公开(公告)号：US06652991B1

公开(公告)日：2003-11-25

申请号：US10267261

申请日：2002-10-09

申请人： You Wang ,  Weixing Chen

发明人： You Wang ,  Weixing Chen

IPC分类号： B32B1501

CPC分类号： C22C30/00 ,  B32B15/012 ,  B32B15/013 ,  Y10S428/926 ,  Y10S428/935 ,  Y10S428/937 ,  Y10S428/938 ,  Y10S428/94 ,  Y10T428/1275 ,  Y10T428/12757 ,  Y10T428/12931 ,  Y10T428/12937 ,  Y10T428/12944 ,  Y10T428/12951 ,  Y10T428/12958 ,  Y10T428/12979

摘要： The addition of small amounts of CeO2 and Cr to intermetallic compositions of NiAl and FeAl improves ductility, thermal stability, thermal shock resistance, and resistance to oxidation, sulphidization and carburization.

摘要翻译： 对NiAl和FeAl的金属间化合物添加少量的CeO 2和Cr可以提高延展性，热稳定性，耐热冲击性，耐氧化，硫化和渗碳。

公开(公告)号：US08586481B2

公开(公告)日：2013-11-19

申请号：US13105658

申请日：2011-05-11

申请人： You Wang ,  Wen-Chiang Tu ,  Feng Q. Liu ,  Yuchun Wang ,  Lakshmanan Karuppiah ,  William H. McClintock ,  Barry L. Chin

发明人： You Wang ,  Wen-Chiang Tu ,  Feng Q. Liu ,  Yuchun Wang ,  Lakshmanan Karuppiah ,  William H. McClintock ,  Barry L. Chin

IPC分类号： H01L21/302

CPC分类号： H01L21/3212 ,  B24B37/044 ,  C09G1/04 ,  H01L21/7684

摘要： Embodiments described herein relate to removing material from a substrate. More particularly, the embodiments described herein relate to polishing or planarizing a substrate by a chemical mechanical polishing process. In one embodiment, a method of chemical mechanical polishing (CMP) of a substrate is provided. The method comprises exposing a substrate having a conductive material layer formed thereon to a polishing solution comprising phosphoric acid, one or more chelating agents, one or more corrosion inhibitors, and one or more oxidizers, forming a passivation layer on the conductive material layer, providing relative motion between the substrate and a polishing pad and removing at least a portion of the passivation layer to expose a portion of the underlying conductive material layer, and removing a portion of the exposed conductive material layer.

摘要翻译： 本文所述的实施例涉及从衬底去除材料。 更具体地，本文所述的实施例涉及通过化学机械抛光工艺抛光或平面化基板。 在一个实施例中，提供了基板的化学机械抛光（CMP）的方法。 该方法包括将其上形成有导电材料层的基底暴露于包含磷酸，一种或多种螯合剂，一种或多种腐蚀抑制剂和一种或多种氧化剂的抛光溶液，在导电材料层上形成钝化层，提供 衬底和抛光垫之间的相对运动，并去除钝化层的至少一部分以暴露下面的导电材料层的一部分，以及去除暴露的导电材料层的一部分。

公开(公告)号：US20120064801A1

公开(公告)日：2012-03-15

申请号：US13223159

申请日：2011-08-31

申请人： Kun Xu ,  Ingemar Carlsson ,  Feng Q. Liu ,  David Maxwell Gage ,  You Wang ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Yuchun Wang ,  Pierre Fontarensky ,  Wen-Chiang Tu ,  Lakshmanan Karuppiah

发明人： Kun Xu ,  Ingemar Carlsson ,  Feng Q. Liu ,  David Maxwell Gage ,  You Wang ,  Dominic J. Benvegnu ,  Boguslaw A. Swedek ,  Yuchun Wang ,  Pierre Fontarensky ,  Wen-Chiang Tu ,  Lakshmanan Karuppiah

IPC分类号： B24B49/00

CPC分类号： B24B37/005 ,  B24B37/042 ,  B24B37/107 ,  B24B37/30 ,  B24B49/12 ,  G01B11/0683

摘要： A method of controlling polishing includes polishing a first substrate having an overlying layer on an underlying layer or layer structure. During polishing, the substrate is monitored with an in-situ monitoring system to generate a sequence of measurements. The measurements are sorted into groups, each group associated with a different zone of a plurality of zones on the substrate. For each zone, a time at which the overlying layer is cleared is determined based on the measurements from the associated group. At least one second adjusted polishing pressure for at least zone is calculated based on a pressure applied in the at least one zone during polishing the substrate, the time for the at least one zone, and the time for another zone. A second substrate is polished using the at least one adjusted polishing pressure.

摘要翻译： 控制抛光的方法包括在下层或层结构上抛光具有上层的第一衬底。 在抛光期间，用原位监测系统监测基底以产生测量序列。 测量被分组成组，每个组与衬底上的多个区域的不同区域相关联。 对于每个区域，基于来自关联组的测量来确定覆盖层被清除的时间。 基于在抛光衬底期间在至少一个区域中施加的压力，至少一个区域的时间和另一个区域的时间来计算至少一个至少一个区域的调整后的第二抛光压力。 使用至少一个调整的抛光压力来抛光第二基底。

公开(公告)号：US20110294293A1

公开(公告)日：2011-12-01

申请号：US13105658

申请日：2011-05-11

申请人： You Wang ,  Wen-Chiang Tu ,  Feng Q. Liu ,  Yuchun Wang ,  Lakshmanan Karuppiah ,  William H. Mc Clintock ,  Barry L. Chin

发明人： You Wang ,  Wen-Chiang Tu ,  Feng Q. Liu ,  Yuchun Wang ,  Lakshmanan Karuppiah ,  William H. Mc Clintock ,  Barry L. Chin

IPC分类号： H01L21/306

CPC分类号： H01L21/3212 ,  B24B37/044 ,  C09G1/04 ,  H01L21/7684

摘要： Embodiments described herein relate to removing material from a substrate. More particularly, the embodiments described herein relate to polishing or planarzing a substrate by a chemical mechanical polishing process. In one embodiment, a method of chemical mechanical polishing (CMP) of a substrate is provided. The method comprises exposing a substrate having a conductive material layer formed thereon to a polishing solution comprising phosphoric acid, one or more chelating agents, one or more corrosion inhibitors, and one or more oxidizers, forming a passivation layer on the conductive material layer, providing relative motion between the substrate and a polishing pad and removing at least a portion of the passivation layer to expose a portion of the underlying conductive material layer, and removing a portion of the exposed conductive material layer.

摘要翻译： 本文所述的实施例涉及从衬底去除材料。 更具体地，本文所述的实施例涉及通过化学机械抛光工艺抛光或平面化衬底。 在一个实施例中，提供了基板的化学机械抛光（CMP）的方法。 该方法包括将其上形成有导电材料层的基底暴露于包含磷酸，一种或多种螯合剂，一种或多种腐蚀抑制剂和一种或多种氧化剂的抛光溶液，在导电材料层上形成钝化层，提供 衬底和抛光垫之间的相对运动，并去除钝化层的至少一部分以暴露下面的导电材料层的一部分，以及去除暴露的导电材料层的一部分。

公开(公告)号：US20100121828A1

公开(公告)日：2010-05-13

申请号：US12616672

申请日：2009-11-11

申请人： You Wang

发明人： You Wang

IPC分类号： G06F17/00

CPC分类号： G06F16/188

摘要： A system and method for presenting a uniform file system interface for accessing multiple storage devices where at least one of the storage devices has some resource constraints. The system includes an intermediary device abstracting the individual storage devices and aggregating the storage available on each device into a single volume while accounting for each individual storage device's resource constraints.

摘要翻译： 一种用于呈现用于访问多个存储设备的统一文件系统接口的系统和方法，其中至少一个存储设备具有一些资源限制。 该系统包括抽象各个存储设备并将每个设备上可用的存储集合为单个卷的中间设备，同时考虑每个单独的存储设备的资源约束。

公开(公告)号：US07586968B2

公开(公告)日：2009-09-08

申请号：US11878745

申请日：2007-07-26

申请人： Minoru Niigaki ,  You Wang ,  Yujin Zheng ,  Hirofumi Kan

发明人： Minoru Niigaki ,  You Wang ,  Yujin Zheng ,  Hirofumi Kan

IPC分类号： H01S3/22

CPC分类号： H01S3/227 ,  H01S3/02 ,  H01S3/041 ,  H01S3/08054 ,  H01S3/0815 ,  H01S3/09415 ,  H01S3/1028 ,  H01S5/4062

摘要： An alkali-encapsulated cell internally having an alkali metal vapor G encapsulated is provided with first and second heaters 11, 12. The alkali-encapsulated cell 10 has first and second end faces 10a, 10b opposed to each other, and a side face 10c connecting the two end faces 10a, 10b. Each of the first and second heaters 11, 12 has a covering portion 11B, 12B and an extending portion 11C, 12C. Some portions of the alkali-encapsulated cell 10 are inserted in the covering portions 11B, 12B. On the other hand, the extending portions 11C, 12C extend in directions away from the alkali-encapsulated cell 10. The first and second heaters 11, 12 are separated from each other with a distance d0 between them in an opposing direction of the first and second end faces 10a, 10b.

摘要翻译： 在内部具有封入了碱金属蒸气G的碱封装的电池设置有第一和第二加热器11,12。碱封装的电池10具有彼此相对的第一和第二端面10a，10b，以及连接 两个端面10a，10b。 第一和第二加热器11,12中的每一个具有覆盖部分11B，12B和延伸部分11C，12C。 碱封装电池10的一部分插入到覆盖部11B，12B中。 另一方面，延伸部分11C，12C沿着远离碱封装的电池10的方向延伸。第一和第二加热器11,12彼此分开，在它们之间的距离d0在第一和第二加热器10的相反方向上 第二端面10a，10b。

公开(公告)号：US07422982B2

公开(公告)日：2008-09-09

申请号：US11483843

申请日：2006-07-07

申请人： You Wang ,  Jie Diao ,  Stan D. Tsai ,  Lakshmanan Karuppiah

发明人： You Wang ,  Jie Diao ,  Stan D. Tsai ,  Lakshmanan Karuppiah

IPC分类号： H01L21/302 ,  H01L21/461

CPC分类号： B23H5/08 ,  C25D17/10 ,  C25D17/12 ,  C25D21/12

摘要： A method and apparatus for electroprocessing a substrate is provided. In one embodiment, a method for electroprocessing a substrate includes the steps of biasing a first electrode to establish a first electroprocessing zone between the electrode and the substrate, and biasing a second electrode disposed radially inward of the first electrode with a bias that is different than the bias applied to the first electrode. In one embodiment, the first electrode is coated with an inert material and in this way the same polish rate is obtained with a lower potential level applied to the first electrode.

摘要翻译： 提供了一种用于电子处理衬底的方法和装置。 在一个实施例中，用于对衬底进行电处理的方法包括以下步骤：偏置第一电极以在电极和衬底之间建立第一电处理区，并且以不同于第一电极的偏压来偏置设置在第一电极的径向内侧的第二电极 施加到第一电极的偏压。 在一个实施例中，第一电极被涂覆有惰性材料，并且以这种方式获得相同的抛光速率，并且施加到第一电极的较低电位电平。

公开(公告)号：US20080065703A1

公开(公告)日：2008-03-13

申请号：US11710238

申请日：2007-02-22

申请人： You Wang ,  Steven Hartung ,  Dworkin Muller

发明人： You Wang ,  Steven Hartung ,  Dworkin Muller

IPC分类号： G06F17/30 ,  G06F12/00

CPC分类号： G06F1/3268 ,  G06F1/3203 ,  G06F16/172 ,  Y02D10/154

摘要： In one embodiment, a method for creating a view for a plurality of data units is provided. A portion of the plurality of data units are stored in one or more storage drives that are in a lower power mode of operation in the storage system. The method includes determining a subset of data units stored in a storage system based on one or more filter criteria. Metadata is determined that represents the subset of data units in the storage system. A view is then created from the metadata. For example, a dynamic or static view may be created. The view is then stored such that it is always accessible on an always on storage drive. The metadata may be used to provide information about the data units in the storage drives that are in a lower power mode of operation without having to power on the storage drives.

摘要翻译： 在一个实施例中，提供了一种用于创建多个数据单元的视图的方法。 多个数据单元的一部分存储在存储系统中处于较低功率操作模式的一个或多个存储驱动器中。 该方法包括基于一个或多个过滤器标准确定存储在存储系统中的数据单元的子集。 确定代表存储系统中数据单元子集的元数据。 然后从元数据创建视图。 例如，可以创建动态或静态视图。 然后存储视图，使其始终可以在始终存储驱动器上访问。 可以使用元数据来提供关于处于较低功率操作模式的存储驱动器中的数据单元的信息，而不必对存储驱动器通电。

公开(公告)号：US20070161250A1

公开(公告)日：2007-07-12

申请号：US11328958

申请日：2006-01-09

申请人： You Wang ,  Zhihong Wang ,  Renhe Jia ,  Stan Tsai ,  Yongqi Hu

发明人： You Wang ,  Zhihong Wang ,  Renhe Jia ,  Stan Tsai ,  Yongqi Hu

IPC分类号： H01L21/302 ,  H01L21/461

CPC分类号： H01L21/7684 ,  B23H5/08 ,  H01L21/32125

摘要： Aspects of the present invention include a method and an apparatus that may be utilized to reduce dishing and improve cleaning efficiency of a material layer residue (e.g., copper residual) by varying a substrate potential in a substrate processing system. For example, by utilizing multiple polishing steps and applying different voltages (e.g., while a substrate is being in a polishing station), ECMP can be used to effectively reduce dishing and it can be used to enhance copper residual cleaning as well as minimizing a possibility of arcing, which can occur at the end of the polishing process, when a substrate is moved from a polishing station.

摘要翻译： 本发明的方面包括可以通过改变衬底处理系统中的衬底电位来减少凹陷并提高材料层残留物（例如铜残留物）的清洁效率的方法和装置。 例如，通过利用多个抛光步骤和施加不同的电压（例如，当衬底处于抛光站中时），ECMP可以用于有效地减少凹陷，并且可以用于增强铜残留清洁以及最小化可能性 当抛光工位移动基板时，可能在抛光过程结束时发生电弧。

公开(公告)号：US20060249395A1

公开(公告)日：2006-11-09

申请号：US11389867

申请日：2006-03-27

申请人： You Wang ,  Junzi Zhao ,  Jie Diao ,  Renhe Jia ,  Stan Tsai ,  Lakshmanan Karuppiah ,  Robert Ewald

发明人： You Wang ,  Junzi Zhao ,  Jie Diao ,  Renhe Jia ,  Stan Tsai ,  Lakshmanan Karuppiah ,  Robert Ewald

IPC分类号： C09K13/00 ,  B23H9/00 ,  B23H3/00

CPC分类号： C09K3/1463 ,  B23H5/08

摘要： Compositions and methods for processing a substrate having a conductive material layer disposed thereon are provided. In one embodiment, a composition for processing a substrate having a conductive material layer disposed thereon is provided which composition includes an acid based electrolyte, a chelating agent, a corrosion inhibitor, a passivating polymeric material, a pH adjusting agent, a leveler a solvent, and a pH between about 3 and about 10. The composition is used in a method to form a passivation layer on the conductive material layer, abrading the passivation layer to expose a portion of the conductive material layer, applying a bias to the substrate, and removing the conductive material layer.

摘要翻译： 提供了用于处理其上设置有导电材料层的基板的组合物和方法。 在一个实施方案中，提供了一种用于处理其上设置有导电材料层的基材的组合物，其组成包括酸性电解质，螯合剂，缓蚀剂，钝化聚合物材料，pH调节剂，整理剂，溶剂， 并且pH在约3至约10之间。该组合物用于在导电材料层上形成钝化层的方法，研磨钝化层以暴露导电材料层的一部分，向衬底施加偏压，以及 去除导电材料层。