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公开(公告)号：US08513970B2
公开(公告)日：2013-08-20
申请号：US13139609
申请日：2009-12-22
IPC分类号： G01R31/02
CPC分类号： G01R31/2884 , G01R31/3012
摘要： A semiconductor device (1) includes a semiconductor wafer (11) on which a plurality of semiconductor chip forming regions (1A) is formed, a circuit section (12) which is provided within each of the semiconductor chip forming regions (1A) of the semiconductor wafer (11), a control circuit section (14), provided within each of the semiconductor chip forming regions (1A) and connected to the circuit section (12), that controls electric power supplied to the circuit section (12), a power supply line (18) connected to the plurality of control circuit section (14), and a reference power line (17) connected to the plurality of control circuit section (14). In each of the control circuit sections (14), a voltage of electric power supplied from the power supply line (18) is controlled on the basis of a reference voltage from the reference power line (17).
摘要翻译： 半导体器件（1）包括其上形成有多个半导体芯片形成区域（1A）的半导体晶片（11），设置在所述半导体芯片形成区域（1A）的每一个内的电路部分（12） 半导体晶片（11），设置在每个半导体芯片形成区域（1A）内并连接到电路部分（12））的控制电路部分（14），其控制供应到电路部分（12）的电力， 连接到多个控制电路部分（14）的电源线（18）和连接到多个控制电路部分（14）的参考电力线（17）。 在每个控制电路部分（14）中，基于来自参考电力线（17）的参考电压来控制从电源线（18）供应的电力的电压。
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公开(公告)号：US20110260747A1
公开(公告)日：2011-10-27
申请号：US13139609
申请日：2009-12-22
CPC分类号： G01R31/2884 , G01R31/3012
摘要： A semiconductor device (1) includes a semiconductor wafer (11) on which a plurality of semiconductor chip forming regions (1A) is formed, a circuit section (12) which is provided within each of the semiconductor chip forming regions (1A) of the semiconductor wafer (11), a control circuit section (14), provided within each of the semiconductor chip forming regions (1A) and connected to the circuit section (12), that controls electric power supplied to the circuit section (12), a power supply line (18) connected to the plurality of control circuit section (14), and a reference power line (17) connected to the plurality of control circuit section (14). In each of the control circuit sections (14), a voltage of electric power supplied from the power supply line (18) is controlled on the basis of a reference voltage from the reference power line (17).
摘要翻译： 半导体器件（1）包括其上形成有多个半导体芯片形成区域（1A）的半导体晶片（11），设置在所述半导体芯片形成区域（1A）的每一个内的电路部分（12） 半导体晶片（11），设置在每个半导体芯片形成区域（1A）内并连接到电路部分（12））的控制电路部分（14），其控制供应到电路部分（12）的电力， 连接到多个控制电路部分（14）的电源线（18）和连接到多个控制电路部分（14）的参考电力线（17）。 在每个控制电路部分（14）中，基于来自参考电力线（17）的参考电压来控制从电源线（18）供应的电力的电压。
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公开(公告)号：US08330254B2
公开(公告)日：2012-12-11
申请号：US12647639
申请日：2009-12-28
申请人： Masayuki Furumiya , Hiroaki Ohkubo , Fuyuki Okamoto , Masayuki Mizuno , Koichi Nose , Yoshihiro Nakagawa , Yoshio Kameda
发明人： Masayuki Furumiya , Hiroaki Ohkubo , Fuyuki Okamoto , Masayuki Mizuno , Koichi Nose , Yoshihiro Nakagawa , Yoshio Kameda
IPC分类号： H01L23/544
CPC分类号： H01L23/48 , G01R31/2884 , G01R31/3025 , G01R31/31721 , H01L22/32 , H01L23/50 , H01L23/5286 , H01L23/544 , H01L24/06 , H01L2223/5446 , H01L2924/01029
摘要： A semiconductor device includes a semiconductor wafer in which semiconductor chip forming regions and a scribe region located between the semiconductor chip forming regions are formed, a plurality of semiconductor chip circuit portions provided over the semiconductor wafer, a plurality of first conductive layers, provided in each of the semiconductor chip forming regions, which is electrically connected to each of the circuit portions, and a first connecting portion that electrically connects the first conductive layers to each other across a portion of the scribe region. An external power supply or grounding pad is connected to any one of the first conductive layer and the first connecting portion. The semiconductor device includes a communication portion, connected to the circuit portion, which performs communication with the outside by capacitive coupling or inductive coupling.
摘要翻译： 一种半导体器件包括其半导体芯片形成区域和位于半导体芯片形成区域之间的划线区域形成的半导体晶片，设置在半导体晶片上的多个半导体芯片电路部分，设置在每个半导体芯片形成区域中的多个第一导电层 电连接到每个电路部分的半导体芯片形成区域以及跨越划线区域的一部分将第一导电层彼此电连接的第一连接部分。 外部电源或接地焊盘连接到第一导电层和第一连接部分中的任一个。 半导体器件包括连接到电路部分的通信部分，其通过电容耦合或电感耦合与外部进行通信。
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公开(公告)号：US08399960B2
公开(公告)日：2013-03-19
申请号：US12920381
申请日：2009-02-20
IPC分类号： H01L27/08
CPC分类号： H01L27/0688 , H01L23/48 , H01L23/5227 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L25/0657 , H01L2224/05553 , H01L2224/48091 , H01L2224/49113 , H01L2225/06527 , H01L2924/00014 , H01L2924/14 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A plurality of semiconductor chips are juxtaposed, each having an electromagnetic induction coil disposed thereon. A signal is transmitted by way of electromagnetic induction between the electromagnetic induction coils disposed on a pair of adjacent semiconductor chips.
摘要翻译： 多个半导体芯片并置，每个具有布置在其上的电磁感应线圈。 在布置在一对相邻半导体芯片上的电磁感应线圈之间通过电磁感应传输信号。
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公开(公告)号：US20110006443A1
公开(公告)日：2011-01-13
申请号：US12920452
申请日：2009-02-19
IPC分类号： H01L23/48
CPC分类号： H01L23/645 , H01L23/5227 , H01L23/585 , H01L25/0655 , H01L25/0657 , H01L27/08 , H01L2224/16145 , H01L2225/06527 , H01L2225/06596
摘要： Disclosed is a semiconductor device composed of a plurality of semiconductor integrated circuits and a plurality of coils. During the production process of the semiconductor device, the plurality of coils are so arranged that the coil surfaces are generally perpendicular to the front surface of a chip of the semiconductor integrated circuits wherein metal films are laminated. A signal is transmitted between a pair of adjacent coils among the plurality of coils.
摘要翻译： 公开了由多个半导体集成电路和多个线圈组成的半导体器件。 在半导体器件的生产过程中，多个线圈被布置成使得线圈表面大致垂直于半导体集成电路的芯片的前表面，其中金属膜被层压。 信号在多个线圈中的一对相邻线圈之间传输。
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公开(公告)号：US20110012228A1
公开(公告)日：2011-01-20
申请号：US12920381
申请日：2009-02-20
IPC分类号： H01L29/86
CPC分类号： H01L27/0688 , H01L23/48 , H01L23/5227 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L25/0657 , H01L2224/05553 , H01L2224/48091 , H01L2224/49113 , H01L2225/06527 , H01L2924/00014 , H01L2924/14 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A plurality of semiconductor chips are juxtaposed, each having an electromagnetic induction coil disposed thereon. A signal is transmitted by way of electromagnetic induction between the electromagnetic induction coils disposed on a pair of adjacent semiconductor chips.
摘要翻译： 多个半导体芯片并置，每个具有布置在其上的电磁感应线圈。 在布置在一对相邻半导体芯片上的电磁感应线圈之间通过电磁感应传输信号。
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7.发明申请ELECTRONIC CIRCUIT, CIRCUIT APPARATUS, TEST SYSTEM, CONTROL METHOD OF THE ELECTRONIC CIRCUIT 审中-公开电子电路，电路设备，测试系统，电子电路控制方法公开(公告)号：US20120025790A1
公开(公告)日：2012-02-02
申请号：US13146806
申请日：2010-02-09
IPC分类号： G05F1/10
CPC分类号： G01R31/31721 , G05F1/607
摘要： An electronic circuit includes: a first power line capable of supplying power; a second power line capable of supplying power independently from the first power line; a main circuit connected to the second power line; a detector that detects the supply of power from the first power line or the second power line; and a controller connected to the first power line and the second power line, wherein the controller controls a voltage or a current supplied from the first power line and supplies the voltage or the current to the main circuit when the detector detects supply of power from the first power line.
摘要翻译： 电子电路包括：能够供电的第一电力线; 能够独立于所述第一电力线供电的第二电力线; 连接到第二电力线的主电路; 检测器，其检测来自所述第一电力线或所述第二电力线的电力供应; 以及连接到所述第一电力线和所述第二电力线的控制器，其中，所述控制器控制从所述第一电力线提供的电压或电流，并且当所述检测器检测到来自所述主电路的电力供应时，将电压或电流提供给所述主电路 第一条电力线。
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8.发明授权Semiconductor inspection apparatus, semiconductor wafer positioning method, and semiconductor wafer inspection method 失效半导体检查装置，半导体晶片定位方法以及半导体晶片检查方法公开(公告)号：US08570056B2
公开(公告)日：2013-10-29
申请号：US12866223
申请日：2009-02-26
CPC分类号： G01R31/2891
摘要： A semiconductor inspection apparatus comprising: a plurality of wafer stages, provided independently for each of a plurality of laminated semiconductor wafers, that directly or indirectly secure the corresponding semiconductor wafers and that possess a mechanism for positioning the corresponding semiconductor wafers; and a probe card, arranged outside or in between the plurality of laminated semiconductor wafers so as to face the semiconductor wafers, that transmits a signal or power to the plurality of semiconductor wafers.
摘要翻译： 一种半导体检查装置，包括：对于多个层叠半导体晶片中的每一个独立设置的多个晶片台，其直接或间接固定相应的半导体晶片，并且具有用于定位相应的半导体晶片的机构; 以及探针卡，其布置在多个层叠半导体晶片之间或之间，以面对半导体晶片，其向多个半导体晶片发送信号或电力。
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公开(公告)号：US08536890B2
公开(公告)日：2013-09-17
申请号：US12865201
申请日：2009-02-05
IPC分类号： G01R31/20
CPC分类号： G01R31/303 , G01R31/2889 , G01R31/3025
摘要： A semiconductor inspecting device comprises a probe card for transmitting a signal or power supply to semiconductor wafers having one or more subject chips formed therein, and is constituted such that the first semiconductor wafer faces the first face of the probe card and such that the second semiconductor wafer faces the second face of the probe card on the opposite side of the first face. The probe card includes one or more inspecting chips, which can perform non-contact transmissions with the first subject chip in the first semiconductor wafer and the second subject chip in the second semiconductor wafer.
摘要翻译： 半导体检查装置包括用于向其中形成有一个或多个对象芯片的半导体晶片发送信号或电源的探针卡，并且构成为使得第一半导体晶片面向探针卡的第一面，并且使得第二半导体 晶片面对第一面的相对侧的探针卡的第二面。 探针卡包括一个或多个检查芯片，其可以执行与第一半导体晶片中的第一对象芯片和第二半导体晶片中的第二对象芯片的非接触传输。
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公开(公告)号：US20100321054A1
公开(公告)日：2010-12-23
申请号：US12865201
申请日：2009-02-05
CPC分类号： G01R31/303 , G01R31/2889 , G01R31/3025
摘要： A semiconductor inspecting device comprises a probe card for transmitting a signal or power supply to semiconductor wafers having one or more subject chips formed therein, and is constituted such that the first semiconductor wafer faces the first face of the probe card and such that the second semiconductor wafer faces the second face of the probe card on the opposite side of the first face. The probe card includes one or more inspecting chips, which can perform non-contact transmissions with the first subject chip in the first semiconductor wafer and the second subject chip in the second semiconductor wafer.
摘要翻译： 半导体检查装置包括用于向其中形成有一个或多个对象芯片的半导体晶片发送信号或电源的探针卡，并且构成为使得第一半导体晶片面向探针卡的第一面，并且使得第二半导体 晶片面对第一面的相对侧的探针卡的第二面。 探针卡包括一个或多个检查芯片，其可以执行与第一半导体晶片中的第一对象芯片和第二半导体晶片中的第二对象芯片的非接触传输。
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