公开(公告)号：US07513062B2

公开(公告)日：2009-04-07

申请号：US11054336

申请日：2005-02-09

申请人： Younes Achkire ,  Alexander N Lerner ,  Boris Govzman ,  Boris Fishkin ,  Michael N Sugarman ,  Rashid A Mavliev ,  Haoquan Fang ,  Shijian Li ,  Guy E Shirazi ,  Jianshe Tang

发明人： Younes Achkire ,  Alexander N Lerner ,  Boris Govzman ,  Boris Fishkin ,  Michael N Sugarman ,  Rashid A Mavliev ,  Haoquan Fang ,  Shijian Li ,  Guy E Shirazi ,  Jianshe Tang

IPC分类号： F26B3/00 ,  B08B3/00

CPC分类号： H01L21/02052 ,  H01L21/67034

摘要： In a first aspect, a first method of drying a substrate is provided. The first method includes the steps of (1) lifting a substrate through an air/fluid interface at a first rate; (2) directing a drying vapor at the air/fluid interface during lifting of the substrate; and (3) while a portion of the substrate remains in the air/fluid interface, reducing a rate at which a remainder of the substrate is lifted through the air/fluid interface to a second rate. The drying vapor may form an angle of about 23° with the air/fluid interface and/or the second rate may be about 2.5 mm/sec.

摘要翻译： 在第一方面中，提供了干燥基板的第一种方法。 第一种方法包括以下步骤：（1）以第一速率提升衬底通过空气/流体界面; （2）在提升衬底期间在空气/流体界面处引导干燥蒸汽; 和（3）当衬底的一部分保留在空气/流体界面中时，降低衬底的剩余部分通过空气/流体界面提升到第二速率的速率。 干燥蒸气可以与空气/流体界面形成约23°的角度和/或第二速率可以为约2.5mm / sec。

公开(公告)号：US20090241996A1

公开(公告)日：2009-10-01

申请号：US12345642

申请日：2008-12-29

申请人： Younes Achkire ,  Alexander N. Lerner ,  Boris I. Govzman ,  Boris Fishkin ,  Michael N. Sugarman ,  Rashid A. Mavliev ,  Haoquan Fang ,  Shijian Li ,  Guy E. Shirazi ,  Jianshe Tang

发明人： Younes Achkire ,  Alexander N. Lerner ,  Boris I. Govzman ,  Boris Fishkin ,  Michael N. Sugarman ,  Rashid A. Mavliev ,  Haoquan Fang ,  Shijian Li ,  Guy E. Shirazi ,  Jianshe Tang

IPC分类号： B08B3/00

CPC分类号： H01L21/67034 ,  B08B3/10 ,  H01L21/67751 ,  H01L21/681 ,  H01L21/68764 ,  Y10S414/139

摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

摘要翻译： 在第一方面，提供一种适于处理晶片的模块。 模块包括具有一个或多个特征的处理部分，例如（1）可旋转晶片支撑件，用于从第一取向旋转输入晶片，其中晶片与负载端口对准至第二取向，其中晶片与 卸货港 （2）捕捉器，其适于在从所述处理部分卸载时与晶片被动接触和行进; （3）适于产生从其一侧到另一侧的层流空气流的封闭输出部分; （4）具有多个晶片接收器的输出部分; （5）浸没式流体喷嘴; 和/或（6）干燥气体导流板等。其它方面包括晶片处理的方法。

公开(公告)号：US20050241684A1

公开(公告)日：2005-11-03

申请号：US11179926

申请日：2005-07-12

申请人： Younes Achkire ,  Alexander Lerner ,  Boris Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavleiv ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

发明人： Younes Achkire ,  Alexander Lerner ,  Boris Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavleiv ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

IPC分类号： H01L21/304 ,  H01L21/00 ,  B08B3/00

CPC分类号： H01L21/67034 ,  B08B3/10 ,  H01L21/67751 ,  H01L21/681 ,  H01L21/68764 ,  Y10S414/139

摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

公开(公告)号：US20070295371A1

公开(公告)日：2007-12-27

申请号：US11846400

申请日：2007-08-28

申请人： Younes Achkire ,  Alexander Lerner ,  Boris Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavleiv ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

发明人： Younes Achkire ,  Alexander Lerner ,  Boris Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavleiv ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

IPC分类号： B08B1/00

CPC分类号： H01L21/67034 ,  B08B3/10 ,  H01L21/67751 ,  H01L21/681 ,  H01L21/68764 ,  Y10S414/139

摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

摘要翻译： 在第一方面，提供一种适于处理晶片的模块。 模块包括具有一个或多个特征的处理部分，例如（1）可旋转晶片支撑件，用于从第一取向旋转输入晶片，其中晶片与负载端口对准至第二取向，其中晶片与 卸货港 （2）捕捉器，其适于在从所述处理部分卸载时与晶片被动接触和行进; （3）适于产生从其一侧到另一侧的层流空气流的封闭输出部分; （4）具有多个晶片接收器的输出部分; （5）浸没式流体喷嘴; 和/或（6）干燥气体导流板等。其它方面包括晶片处理的方法。

公开(公告)号：US20060174921A1

公开(公告)日：2006-08-10

申请号：US11398058

申请日：2006-04-04

申请人： Younes Achkire ,  Alexander Lerner ,  Boris Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavleiv ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

发明人： Younes Achkire ,  Alexander Lerner ,  Boris Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavleiv ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

IPC分类号： B08B3/00

CPC分类号： H01L21/67034 ,  B08B3/10 ,  H01L21/67751 ,  H01L21/681 ,  H01L21/68764 ,  Y10S414/139

摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

公开(公告)号：US20050229426A1

公开(公告)日：2005-10-20

申请号：US11054336

申请日：2005-02-09

申请人： Younes Achkire ,  Alexander Lerner ,  Boris Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavliev ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

发明人： Younes Achkire ,  Alexander Lerner ,  Boris Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavliev ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

IPC分类号： B05D3/02 ,  F26B3/00 ,  H01L21/00 ,  H01L21/306

CPC分类号： H01L21/02052 ,  H01L21/67034

摘要： In a first aspect, a first method of drying a substrate is provided. The first method includes the steps of (1) lifting a substrate through an air/fluid interface at a first rate; (2) directing a drying vapor at the air/fluid interface during lifting of the substrate; and (3) while a portion of the substrate remains in the air/fluid interface, reducing a rate at which a remainder of the substrate is lifted through the air/fluid interface to a second rate. The drying vapor may form an angle of about 23° with the air/fluid interface and/or the second rate may be about 2.5 mm/sec.

摘要翻译： 在第一方面中，提供了干燥基板的第一种方法。 第一种方法包括以下步骤：（1）以第一速率提升衬底通过空气/流体界面; （2）在提升衬底期间在空气/流体界面处引导干燥蒸汽; 和（3）当衬底的一部分保留在空气/流体界面中时，降低衬底的剩余部分通过空气/流体界面提升到第二速率的速率。 干燥蒸气可以与空气/流体界面形成约23°的角度和/或第二速率可以为约2.5mm / sec。

公开(公告)号：US07980255B2

公开(公告)日：2011-07-19

申请号：US11846400

申请日：2007-08-28

申请人： Younes Achkire ,  Alexander Lerner ,  Boris T. Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavleiv ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

发明人： Younes Achkire ,  Alexander Lerner ,  Boris T. Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavleiv ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

IPC分类号： B08B3/04

CPC分类号： H01L21/67034 ,  B08B3/10 ,  H01L21/67751 ,  H01L21/681 ,  H01L21/68764 ,  Y10S414/139

摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluidnozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

摘要翻译： 在第一方面，提供一种适于处理晶片的模块。 模块包括具有一个或多个特征的处理部分，例如（1）可旋转晶片支撑件，用于从第一取向旋转输入晶片，其中晶片与负载端口对准至第二取向，其中晶片与 卸货港 （2）捕捉器，其适于在从所述处理部分卸载时与晶片被动接触和行进; （3）适于产生从其一侧到另一侧的层流空气流的封闭输出部分; （4）具有多个晶片接收器的输出部分; （5）浸没液体喷嘴; 和/或（6）干燥气体导流板等。其它方面包括晶片处理的方法。

公开(公告)号：US06955516B2

公开(公告)日：2005-10-18

申请号：US10286404

申请日：2002-11-01

申请人： Younes Achkire ,  Alexander Lerner ,  Boris T. Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavliev ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

发明人： Younes Achkire ,  Alexander Lerner ,  Boris T. Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavliev ,  Haoquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

IPC分类号： H01L21/304 ,  H01L21/00 ,  B65G1/133

CPC分类号： H01L21/67034 ,  B08B3/10 ,  H01L21/67751 ,  H01L21/681 ,  H01L21/68764 ,  Y10S414/139

摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

摘要翻译： 在第一方面，提供一种适于处理晶片的模块。 模块包括具有一个或多个特征的处理部分，例如（1）可旋转晶片支撑件，用于从第一取向旋转输入晶片，其中晶片与负载端口对准至第二取向，其中晶片与 卸货港 （2）捕捉器，其适于在从所述处理部分卸载时与晶片被动接触和行进; （3）适于产生从其一侧到另一侧的层流空气流的封闭输出部分; （4）具有多个晶片接收器的输出部分; （5）浸没式流体喷嘴; 和/或（6）干燥气体导流板等。其它方面包括晶片处理的方法。

公开(公告)号：US20100006124A1

公开(公告)日：2010-01-14

申请号：US12345605

申请日：2008-12-29

申请人： Younes Achkire ,  Alexander Lerner ,  Boris T. Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavleiv ,  Hoaquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

发明人： Younes Achkire ,  Alexander Lerner ,  Boris T. Govzman ,  Boris Fishkin ,  Michael Sugarman ,  Rashid Mavleiv ,  Hoaquan Fang ,  Shijian Li ,  Guy Shirazi ,  Jianshe Tang

IPC分类号： B08B5/00

CPC分类号： H01L21/67034 ,  B08B3/10 ,  H01L21/67751 ,  H01L21/681 ,  H01L21/68764 ,  Y10S414/139

摘要： In a first aspect, a module is provided that is adapted to process a wafer. The module includes a processing portion having one or more features such as (1) a rotatable wafer support for rotating an input wafer from a first orientation wherein the wafer is in line with a load port to a second orientation wherein the wafer is in line with an unload port; (2) a catcher adapted to contact and travel passively with a wafer as it is unloaded from the processing portion; (3) an enclosed output portion adapted to create a laminar air flow from one side thereof to the other; (4) an output portion having a plurality of wafer receivers; (5) submerged fluid nozzles; and/or (6) drying gas flow deflectors, etc. Other aspects include methods of wafer processing.

摘要翻译： 在第一方面，提供一种适于处理晶片的模块。 模块包括具有一个或多个特征的处理部分，例如（1）可旋转晶片支撑件，用于从第一取向旋转输入晶片，其中晶片与负载端口对准至第二取向，其中晶片与 卸货港 （2）捕捉器，其适于在从所述处理部分卸载时与晶片被动接触和行进; （3）适于产生从其一侧到另一侧的层流空气流的封闭输出部分; （4）具有多个晶片接收器的输出部分; （5）浸没式流体喷嘴; 和/或（6）干燥气体导流板等。其它方面包括晶片处理的方法。

公开(公告)号：US06345630B2

公开(公告)日：2002-02-12

申请号：US09738797

申请日：2000-12-15

申请人： Boris Fishkin ,  Jianshe Tang ,  Brian J. Brown

发明人： Boris Fishkin ,  Jianshe Tang ,  Brian J. Brown

IPC分类号： B08B310

CPC分类号： H01L21/67051 ,  H01L21/67046 ,  Y10S134/902

摘要： An inventive edge cleaning device is provided for cleaning the edge a thin disc such as a semiconductor wafer. The inventive edge cleaning device has a sonic nozzle positioned so as to direct a liquid jet at the edge surface of the thin disc. Preferably the sonic nozzle is radially spaced from the thin disc's edge so that scrubbing, spin rinsing or spin cleaning may be simultaneously performed on the major surfaces of the thin disc as the thin disc edge is cleaned by the sonic nozzle. The liquid jet may include deionized water, NH4OH, KOH, TMAH, HF, citric acid, a surfactant, or other similar cleaning solutions, and the nozzle may remain stationary as the thin disc rotates or the nozzle may scan the circumference of the thin disc to clean the entire edge of the thin disc.

摘要翻译： 提供了一种创新的边缘清洁装置，用于清洁边缘诸如半导体晶片的薄盘。 本发明的边缘清洁装置具有定位成在薄盘的边缘表面处引导液体射流的声波喷嘴。 优选地，声波喷嘴与薄盘的边缘径向间隔开，使得当由声波喷嘴清洁薄盘边缘时，可以在薄盘的主表面上同时进行洗涤，旋转漂洗或旋转清洁。 液体射流可以包括去离子水，NH 4 OH，KOH，TMAH，HF，柠檬酸，表面活性剂或其他类似的清洁溶液，并且当薄盘旋转时喷嘴可以保持静止，或者喷嘴可以扫描薄盘的圆周 以清洁薄片的整个边缘。