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公开(公告)号：US08830740B2
公开(公告)日：2014-09-09
申请号：US13814104
申请日：2011-08-26
申请人： Yoshitaka Sasago , Hiroyuki Minemura , Takashi Kobayashi , Toshimichi Shintani , Satoru Hanzawa , Masaharu Kinoshita
发明人： Yoshitaka Sasago , Hiroyuki Minemura , Takashi Kobayashi , Toshimichi Shintani , Satoru Hanzawa , Masaharu Kinoshita
CPC分类号： G11C13/0004 , G11C2213/71 , G11C2213/72 , G11C2213/75 , H01L27/2436 , H01L27/2463 , H01L27/2481 , H01L45/06 , H01L45/1233
摘要： The purpose of the present invention is to improve a rewriting transmission rate and reliability of a phase change memory. To attain the purpose, a plurality of phase change memory cells (SMC or USMC) which are provided in series between a word line (2) and a bit line (3) and have a selection element and a storage element that are parallel connected with each other are entirely set, and after that, a part of the cells corresponding to a data pattern is reset. Alternatively, the reverse of the operation is carried out.
摘要翻译： 本发明的目的是提高相变存储器的重写传输速率和可靠性。 为了实现该目的，在串行（2）和位线（3）之间串联提供多个相变存储单元（SMC或USMC），并且具有并联连接的选择元件和存储元件 彼此完全设置，之后，与数据模式对应的单元的一部分被重置。 或者，执行相反的操作。
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公开(公告)号：US20130141968A1
公开(公告)日：2013-06-06
申请号：US13814104
申请日：2011-08-26
申请人： Yoshitaka Sasago , Hiroyuki Minemura , Takashi Kobayashi , Toshimichi Shintani , Satoru Hanzawa , Masaharu Kinoshita
发明人： Yoshitaka Sasago , Hiroyuki Minemura , Takashi Kobayashi , Toshimichi Shintani , Satoru Hanzawa , Masaharu Kinoshita
IPC分类号： G11C13/00
CPC分类号： G11C13/0004 , G11C2213/71 , G11C2213/72 , G11C2213/75 , H01L27/2436 , H01L27/2463 , H01L27/2481 , H01L45/06 , H01L45/1233
摘要： The purpose of the present invention is to improve a rewriting transmission rate and reliability of a phase change memory. To attain the purpose, a plurality of phase change memory cells (SMC or USMC) which are provided in series between a word line (2) and a bit line (3) and have a selection element and a storage element that are parallel connected with each other are entirely set, and after that, a part of the cells corresponding to a data pattern is reset. Alternatively, the reverse of the operation is carried out.
摘要翻译： 本发明的目的是提高相变存储器的重写传输速率和可靠性。 为了实现该目的，在串行（2）和位线（3）之间串联提供多个相变存储单元（SMC或USMC），并且具有并联连接的选择元件和存储元件 彼此完全设置，之后，与数据模式对应的单元的一部分被重置。 或者，执行相反的操作。
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公开(公告)号：US08563961B2
公开(公告)日：2013-10-22
申请号：US13515435
申请日：2010-12-13
申请人： Yoshitaka Sasago , Akio Shima , Satoru Hanzawa , Takashi Kobayashi , Masaharu Kinoshita , Norikastsu Takaura
发明人： Yoshitaka Sasago , Akio Shima , Satoru Hanzawa , Takashi Kobayashi , Masaharu Kinoshita , Norikastsu Takaura
IPC分类号： H01L47/00
CPC分类号： H01L45/1666 , H01L27/224 , H01L27/2409 , H01L27/2454 , H01L27/2481 , H01L45/04 , H01L45/06 , H01L45/12 , H01L45/1206 , H01L45/1233 , H01L45/144 , H01L45/1608 , H01L45/1641 , H01L45/1675 , H01L45/1683
摘要： Disclosed are a semiconductor storage device and a method for manufacturing the semiconductor storage device, whereby the bit cost of memory using a variable resistance material is reduced. The semiconductor storage device has: a substrate; a first word line (2) which is provided above the substrate; a first laminated body, which is disposed above the first word line (2), and which has the N+1 (N≧1) number of first inter-gate insulating layers (11-15) and the N number of first semiconductor layers (21p-24p) alternately laminated in the height direction of the substrate; a first bit line (3), which extends in the direction that intersects the first word line (2), and which is disposed above the laminated body; a first gate insulating layer (9) which is provided on the side surface of the N+1 number of the first inter-gate insulating layers (11-15) and those of the N number of the first semiconductor layers (21p-24p); a first channel layer (8p) which is provided on the side surface of the first gate insulating layer (9); and a first variable resistance material layer (7) which is provided on the side surface of the first channel layer. The first variable material layer (7) is in a region where the first word line (2) and the first bit line (3) intersect each other. Furthermore, a polysilicon diode (PD) is used as a selection element.
摘要翻译： 公开了一种半导体存储装置和用于制造半导体存储装置的方法，由此降低了使用可变电阻材料的存储器的位成本。 半导体存储装置具有：基板; 设置在基板上方的第一字线（2） 第一层叠体，其设置在第一字线（2）的上方，并且具有N + 1（N> = 1）个第一栅极间绝缘层（11-15）和N个第一半导体 层（21p-24p）在基板的高度方向交替层叠; 第一位线（3），其在与所述第一字线（2）相交的方向上延伸，并且位于所述层叠体的上方; 设置在N + 1个第一栅极绝缘层（11-15）的侧表面和N个第一半导体层（21p-24p）的侧表面上的第一栅极绝缘层（9） ; 设置在第一栅极绝缘层（9）的侧面上的第一沟道层（8p）; 以及设置在第一沟道层的侧表面上的第一可变电阻材料层（7）。 第一可变材料层（7）在第一字线（2）和第一位线（3）彼此相交的区域中。 此外，使用多晶硅二极管（PD）作为选择元件。
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公开(公告)号：US20120248399A1
公开(公告)日：2012-10-04
申请号：US13515435
申请日：2010-12-13
申请人： Yoshitaka Sasago , Akio Shima , Satoru Hanzawa , Takashi Kobayashi , Masaharu Kinoshita , Norikastsu Takaura
发明人： Yoshitaka Sasago , Akio Shima , Satoru Hanzawa , Takashi Kobayashi , Masaharu Kinoshita , Norikastsu Takaura
IPC分类号： H01L27/24
CPC分类号： H01L45/1666 , H01L27/224 , H01L27/2409 , H01L27/2454 , H01L27/2481 , H01L45/04 , H01L45/06 , H01L45/12 , H01L45/1206 , H01L45/1233 , H01L45/144 , H01L45/1608 , H01L45/1641 , H01L45/1675 , H01L45/1683
摘要： Disclosed are a semiconductor storage device and a method for manufacturing the semiconductor storage device, whereby the bit cost of memory using a variable resistance material is reduced. The semiconductor storage device has: a substrate; a first word line (2) which is provided above the substrate; a first laminated body, which is disposed above the first word line (2), and which has the N+1 (N≧1) number of first inter-gate insulating layers (11-15) and the N number of first semiconductor layers (21p-24p) alternately laminated in the height direction of the substrate; a first bit line (3), which extends in the direction that intersects the first word line (2), and which is disposed above the laminated body; a first gate insulating layer (9) which is provided on the side surface of the N+1 number of the first inter-gate insulating layers (11-15) and those of the N number of the first semiconductor layers (21p-24p); a first channel layer (8p) which is provided on the side surface of the first gate insulating layer (9); and a first variable resistance material layer (7) which is provided on the side surface of the first channel layer. The first variable material layer (7) is in a region where the first word line (2) and the first bit line (3) intersect each other. Furthermore, a polysilicon diode (PD) is used as a selection element.
摘要翻译： 公开了一种半导体存储装置和用于制造半导体存储装置的方法，由此降低了使用可变电阻材料的存储器的位成本。 半导体存储装置具有：基板; 设置在基板上方的第一字线（2） 第一层叠体，其设置在第一字线（2）的上方，并且具有N + 1（N≥1）个第一栅极间绝缘层（11-15）和N个第一半导体层 （21p-24p）在基板的高度方向上交替层叠; 第一位线（3），其在与所述第一字线（2）相交的方向上延伸，并且位于所述层叠体的上方; 设置在N + 1个第一栅极绝缘层（11-15）的侧表面和N个第一半导体层（21p-24p）的侧表面上的第一栅极绝缘层（9） ; 设置在第一栅极绝缘层（9）的侧面上的第一沟道层（8p）; 以及设置在第一沟道层的侧表面上的第一可变电阻材料层（7）。 第一可变材料层（7）在第一字线（2）和第一位线（3）彼此相交的区域中。 此外，使用多晶硅二极管（PD）作为选择元件。
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公开(公告)号：US08642988B2
公开(公告)日：2014-02-04
申请号：US13588112
申请日：2012-08-17
IPC分类号： H01L29/02
CPC分类号： H01L45/144 , G11C13/0004 , G11C2213/71 , G11C2213/74 , G11C2213/75 , G11C2213/78 , H01L27/2409 , H01L27/2481 , H01L45/06
摘要： A non-volatile memory device includes: a first line extending along a main surface of a substrate; a stack provided above the first line; a second line formed above the stack; a select element provided where the first and second lines intersect, the select element adapted to pass current in a direction perpendicular to the main surface; a second insulator film provided along a side surface of the stack; a channel layer provided along the second insulator film; an adhesion layer provided along the channel layer; and a variable resistance material layer provided along the adhesion layer, wherein the first and second lines are electrically connected via the select element and channel layer, a contact resistance via the adhesion layer between the channel layer and variable resistance material layer is low, and a resistance of the adhesion layer is high with respect to an extending direction of the channel layer.
摘要翻译： 非易失性存储器件包括：沿衬底的主表面延伸的第一线; 提供在第一行之上的堆栈; 在堆叠之上形成第二线; 设置在所述第一和第二线相交的选择元件，所述选择元件适于在垂直于所述主表面的方向上传递电流; 沿着所述堆叠的侧表面设置的第二绝缘膜; 沿所述第二绝缘膜设置的沟道层; 沿着沟道层提供的粘合层; 以及沿着粘合层设置的可变电阻材料层，其中第一和第二线经由选择元件和沟道层电连接，通过沟道层和可变电阻材料层之间的粘合层的接触电阻低，并且 粘合层的电阻相对于沟道层的延伸方向高。
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公开(公告)号：US20130075684A1
公开(公告)日：2013-03-28
申请号：US13588112
申请日：2012-08-17
CPC分类号： H01L45/144 , G11C13/0004 , G11C2213/71 , G11C2213/74 , G11C2213/75 , G11C2213/78 , H01L27/2409 , H01L27/2481 , H01L45/06
摘要： A non-volatile memory device includes: a first line extending along a main surface of a substrate; a stack provided above the first line; a second line formed above the stack; a select element provided where the first and second lines intersect, the select element adapted to pass current in a direction perpendicular to the main surface; a second insulator film provided along a side surface of the stack; a channel layer provided along the second insulator film; an adhesion layer provided along the channel layer; and a variable resistance material layer provided along the adhesion layer, wherein the first and second lines are electrically connected via the select element and channel layer, a contact resistance via the adhesion layer between the channel layer and variable resistance material layer is low, and a resistance of the adhesion layer is high with respect to an extending direction of the channel layer.
摘要翻译： 非易失性存储器件包括：沿衬底的主表面延伸的第一线; 提供在第一行之上的堆栈; 在堆叠之上形成第二线; 设置在所述第一和第二线相交的选择元件，所述选择元件适于在垂直于所述主表面的方向上传递电流; 沿着所述堆叠的侧表面设置的第二绝缘膜; 沿所述第二绝缘膜设置的沟道层; 沿着沟道层提供的粘合层; 以及沿着粘合层设置的可变电阻材料层，其中第一和第二线经由选择元件和沟道层电连接，通过沟道层和可变电阻材料层之间的粘合层的接触电阻低，并且 粘合层的电阻相对于沟道层的延伸方向高。
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公开(公告)号：US08735865B2
公开(公告)日：2014-05-27
申请号：US12987109
申请日：2011-01-08
CPC分类号： H01L27/2481 , G11C13/0004 , G11C13/0069 , G11C2013/008 , G11C2213/71 , G11C2213/75 , H01L27/2409 , H01L27/2454 , H01L45/06 , H01L45/1233 , H01L45/1286 , H01L45/1293 , H01L45/144
摘要： For decreasing a recording current and suppressing a cross erase simultaneously, a three-dimensional phase-change memory for attaining higher sensitivity and higher reliability by the provision of a chalcogenide type interface layer is provided, in which an electric resistivity, a thermal conductivity, and a melting point of the material of the interface layer are selected appropriately, thereby improving the current concentration to the phase-change material and thermal and material insulation property with Si channel upon writing.
摘要翻译： 为了同时降低记录电流和抑制交叉擦除，提供了一种用于通过提供硫族化物型界面层来获得更高灵敏度和更高可靠性的三维相变存储器，其中电阻率，热导率和 适当地选择界面层的材料的熔点，从而提高相变材料的电流浓度和写入时Si通道的热和材料绝缘性能。
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公开(公告)号：US20110235408A1
公开(公告)日：2011-09-29
申请号：US12987109
申请日：2011-01-08
CPC分类号： H01L27/2481 , G11C13/0004 , G11C13/0069 , G11C2013/008 , G11C2213/71 , G11C2213/75 , H01L27/2409 , H01L27/2454 , H01L45/06 , H01L45/1233 , H01L45/1286 , H01L45/1293 , H01L45/144
摘要： For decreasing a recording current and suppressing a cross erase simultaneously, a three-dimensional phase-change memory for attaining higher sensitivity and higher reliability by the provision of a chalcogenide type interface layer is provided, in which an electric resistivity, a thermal conductivity, and a melting point of the material of the interface layer are selected appropriately, thereby improving the current concentration to the phase-change material and thermal and material insulation property with Si channel upon writing.
摘要翻译： 为了同时降低记录电流和抑制交叉擦除，提供了一种用于通过提供硫族化物型界面层来获得更高灵敏度和更高可靠性的三维相变存储器，其中电阻率，热导率和 适当地选择界面层的材料的熔点，从而提高相变材料的电流浓度和写入时Si通道的热和材料绝缘性能。
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公开(公告)号：US08132063B2
公开(公告)日：2012-03-06
申请号：US13191442
申请日：2011-07-26
申请人： Motoyasu Terao , Satoru Hanzawa , Hitoshi Kume , Minoru Ogushi , Yoshitaka Sasago , Masaharu Kinoshita , Norikatsu Takaura
发明人： Motoyasu Terao , Satoru Hanzawa , Hitoshi Kume , Minoru Ogushi , Yoshitaka Sasago , Masaharu Kinoshita , Norikatsu Takaura
IPC分类号： G11C29/00
CPC分类号： G11C13/0064 , G11C13/0004 , G11C13/004 , G11C13/0069 , G11C29/028 , G11C29/50 , G11C29/50008 , G11C2013/0054 , G11C2213/72
摘要： To realize a fast and highly reliable phase-change memory system of low power consumption, a semiconductor device includes: a memory device which includes a first memory array having a first area including a plurality of first memory cells and a second area including a plurality of second memory cells; a controller coupled to the memory device to issue a command to the memory device; and a condition table for storing a plurality of trial writing conditions. The controller performs trial writing in the plurality of second memory cells a plurality of times based on the plurality of trial writing conditions stored in the condition table, and determines writing conditions in the plurality of first memory cells based on a result of the trial writing. The memory device performs writing in the plurality of first memory cells based on the writing conditions instructed from the controller.
摘要翻译： 为了实现低功耗的快速且高度可靠的相变存储器系统，半导体器件包括：存储器件，其包括具有包括多个第一存储器单元的第一区域的第一存储器阵列和包括多个第一存储器单元的第二区域 第二存储单元; 控制器，其耦合到所述存储器设备以向所述存储器设备发出命令; 以及用于存储多个试写条件的条件表。 控制器基于存储在条件表中的多个试写条件，在多个第二存储单元中执行多次尝试写入，并且基于试写的结果来确定多个第一存储单元中的写入条件。 存储器件基于从控制器指示的写入条件在多个第一存储器单元中执行写入。
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公开(公告)号：US08427865B2
公开(公告)日：2013-04-23
申请号：US13440225
申请日：2012-04-05
申请人： Akio Shima , Yoshitaka Sasago , Masaharu Kinoshita , Toshiyuki Mine , Norikatsu Takaura , Takahiro Morikawa , Kenzo Kurotsuchi , Satoru Hanzawa
发明人： Akio Shima , Yoshitaka Sasago , Masaharu Kinoshita , Toshiyuki Mine , Norikatsu Takaura , Takahiro Morikawa , Kenzo Kurotsuchi , Satoru Hanzawa
CPC分类号： H01L27/2481 , G11C13/0004 , G11C13/003 , G11C2213/71 , G11C2213/75 , G11C2213/79 , H01L27/2454 , H01L45/06 , H01L45/1233 , H01L45/144 , H01L45/1625 , H01L45/1683
摘要： There is provided a semiconductor storage device which is capable of further reducing a size of a memory cell, and increasing a storage capacity. Plural memory cells each including a transistor formed on a semiconductor substrate, and a variable resistive device having a resistance value changed by voltage supply and connected between source and drain terminals of the transistor are arranged longitudinally and in an array to configure a three-dimensional memory cell array. A memory cell structure has a double channel structure in which an inside of a switching transistor is filled with a variable resistance element, particularly, a phase change material. The switching transistor is turned off by application of a voltage to increase a channel resistance so that a current flows in the internal phase change material to operate the memory.
摘要翻译： 提供了能够进一步减小存储单元的尺寸并增加存储容量的半导体存储装置。 每个包括形成在半导体衬底上的晶体管的多个存储单元以及具有由电压供应改变并连接在晶体管的源极和漏极端子之间的电阻值的可变电阻器件被纵向排列成阵列以构成三维存储器 单元格阵列。 存储单元结构具有双通道结构，其中开关晶体管的内部填充有可变电阻元件，特别是相变材料。 通过施加电压来切换开关晶体管，以增加沟道电阻，使得电流在内部相变材料中流动以操作存储器。
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