公开(公告)号：US06943047B2

公开(公告)日：2005-09-13

申请号：US10209146

申请日：2002-07-31

申请人： Yoshiyuki Yanagisawa ,  Toshiaki Iwafuchi ,  Masaru Minami ,  Kunihiko Hayashi

发明人： Yoshiyuki Yanagisawa ,  Toshiaki Iwafuchi ,  Masaru Minami ,  Kunihiko Hayashi

IPC分类号： H01L23/12 ,  B44C1/10 ,  G09F9/00 ,  H01L21/00 ,  H01L21/52 ,  H01L21/60 ,  H01L33/32 ,  H01L33/40 ,  H01L33/48 ,  H01L21/44

CPC分类号： B44C1/105 ,  H01L21/67132 ,  H01L24/24 ,  H01L24/82 ,  H01L2221/68354 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/24225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/7665 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/00

摘要： A device transferring method and a device arraying method are provided for readily transferring a number of devices from a first substrate to a second substrate such that the devices are enlargedly spaced from each other with a pitch larger than an array pitch of the devices arrayed on the first substrate.

摘要翻译： 提供了一种器件传送方法和器件排列方法，用于容易地将多个器件从第一衬底转移到第二衬底，使得器件彼此间隔大，间距大于排列在器件上的器件的阵列间距 第一底物。

公开(公告)号：US20050158896A1

公开(公告)日：2005-07-21

申请号：US11079815

申请日：2005-03-14

申请人： Kunihiko Hayashi ,  Yoshiyuki Yanagisawa ,  Toshiaki Iwafuchi ,  Hisashi Ohba

发明人： Kunihiko Hayashi ,  Yoshiyuki Yanagisawa ,  Toshiaki Iwafuchi ,  Hisashi Ohba

IPC分类号： B44C1/00 ,  B44C1/165 ,  H01L21/00 ,  H01L21/336 ,  H01L21/50 ,  H01L21/60 ,  H01L21/68 ,  H01L25/075

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/20 ,  H01L2221/68318 ,  H01L2221/68354 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/00

摘要： A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate. As a result, only the devices to be transferred can be done so with certainty, efficiency, and accuracy without exerting adverse effect on other parts.

公开(公告)号：US20050155699A1

公开(公告)日：2005-07-21

申请号：US11023834

申请日：2004-12-22

申请人： Kunihiko Hayashi ,  Yoshiyuki Yanagisawa ,  Toshiaki Iwafuchi ,  Hisashi Ohba

发明人： Kunihiko Hayashi ,  Yoshiyuki Yanagisawa ,  Toshiaki Iwafuchi ,  Hisashi Ohba

IPC分类号： B44C1/00 ,  B44C1/165 ,  H01L21/00 ,  H01L21/336 ,  H01L21/50 ,  H01L21/60 ,  H01L21/68 ,  H01L25/075

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/20 ,  H01L2221/68318 ,  H01L2221/68354 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/00

摘要： A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate. As a result, only the devices to be transferred can be done so with certainty, efficiency, and accuracy without exerting adverse effect on other parts.

公开(公告)号：US07205213B2

公开(公告)日：2007-04-17

申请号：US11079780

申请日：2005-03-14

申请人： Kunihiko Hayashi ,  Yoshiyuki Yanagisawa ,  Toshiaki Iwafuchi ,  Hisashi Ohba

发明人： Kunihiko Hayashi ,  Yoshiyuki Yanagisawa ,  Toshiaki Iwafuchi ,  Hisashi Ohba

IPC分类号： H01L21/201

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/20 ,  H01L2221/68318 ,  H01L2221/68354 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/00

摘要： A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate. As a result, only the devices to be transferred can be done so with certainty, efficiency, and accuracy without exerting adverse effect on other parts.

公开(公告)号：US07205212B2

公开(公告)日：2007-04-17

申请号：US11079742

申请日：2005-03-14

申请人： Kunihiko Hayashi ,  Yoshiyuki Yanagisawa ,  Toshiaki Iwafuchi ,  Hisashi Ohba

发明人： Kunihiko Hayashi ,  Yoshiyuki Yanagisawa ,  Toshiaki Iwafuchi ,  Hisashi Ohba

IPC分类号： H01L21/201

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/20 ,  H01L2221/68318 ,  H01L2221/68354 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/00

摘要： A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate. As a result, only the devices to be transferred can be done so with certainty, efficiency, and accuracy without exerting adverse effect on other parts.

公开(公告)号：US20050158895A1

公开(公告)日：2005-07-21

申请号：US11079780

申请日：2005-03-14

申请人： Kunihiko Hayashi ,  Yoshiyuki Yanagisawa ,  Toshiaki Iwafuchi ,  Hisashi Ohba

发明人： Kunihiko Hayashi ,  Yoshiyuki Yanagisawa ,  Toshiaki Iwafuchi ,  Hisashi Ohba

IPC分类号： B44C1/00 ,  B44C1/165 ,  H01L21/00 ,  H01L21/336 ,  H01L21/50 ,  H01L21/60 ,  H01L21/68 ,  H01L25/075

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/20 ,  H01L2221/68318 ,  H01L2221/68354 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/00

摘要： A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate. As a result, only the devices to be transferred can be done so with certainty, efficiency, and accuracy without exerting adverse effect on other parts.

摘要翻译： 提供了选择性地将排列在第一基板上的装置传送到预先形成有粘合树脂层的第二基板的方法。 该方法包括以下步骤：通过激光照射从第二基板的背面侧选择性地加热第二基板上的粘合树脂层，并且使粘合树脂层的选择性加热部分固化，从而将要传送的装置 到第二基板。 此时，通过激光照射从衬底的背面侧，经由器件或布线部分直接或间接地加热对应于粘合剂层的器件的部分。 粘合树脂层的加热部分选择性地显示粘合力。 然后将粘合剂层的加热部分固化，使得只有待转移的装置被选择性地转移到第二基板。 因此，只有确定性，有效性和准确性才能进行转移的设备，而不会对其他部件产生不利影响。

公开(公告)号：US07205214B2

公开(公告)日：2007-04-17

申请号：US11079815

申请日：2005-03-14

申请人： Kunihiko Hayashi ,  Yoshiyuki Yanagisawa ,  Toshiaki Iwafuchi ,  Hisashi Ohba

发明人： Kunihiko Hayashi ,  Yoshiyuki Yanagisawa ,  Toshiaki Iwafuchi ,  Hisashi Ohba

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/20 ,  H01L2221/68318 ,  H01L2221/68354 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/00

摘要： A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate. As a result, only the devices to be transferred can be done so with certainty, efficiency, and accuracy without exerting adverse effect on other parts.

摘要翻译： 提供了选择性地将排列在第一基板上的装置传送到预先形成有粘合树脂层的第二基板的方法。 该方法包括以下步骤：通过激光照射从第二基板的背面侧选择性地加热第二基板上的粘合树脂层，并且使粘合树脂层的选择性加热部分固化，从而将要传送的装置 到第二基板。 此时，通过激光照射从衬底的背面侧，经由器件或布线部分直接或间接地加热对应于粘合剂层的器件的部分。 粘合树脂层的加热部分选择性地显示粘合力。 然后将粘合剂层的加热部分固化，使得只有待转移的装置被选择性地转移到第二基板。 因此，只有确定性，有效性和准确性才能进行转移的设备，而不会对其他部件产生不利影响。

公开(公告)号：US20070048891A1

公开(公告)日：2007-03-01

申请号：US11551971

申请日：2006-10-23

申请人： Kunihiko Hayashi ,  Yoshiyuki Yanagisawa ,  Toshiaki Iwafuchi ,  Hisashi Ohba

发明人： Kunihiko Hayashi ,  Yoshiyuki Yanagisawa ,  Toshiaki Iwafuchi ,  Hisashi Ohba

IPC分类号： H01L21/00

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/20 ,  H01L2221/68318 ,  H01L2221/68354 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/00

摘要： A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate. As a result, only the devices to be transferred can be done so with certainty, efficiency, and accuracy without exerting adverse effect on other parts.

摘要翻译： 提供了选择性地将排列在第一基板上的装置传送到预先形成有粘合树脂层的第二基板的方法。 该方法包括以下步骤：通过激光照射从第二基板的背面侧选择性地加热第二基板上的粘合树脂层，并且使粘合树脂层的选择性加热部分固化，从而将要传送的装置 到第二基板。 此时，通过激光照射从衬底的背面侧，经由器件或布线部分直接或间接地加热对应于粘合剂层的器件的部分。 粘合树脂层的加热部分选择性地显示粘合力。 然后将粘合剂层的加热部分固化，使得只有待转移的装置被选择性地转移到第二基板。 因此，只有确定性，有效性和准确性才能进行转移的设备，而不会对其他部件产生不利影响。

公开(公告)号：US20050158904A1

公开(公告)日：2005-07-21

申请号：US11079742

申请日：2005-03-14

申请人： Kunihiko Hayashi ,  Yoshiyuki Yanagisawa ,  Toshiaki Iwafuchi ,  Hisashi Ohba

发明人： Kunihiko Hayashi ,  Yoshiyuki Yanagisawa ,  Toshiaki Iwafuchi ,  Hisashi Ohba

IPC分类号： B44C1/00 ,  B44C1/165 ,  H01L21/00 ,  H01L21/336 ,  H01L21/50 ,  H01L21/60 ,  H01L21/68 ,  H01L25/075

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/20 ,  H01L2221/68318 ,  H01L2221/68354 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/00

摘要： A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate. As a result, only the devices to be transferred can be done so with certainty, efficiency, and accuracy without exerting adverse effect on other parts.

公开(公告)号：US07763139B2

公开(公告)日：2010-07-27

申请号：US11551971

申请日：2006-10-23

申请人： Kunihiko Hayashi ,  Yoshiyuki Yanagisawa ,  Toshiaki Iwafuchi ,  Hisashi Ohba

发明人： Kunihiko Hayashi ,  Yoshiyuki Yanagisawa ,  Toshiaki Iwafuchi ,  Hisashi Ohba

IPC分类号： B32B38/10 ,  B32B38/18 ,  B32B37/06 ,  B32B37/08 ,  B32B37/12 ,  B32B37/14 ,  H01L21/02 ,  H01L21/82 ,  B44C1/17 ,  H01L21/822 ,  H01L21/67 ,  H01L21/98

CPC分类号： H01L21/6835 ,  H01L21/568 ,  H01L24/24 ,  H01L24/82 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/20 ,  H01L2221/68318 ,  H01L2221/68354 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/04105 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/82039 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01052 ,  H01L2924/01058 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/3025 ,  H01L2924/00

摘要： A method of selectively transferring devices arrayed on a first substrate to a second substrate on which an adhesive resin layer is previously formed is provided. The method includes steps of selectively heating the adhesive resin layer on the second substrate by laser irradiation from the back surface side of the second substrate, and curing the selectively heated portions of the adhesive resin layer, thereby adhesively bonding those to be transferred of the devices to the second substrate. At this time, portions, corresponding to the devices, of the adhesive layer are heated directly or indirectly via the devices or wiring portions by laser irradiation from the back surface side of the substrate. The heated portions of the adhesive resin layer selectively exhibit the adhesive forces. The heated portions of the adhesive layer are then cured, so that only the devices to be transferred are selectively transferred to the second substrate. As a result, only the devices to be transferred can be done so with certainty, efficiency, and accuracy without exerting adverse effect on other parts.

摘要翻译： 提供了选择性地将排列在第一基板上的装置传送到预先形成有粘合树脂层的第二基板的方法。 该方法包括以下步骤：通过激光照射从第二基板的背面侧选择性地加热第二基板上的粘合树脂层，并且使粘合树脂层的选择性加热部分固化，从而将要传送的装置 到第二基板。 此时，通过激光照射从衬底的背面侧，经由器件或布线部分直接或间接地加热对应于粘合剂层的器件的部分。 粘合树脂层的加热部分选择性地显示粘合力。 然后将粘合剂层的加热部分固化，使得只有待转移的装置被选择性地转移到第二基板。 因此，只有确定性，有效性和准确性才能进行转移的设备，而不会对其他部件产生不利影响。