Semiconductor device, schottky barrier diode, electronic apparatus, and method of producing semiconductor device
    1.
    发明授权
    Semiconductor device, schottky barrier diode, electronic apparatus, and method of producing semiconductor device 有权
    半导体器件,肖特基势垒二极管,电子器件,以及半导体器件的制造方法

    公开(公告)号:US08772785B2

    公开(公告)日:2014-07-08

    申请号:US13141448

    申请日:2009-11-26

    IPC分类号: H01L29/15

    摘要: A semiconductor device includes semiconductor layers, an anode electrode, and a cathode electrode. The semiconductor layers include a composition change layer, the anode electrode is electrically connected to one of principal surfaces of the composition change layer through a formation of a Schottky junction between the anode electrode and a part of the semiconductor layers, the cathode electrode is electrically connected to the other of the principal surfaces of the composition change layer through a formation of a junction between the cathode electrode and another part of the semiconductor layers, the anode electrode and the cathode electrode are capable of applying a voltage to the composition change layer in a direction perpendicular to the principal surface.

    摘要翻译: 半导体器件包括半导体层,阳极电极和阴极电极。 半导体层包括组成变化层,阳极电极通过在阳极电极和一部分半导体层之间形成肖特基结而与组合物变化层的主表面电连接,阴极电连接 通过在阴极电极和另一部分半导体层之间形成接合而形成组合物变化层的另一个主表面,阳极电极和阴极电极能够向组合物变化层施加电压 方向垂直于主表面。

    SEMICONDUCTOR DEVICE, SCHOTTKY BARRIER DIODE, ELECTRONIC APPARATUS, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE
    2.
    发明申请
    SEMICONDUCTOR DEVICE, SCHOTTKY BARRIER DIODE, ELECTRONIC APPARATUS, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE 有权
    半导体器件,肖特基二极管二极管,电子设备和生产半导体器件的方法

    公开(公告)号:US20110297954A1

    公开(公告)日:2011-12-08

    申请号:US13141448

    申请日:2009-11-26

    IPC分类号: H01L29/20 H01L21/329

    摘要: [Problem to be Solved] Provided is a semiconductor device in which the trade-off between the pressure resistance and the on-state resistance is improved and the performance is improved.[Solution] The semiconductor device 1 of the present invention comprises semiconductor layers 20 to 23, an anode electrode 12, and a cathode electrode 13, wherein the semiconductor layers include a composition change layer 23, the anode electrode 12 is electrically connected to one of principal surfaces of the composition change layer through a formation of a Schottky junction between the anode electrode 12 and a part of the semiconductor layers, the cathode electrode 13 is electrically connected to the other of the principal surfaces of the composition change layer through a formation of a junction between the cathode electrode 13 and another part of the semiconductor layers, the anode electrode 12 and the cathode electrode 13 are capable of applying a voltage to the composition change layer 23 in a direction perpendicular to the principal surface, andthe composition change layer 23 has composition that changes from a cathode electrode 13 side toward an anode electrode 12 side in the direction perpendicular to the principal surface of the composition change layer, has a negative polarization charge that is generated due to the composition that changes, and contains a donor impurity.

    摘要翻译: [待解决的问题]提供了一种半导体器件,其中改善了耐压性和通态电阻之间的折衷,并提高了性能。 [解决方案]本发明的半导体器件1包括半导体层20至23,阳极电极12和阴极电极13,其中半导体层包括组成变化层23,阳极电极12电连接到 通过在阳极12和半导体层的一部分之间形成肖特基结,组成变化层的主表面通过形成阴极电极13而与组合物改变层的另一个主表面电连接 阴极电极13和半导体层的另一部分之间的接合点,阳极电极12和阴极电极13能够在垂直于主表面的方向上向组合物变化层23施加电压,并且组成变化层 23具有从阴极电极13侧向阳极电极12侧变化的组成 具有垂直于组成变化层的主表面的方向具有由于组成变化而产生并且包含施主杂质的负极化电荷。

    Semiconductor apparatus having reverse blocking characteristics and method of manufacturing the same
    3.
    发明授权
    Semiconductor apparatus having reverse blocking characteristics and method of manufacturing the same 失效
    具有反向阻挡特性的半导体装置及其制造方法

    公开(公告)号:US08552471B2

    公开(公告)日:2013-10-08

    申请号:US13139789

    申请日:2009-12-11

    IPC分类号: H01L29/66

    摘要: There is provided a semiconductor apparatus capable of achieving both a reverse blocking characteristic and a low on-resistance. The semiconductor apparatus includes a first semiconductor layer including a channel layer, a source electrode formed on the first semiconductor layer, a drain electrode formed at a distance from the source electrode on the first semiconductor layer, and a gate electrode formed between the source electrode and the drain electrode on the first semiconductor layer. The drain electrode includes a first drain region where reverse current between the first semiconductor layer and the first drain region is blocked, and a second drain region formed at a greater distance from the gate electrode than the first drain region, where a resistance between the first semiconductor layer and the second drain region is lower than a resistance between the first semiconductor layer and the first drain region.

    摘要翻译: 提供了能够实现反向阻挡特性和低导通电阻的半导体装置。 半导体装置包括:第一半导体层,包括沟道层,形成在第一半导体层上的源电极,在第一半导体层上与源极间隔一定距离处形成的漏电极,以及形成在源电极和 第一半导体层上的漏电极。 漏电极包括第一漏极区,其中第一半导体层和第一漏极区之间的反向电流被阻挡,以及形成在比栅极电极比第一漏极区更远的距离处的第二漏区, 半导体层和第二漏极区域比第一半导体层和第一漏极区域之间的电阻低。

    FIELD EFFECT TRANSISTOR, METHOD FOR PRODUCING THE SAME, AND ELECTRONIC DEVICE
    4.
    发明申请
    FIELD EFFECT TRANSISTOR, METHOD FOR PRODUCING THE SAME, AND ELECTRONIC DEVICE 有权
    场效应晶体管,其制造方法和电子器件

    公开(公告)号:US20130105811A1

    公开(公告)日:2013-05-02

    申请号:US13637555

    申请日:2010-12-15

    IPC分类号: H01L29/78 H01L29/66 H01L29/20

    摘要: The present invention provides a field effect transistor which can achieve both of a high threshold voltage and a low on-state resistance, a method for producing the same, and an electronic device. In the field effect transistor, each of a buffer layer 112, a channel layer 113, a barrier layer 114, and a spacer layer 115 is formed of a group-III nitride semiconductor, and each of the upper surfaces thereof is a group-III atomic plane that is perpendicular to a (0001) crystal axis. The lattice-relaxed buffer layer 112, the channel layer 113 having a compressive strain, and the barrier layer 114 having a tensile strain, and the spacer layer 115 having a compressive strain are laminated on a substrate 100 in this order. The gate insulating film 14 is arranged on the spacer layer 115. The gate electrode 15 is arranged on the gate insulating film 14. The source electrode 161 and the drain electrode 162 are electrically connected to the channel layer 113 directly or via another component.

    摘要翻译: 本发明提供了能够实现高阈值电压和低通态电阻两者的场效应晶体管,其制造方法和电子器件。 在场效应晶体管中,由III族氮化物半导体形成缓冲层112,沟道层113,势垒层114和间隔层115,其上表面分别为III族 原子平面垂直于(0001)晶轴。 栅格弛豫缓冲层112,具有压缩应变的沟道层113和具有拉伸应变的阻挡层114以及具有压缩应变的间隔层115以此顺序层压在基板100上。 栅极绝缘膜14布置在间隔层115上。栅电极15布置在栅极绝缘膜14上。源极161和漏极162直接或经由另一个部件电连接到沟道层113。

    SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME
    5.
    发明申请
    SEMICONDUCTOR APPARATUS AND METHOD OF MANUFACTURING THE SAME 失效
    半导体装置及其制造方法

    公开(公告)号:US20110260217A1

    公开(公告)日:2011-10-27

    申请号:US13139789

    申请日:2009-12-11

    IPC分类号: H01L29/778 H01L21/335

    摘要: There is provided a semiconductor apparatus capable of achieving both a reverse blocking characteristic and a low on-resistance. The semiconductor apparatus includes a first semiconductor layer including a channel layer, a source electrode formed on the first semiconductor layer, a drain electrode formed at a distance from the source electrode on the first semiconductor layer, and a gate electrode formed between the source electrode and the drain electrode on the first semiconductor layer. The drain electrode includes a first drain region where reverse current between the first semiconductor layer and the first drain region is blocked, and a second drain region formed at a greater distance from the gate electrode than the first drain region, where a resistance between the first semiconductor layer and the second drain region is lower than a resistance between the first semiconductor layer and the first drain region.

    摘要翻译: 提供了能够实现反向阻挡特性和低导通电阻的半导体装置。 半导体装置包括:第一半导体层,包括沟道层,形成在第一半导体层上的源电极,在第一半导体层上与源极间隔一定距离处形成的漏电极,以及形成在源电极和 第一半导体层上的漏电极。 漏电极包括第一漏极区,其中第一半导体层和第一漏极区之间的反向电流被阻挡,以及形成在比栅极电极比第一漏极区更远的距离处的第二漏区, 半导体层和第二漏极区域比第一半导体层和第一漏极区域之间的电阻低。

    Semiconductor device and field effect transistor
    6.
    发明授权
    Semiconductor device and field effect transistor 有权
    半导体器件和场效应晶体管

    公开(公告)号:US08981434B2

    公开(公告)日:2015-03-17

    申请号:US13393002

    申请日:2010-06-23

    摘要: Provided is a semiconductor device in which the trade-off between the withstand voltage and the on-resistance is improved and the performance is increased. A semiconductor device comprises a substrate 1, a first n-type semiconductor layer 21′, a second n-type semiconductor layer 23, a p-type semiconductor layer 24, and a third n-type semiconductor layer 25′, wherein the first n-type semiconductor layer 21′, the second n-type semiconductor layer 23, the p-type semiconductor layer 24, and the third n-type semiconductor layer 25′ are laminated at the upper side of the substrate 1 in this order. The drain electrode 13 is in ohmic-contact with the first n-type semiconductor layer 21′ and the source electrode 12 is in ohmic-contact with the third n-type semiconductor layer 25′. A gate electrode 14 is arranged so as to fill an opening portion to be filled that extends from the third n-type semiconductor layer 25′ to the second n-type semiconductor layer 23, and the gate electrode 14 is in contact with the upper surface of the second n-type semiconductor layer 23, the side surfaces of the p-type semiconductor layer 24, and the side surfaces of the third n-type semiconductor layer 25′. The second n-type semiconductor layer 23 has composition that changes from the drain electrode 13 side toward the source electrode 12 side in the direction perpendicular to the plane of the substrate 1 and contains donor impurity.

    摘要翻译: 提供一种半导体器件,其中耐压和导通电阻之间的折衷被提高并且性能提高。 半导体器件包括衬底1,第一n型半导体层21',第二n型半导体层23,p型半导体层24和第三n型半导体层25',其中第一n型半导体层 型半导体层21',第二n型半导体层23,p型半导体层24和第三n型半导体层25'依次层叠在基板1的上侧。 漏电极13与第一n型半导体层21'欧姆接触,源电极12与第三n型半导体层25'欧姆接触。 栅电极14被布置成填充从第三n型半导体层25'延伸到第二n型半导体层23的待填充的开口部分,并且栅电极14与上表面 第二n型半导体层23,p型半导体层24的侧表面和第三n型半导体层25'的侧表面。 第二n型半导体层23具有从垂直于基板1的平面的方向从漏电极13侧向源电极12侧变化的成分,并且含有施主杂质。

    Field effect transistor, method for producing the same, and electronic device
    7.
    发明授权
    Field effect transistor, method for producing the same, and electronic device 有权
    场效应晶体管,其制造方法和电子器件

    公开(公告)号:US08921894B2

    公开(公告)日:2014-12-30

    申请号:US13637555

    申请日:2010-12-15

    摘要: The present invention provides a field effect transistor which can achieve both of a high threshold voltage and a low on-state resistance, a method for producing the same, and an electronic device. In the field effect transistor, each of a buffer layer 112, a channel layer 113, a barrier layer 114, and a spacer layer 115 is formed of a group-III nitride semiconductor, and each of the upper surfaces thereof is a group-III atomic plane that is perpendicular to a (0001) crystal axis. The lattice-relaxed buffer layer 112, the channel layer 113 having a compressive strain, and the barrier layer 114 having a tensile strain, and the spacer layer 115 having a compressive strain are laminated on a substrate 100 in this order. The gate insulating film 14 is arranged on the spacer layer 115. The gate electrode 15 is arranged on the gate insulating film 14. The source electrode 161 and the drain electrode 162 are electrically connected to the channel layer 113 directly or via another component.

    摘要翻译: 本发明提供了能够实现高阈值电压和低通态电阻两者的场效应晶体管,其制造方法和电子器件。 在场效应晶体管中,由III族氮化物半导体形成缓冲层112,沟道层113,势垒层114和间隔层115,其上表面为III族 原子平面垂直于(0001)晶轴。 栅格弛豫缓冲层112,具有压缩应变的沟道层113和具有拉伸应变的阻挡层114以及具有压缩应变的间隔层115以此顺序层压在基板100上。 栅极绝缘膜14布置在间隔层115上。栅电极15布置在栅极绝缘膜14上。源极161和漏极162直接或经由另一个部件电连接到沟道层113。

    FIELD EFFECT TRANSISTOR, METHOD FOR PRODUCING THE SAME, AND ELECTRONIC DEVICE
    8.
    发明申请
    FIELD EFFECT TRANSISTOR, METHOD FOR PRODUCING THE SAME, AND ELECTRONIC DEVICE 审中-公开
    场效应晶体管,其制造方法和电子器件

    公开(公告)号:US20130099245A1

    公开(公告)日:2013-04-25

    申请号:US13637316

    申请日:2010-12-15

    摘要: The present invention provides a field effect transistor which can achieve both of a high threshold voltage and a low on-state resistance, a method for producing the same, and an electronic device. In the field effect transistor, each of a buffer layer 112, a channel layer 113, a barrier layer 114, and a spacer layer 115 is formed of a group-III nitride semiconductor, and each of the upper surfaces thereof is a group-III atomic plane that is perpendicular to a (0001) crystal axis. The lattice-relaxed buffer layer 112, the lattice-relaxed channel layer 113, and the barrier layer 114 having a tensile strain, and the spacer layer 115 are laminated on a substrate 100 in this order. The gate insulating film 14 is arranged on the spacer layer 115. The gate electrode 15 is arranged on the gate insulating film 14. The source electrode 161 and the drain electrode 162 are electrically connected to the channel layer 113 directly or via another component.

    摘要翻译: 本发明提供了能够实现高阈值电压和低通态电阻两者的场效应晶体管,其制造方法和电子器件。 在场效应晶体管中,由III族氮化物半导体形成缓冲层112,沟道层113,势垒层114和间隔层115,其上表面为III族 原子平面垂直于(0001)晶轴。 晶格弛豫缓冲层112,晶格松弛沟道层113和具有拉伸应变的势垒层114和间隔层115依次层压在基板100上。 栅极绝缘膜14布置在间隔层115上。栅电极15布置在栅极绝缘膜14上。源极161和漏极162直接或经由另一个部件电连接到沟道层113。

    SEMICONDUCTOR DEVICE AND FIELD EFFECT TRANSISTOR
    9.
    发明申请
    SEMICONDUCTOR DEVICE AND FIELD EFFECT TRANSISTOR 有权
    半导体器件和场效应晶体管

    公开(公告)号:US20120199889A1

    公开(公告)日:2012-08-09

    申请号:US13393002

    申请日:2010-06-23

    IPC分类号: H01L29/78

    摘要: Provided is a semiconductor device in which the trade-off between the withstand voltage and the on-resistance is improved and the performance is increased.A semiconductor device comprises a substrate 1, a first n-type semiconductor layer 21′, a second n-type semiconductor layer 23, a p-type semiconductor layer 24, and a third n-type semiconductor layer 25′, wherein the first n-type semiconductor layer 21′, the second n-type semiconductor layer 23, the p-type semiconductor layer 24, and the third n-type semiconductor layer 25′ are laminated at the upper side of the substrate 1 in this order. The drain electrode 13 is in ohmic-contact with the first n-type semiconductor layer 21′ and the source electrode 12 is in ohmic-contact with the third n-type semiconductor layer 25′. A gate electrode 14 is arranged so as to fill an opening portion to be filled that extends from the third n-type semiconductor layer 25′ to the second n-type semiconductor layer 23, and the gate electrode 14 is in contact with the upper surface of the second n-type semiconductor layer 23, the side surfaces of the p-type semiconductor layer 24, and the side surfaces of the third n-type semiconductor layer 25′. The second n-type semiconductor layer 23 has composition that changes from the drain electrode 13 side toward the source electrode 12 side in the direction perpendicular to the plane of the substrate 1 and contains donor impurity.

    摘要翻译: 提供一种半导体器件,其中耐压和导通电阻之间的折衷被提高并且性能提高。 半导体器件包括衬底1,第一n型半导体层21',第二n型半导体层23,p型半导体层24和第三n型半导体层25',其中第一n型半导体层 型半导体层21',第二n型半导体层23,p型半导体层24和第三n型半导体层25'依次层叠在基板1的上侧。 漏电极13与第一n型半导体层21'欧姆接触,源电极12与第三n型半导体层25'欧姆接触。 栅电极14被布置成填充从第三n型半导体层25'延伸到第二n型半导体层23的待填充的开口部分,并且栅电极14与上表面 第二n型半导体层23,p型半导体层24的侧表面和第三n型半导体层25'的侧表面。 第二n型半导体层23具有从垂直于基板1的平面的方向从漏电极13侧向源电极12侧变化的成分,并且含有施主杂质。

    SEMICONDUCTOR DEVICE
    10.
    发明申请
    SEMICONDUCTOR DEVICE 有权
    半导体器件

    公开(公告)号:US20140084300A1

    公开(公告)日:2014-03-27

    申请号:US14117763

    申请日:2012-05-15

    IPC分类号: H01L29/778 H01L29/20

    摘要: A field effect transistor includes a substrate and a semiconductor layer provided on the substrate, wherein the semiconductor layer includes a lower barrier layer provided on the substrate, Ga-face grown, lattice relaxed, and having a composition In1-zAlzN (0≦z≦1), a channel layer having a composition of: AlxGa1-xN (0≦x≦1) or InyGa1-yN (0≦y≦1). Or GaN provided on and lattice-matched to the lower barrier layer, a source electrode and a drain electrode having ohmic contact to an upper part of the semiconductor layers, disposed spaced to each other, and a gate electrode arranged via a gate insulating film in a region lying between the source electrode and the drain electrode.

    摘要翻译: 场效应晶体管包括衬底和设置在衬底上的半导体层,其中半导体层包括设置在衬底上的下阻挡层,生长Ga面,晶格弛豫并具有组成In 1-z Al z N(0&nl; z&nl E; 1),具有以下组成的沟道层:Al x Ga 1-x N(0& nlE; x≦̸ 1)或In y Ga 1-y N(0≦̸ y≦̸ 1)。 或提供在栅极绝缘膜上并与栅极绝缘膜配置的栅电极,栅极配置在栅极绝缘膜上,栅电极配置在栅极绝缘膜上, 位于源电极和漏电极之间的区域。