into a liquid by transferring the heat into an outside of the apparatus. A thermo siphon is used for circulating the refrigerant due to phase change thereof, and the condenser has fine grooves on an inner wall surface thereof along a direction of flow of the refrigerant, and is also formed flat in a cross-section thereof, for cooling the refrigerant vapor from the heat-receiving jacket on the inner wall surface thereof, efficiently.

摘要翻译： 用于冷却安装在其外壳内的印刷电路板100上的CPU 200的冷却系统具有与在其中产生热量的CPU的表面热连接的热接收套310，并且用于蒸发存储在压力中的液体制冷剂 - 减少内部空间的发热。 冷凝器320从热接收套管接收制冷剂蒸汽，用于通过将热量传递到设备的外部将制冷剂蒸汽冷凝成液体。 热虹吸由于其相变而使制冷剂循环，并且冷凝器沿着制冷剂的流动方向在其内壁表面上具有细槽，并且在其横截面上也形成为平坦的，用于冷却 来自受热套的内壁面上的制冷剂蒸气有效。

公开(公告)号：US20100073866A1

公开(公告)日：2010-03-25

申请号：US12544166

申请日：2009-08-19

申请人： Hiroyuki TOYODA ,  Akio Idei ,  Shigeyasu Tsubaki ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Tomoo Hayashi

发明人： Hiroyuki TOYODA ,  Akio Idei ,  Shigeyasu Tsubaki ,  Tadakatsu Nakajima ,  Yoshihiro Kondo ,  Tomoo Hayashi

IPC分类号： H05K7/20 ,  F28F13/00

CPC分类号： F28D15/043 ,  F28D15/046 ,  H01L2924/0002 ,  H05K7/20809 ,  H01L2924/00

摘要： A blade server including a cooling structure to be loaded with a CPU of high performance is provided. In order to enhance draining performance of a condensed working fluid which stays between fins, a vapor condensing pipe is used, in which grooves are formed in a direction substantially parallel direction with a pipe axis direction on the above described pipe inner surface, a section of a row of the above described fins is exposed on a side surface of the above described groove, the above described groove is disposed at a lower side in the vertical direction from the center line in the pipe axis direction of the vapor condensing pipe when the above described groove is installed in the above described vapor condensing pipe, and a wick with a wire space smaller than the fin space of the above described fin row is filled inside the above described groove.

摘要翻译： 提供了包括具有高性能CPU的冷却结构的刀片服务器。 为了提高滞留在翅片之间的冷凝工作流体的排水性能，使用蒸气冷凝管，在上述管内表面上沿与管轴方向大致平行的方向形成有槽， 上述散热片的一排在上述槽的侧面露出，当上述槽位于上述的蒸汽冷凝管的管轴方向的中心线时，上述槽沿垂直方向配置在下侧 将上述凹槽安装在上述蒸汽冷凝管中，并且将具有小于上述翅片排的翅片空间的线空间的芯填充在上述凹槽内。

公开(公告)号：US20100073863A1

公开(公告)日：2010-03-25

申请号：US12544153

申请日：2009-08-19

申请人： Hitoshi MATSUSHIMA ,  Tadakatsu Nakajima ,  Takayuki Atarashi ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Akio Idei ,  Shigeyasu Tsubaki ,  Takumi Sugiura ,  Yasuhiro Kashirajima

发明人： Hitoshi MATSUSHIMA ,  Tadakatsu Nakajima ,  Takayuki Atarashi ,  Yoshihiro Kondo ,  Hiroyuki Toyoda ,  Tomoo Hayashi ,  Akio Idei ,  Shigeyasu Tsubaki ,  Takumi Sugiura ,  Yasuhiro Kashirajima

IPC分类号： H05K7/20

CPC分类号： H05K7/20809 ,  H05K7/20245

摘要： An electronic apparatus, such as a blade server or the like, has a cooling system for efficiently cooling a plurality of heat generating semiconductor devices, such as a CPU, mounted on blades which is freely put on and taken off. The cooling system includes a thermosiphon which transfers heat from devices having relatively high heat generation, such as CPU or the like, to the outside of the apparatus, heat pipes which transfer heat of devices having relatively low heat generation to the thermosiphon, a thermal highway which is thermally coupled to the thermosiphon by the mounting of blades into a housing and collects and transfers the heat from the thermosiphon and the heat pipes, and a condenser which transfers the heat collected and transferred by the thermal highway outside a housing.

摘要翻译： 诸如刀片服务器等的电子设备具有冷却系统，用于有效地冷却安装在自由放置和取出的叶片上的诸如CPU的多个发热半导体器件。 冷却系统包括将来自具有较高发热量的装置（例如CPU等）的热量传递到设备外部的热虹吸管，将热发生相对低的装置的热传递到热虹吸管的热管， 其通过将叶片安装到壳体中而热耦合到热虹吸管并且收集和传递来自热虹吸管和热管的热量，以及冷凝器，其将由热力公路收集和传送的热量传送到壳体外部。