Field effect transistor
    1.
    发明授权
    Field effect transistor 有权
    场效应晶体管

    公开(公告)号:US08072002B2

    公开(公告)日:2011-12-06

    申请号:US12382941

    申请日:2009-03-26

    IPC分类号: H01L29/66

    摘要: A field effect transistor formed of a semiconductor of a III group nitride compound, includes an electron running layer formed on a substrate and formed of GaN; an electron supplying layer formed on the electron running layer and formed of AlxGa1-xN (0.01≦x≦0.4), the electron supplying layer having a band gap energy different from that of the electron running layer and being separated with a recess region having a depth reaching the electron running layer; a source electrode and a drain electrode formed on the electron supplying layer with the recess region in between; a gate insulating film layer formed on the electron supplying layer for covering a surface of the electron running layer in the recess region; and a gate electrode formed on the gate insulating film layer in the recess region. The electron supplying layer has a layer thickness between 5.5 nm and 40 nm.

    摘要翻译: 由III族氮化物化合物的半导体形成的场效应晶体管包括形成在衬底上并由GaN形成的电子运行层; 电子供给层,形成在电子运行层上,由Al x Ga 1-x N(0.01≦̸ x≦̸ 0.4)形成,电子供给层的带隙能量与电子运行层的能隙不同,并且与具有 达到电子运行层的深度; 形成在电子供给层上的源电极和漏电极,其间具有凹陷区域; 在所述电子供给层上形成的用于覆盖所述凹部的电子运行层的表面的栅极绝缘膜层; 以及形成在所述凹部区域中的所述栅极绝缘膜层上的栅电极。 电子供给层的层厚在5.5nm至40nm之间。

    Field effect transistor
    4.
    发明申请
    Field effect transistor 有权
    场效应晶体管

    公开(公告)号:US20090242938A1

    公开(公告)日:2009-10-01

    申请号:US12382941

    申请日:2009-03-26

    IPC分类号: H01L29/778

    摘要: A field effect transistor formed of a semiconductor of a III group nitride compound, includes an electron running layer formed on a substrate and formed of GaN; an electron supplying layer formed on the electron running layer and formed of AlxGal-xN (0.01≦x≦0.4), the electron supplying layer having a band gap energy different from that of the electron running layer and being separated with a recess region having a depth reaching the electron running layer; a source electrode and a drain electrode formed on the electron supplying layer with the recess region in between; a gate insulating film layer formed on the electron supplying layer for covering a surface of the electron running layer in the recess region; and a gate electrode formed on the gate insulating film layer in the recess region. The electron supplying layer has a layer thickness between 5.5 nm and 40 nm.

    摘要翻译: 由III族氮化物化合物的半导体形成的场效应晶体管包括形成在衬底上并由GaN形成的电子运行层; 形成在电子运行层上并由Al x Ga 1-x N(0.01 <= x <= 0.4)形成的电子供给层,电子供给层具有与电子运行层的能隙不同的带隙能量,并且与凹陷区域分离 具有深度到达电子运行层的深度; 形成在电子供给层上的源电极和漏电极,其间具有凹陷区域; 在所述电子供给层上形成的用于覆盖所述凹部的电子运行层的表面的栅极绝缘膜层; 以及形成在所述凹部区域中的所述栅极绝缘膜层上的栅电极。 电子供给层的层厚在5.5nm至40nm之间。

    GaN based semiconductor element
    5.
    发明申请
    GaN based semiconductor element 有权
    GaN基半导体元件

    公开(公告)号:US20090278172A1

    公开(公告)日:2009-11-12

    申请号:US12382010

    申请日:2009-03-05

    IPC分类号: H01L29/205

    摘要: The field effect transistor includes a laminated structure in which a buffer layer, and an electron transporting layer (undoped GaN layer), and an electron supplying layer (undoped AlGaN layer) are laminated in sequence on a sapphire substrate. An npn laminated structure is formed on a source region of the electron supplying layer, and a source electrode is formed on the npn laminated structure. A drain electrode is formed in a drain region of the electron supplying layer, and an insulating film is formed in an opening region formed in the gate region. When a forward voltage greater than a threshold is applied to the gate electrode, an inversion layer is formed and the drain current flows. By changing a thickness and an impurity concentration of the p-type GaN layer, the threshold voltage can be controlled. The electrical field concentration between the gate electrode and the drain electrode is relaxed due to the drift layer, and voltage resistance improves.

    摘要翻译: 场效应晶体管包括其中缓冲层和电子传输层(未掺杂的GaN层)和电子供应层(未掺杂的AlGaN层)依次叠置在蓝宝石衬底上的叠层结构。 在电子供给层的源极区域上形成npn层叠结构,在npn层叠结构上形成源电极。 在电子供给层的漏极区域中形成漏电极,并且在形成在栅极区域的开口区域中形成绝缘膜。 当向栅电极施加大于阈值的正向电压时,形成反型层,漏极电流流动。 通过改变p型GaN层的厚度和杂质浓度,可以控制阈值电压。 由于漂移层,栅极电极和漏电极之间的电场浓度被松弛,并且耐电压提高。

    GaN based semiconductor element
    10.
    发明授权
    GaN based semiconductor element 有权
    GaN基半导体元件

    公开(公告)号:US07812371B2

    公开(公告)日:2010-10-12

    申请号:US12382010

    申请日:2009-03-05

    IPC分类号: H01L31/072

    摘要: The field effect transistor includes a laminated structure in which a buffer layer, and an electron transporting layer (undoped GaN layer), and an electron supplying layer (undoped AlGaN layer) are laminated in sequence on a sapphire substrate. An npn laminated structure is formed on a source region of the electron supplying layer, and a source electrode is formed on the npn laminated structure. A drain electrode is formed in a drain region of the electron supplying layer, and an insulating film is formed in an opening region formed in the gate region. When a forward voltage greater than a threshold is applied to the gate electrode, an inversion layer is formed and the drain current flows. By changing a thickness and an impurity concentration of the p-type GaN layer, the threshold voltage can be controlled. The electrical field concentration between the gate electrode and the drain electrode is relaxed due to the drift layer, and voltage resistance improves.

    摘要翻译: 场效应晶体管包括其中缓冲层和电子传输层(未掺杂的GaN层)和电子供体层(未掺杂的AlGaN层)依次层叠在蓝宝石衬底上的叠层结构。 在电子供给层的源极区域上形成npn层叠结构,在npn层叠结构上形成源电极。 在电子供给层的漏极区域中形成漏电极,并且在形成在栅极区域的开口区域中形成绝缘膜。 当向栅电极施加大于阈值的正向电压时,形成反型层,漏极电流流动。 通过改变p型GaN层的厚度和杂质浓度,可以控制阈值电压。 由于漂移层,栅极电极和漏电极之间的电场浓度被松弛,并且耐电压提高。