公开(公告)号：US20080136017A1

公开(公告)日：2008-06-12

申请号：US11950625

申请日：2007-12-05

申请人： Yukihiro KOZAKA ,  Yoshifumi NAKAMURA ,  Michinari TETANI

发明人： Yukihiro KOZAKA ,  Yoshifumi NAKAMURA ,  Michinari TETANI

IPC分类号： H01L23/373 ,  H01L21/00

CPC分类号： H01L23/49572 ,  G02F1/13452 ,  H01L23/367 ,  H01L23/4006 ,  H01L24/12 ,  H01L24/50 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05655 ,  H01L2224/13144 ,  H01L2224/13155 ,  H01L2224/16 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/75 ,  H01L2224/75301 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/81805 ,  H01L2224/81894 ,  H01L2224/81895 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A semiconductor device of the present invention includes: a wiring board 4 in which a conductive wiring 6 is formed on an insulating substrate 5 having an opening 5a; a semiconductor element 2 that has a circuit forming region 2a and an electrode pad 3, and is mounted on the wiring board with the circuit forming region facing the opening, the electrode pad being connected electrically to the conductive wiring via a protruding electrode 3a; a sealing resin 7 that covers the connected portion between the electrode pad and the conductive wiring; a heat dissipating member 9 that is disposed so as to have a portion facing the opening; and a filling material 8 that has a heat conductivity higher than that of the sealing resin, and is filled into the opening, so as to be in contact with the circuit forming region of the semiconductor element and the heat dissipating member. Even when the wiring board has a small area, heat dissipation efficiency can be ensured, and low cost manufacture can be achieved.

摘要翻译： 本发明的半导体装置包括：布线基板4，在具有开口部5a的绝缘基板5上形成导电布线6; 具有电路形成区域2a和电极焊盘3的半导体元件2，并且安装在布线板上，电路形成区域面向开口，电极焊盘通过突出电极3a与导电布线电连接 ; 覆盖电极焊盘和导电布线之间的连接部分的密封树脂7; 散热构件9，其布置成具有面向开口的部分; 以及填充材料8，其具有比密封树脂的热导率高的热导率，并且填充到开口中，以便与半导体元件的电路形成区域和散热构件接触。 即使布线板面积小，也能够确保散热效率，能够实现低成本的制造。

公开(公告)号：US20070108627A1

公开(公告)日：2007-05-17

申请号：US11553766

申请日：2006-10-27

申请人： Yukihiro KOZAKA ,  Toshiyuki FUKUDA ,  Nozomi SHIMOISHIZAKA ,  Kazuhiko MATSUMURA

发明人： Yukihiro KOZAKA ,  Toshiyuki FUKUDA ,  Nozomi SHIMOISHIZAKA ,  Kazuhiko MATSUMURA

IPC分类号： H01L23/48

CPC分类号： H01L24/10 ,  H01L21/563 ,  H01L23/49811 ,  H01L23/4985 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05567 ,  H01L2224/05573 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13144 ,  H01L2224/13344 ,  H01L2224/13347 ,  H01L2224/13355 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/81895 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/00 ,  H01L2224/05599

摘要： A semiconductor device includes a wiring board having a plurality of conductive wires aligned on an insulating base material and a board bump with a plated metal formed on each conductive wire so as to cover an upper surface and both sides of the conductive wire; and a semiconductor chip mounted on the wiring board, with electrodes of the semiconductor chip being connected to the conductive wires via the board bumps. Chip bumps are formed on the electrodes of the semiconductor chip. The electrodes of the semiconductor chip are connected to the conductive wires via a bond between the chip bumps and the board bumps. Protruding portions are formed by part of the plated metal of the board bumps at the bonded portion peeling off and protruding outwardly from a bonding surface of the chip bumps and the board bumps. Mechanical damage to the semiconductor chip caused by ultrasonic vibrations applied during process of mounting the semiconductor chip.

摘要翻译： 一种半导体器件包括布线板，其具有在绝缘基材上排列的多根导线和形成在每根导线上的电镀金属的板凸起，以覆盖导线的上表面和两侧; 以及安装在所述布线板上的半导体芯片，其中所述半导体芯片的电极经由所述板凸块连接到所述导线。 在半导体芯片的电极上形成芯片凸块。 半导体芯片的电极通过芯片凸块和板凸块之间的接合连接到导线。 在接合部分剥离并从芯片凸块的接合表面和板凸起向外突出的部分，由电路板凸块的电镀金属的一部分形成突出部分。 在半导体芯片的安装过程中由超声波振动引起的对半导体芯片的机械损伤。

公开(公告)号：US20070182009A1

公开(公告)日：2007-08-09

申请号：US11620883

申请日：2007-01-08

申请人： Yukihiro KOZAKA ,  Nozomi SHIMOISHIZAKA ,  Toshiyuki FUKUDA

发明人： Yukihiro KOZAKA ,  Nozomi SHIMOISHIZAKA ,  Toshiyuki FUKUDA

IPC分类号： H01L23/48 ,  H01L21/44

CPC分类号： H01L21/563 ,  H01L23/49811 ,  H01L23/4985 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2224/83192 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/111 ,  H05K3/243 ,  H05K2201/098 ,  H05K2201/0989 ,  H05K2201/10674 ,  H01L2224/05599

摘要： A wiring board includes a film base, a plurality of conductive wirings aligned on the film base, and protrusion electrodes formed of a plated metal in the vicinity of end portions of the conductive wirings, respectively. An outer surface at both side portions of the protrusion electrodes in cross section in a width direction of the conductive wirings defines a curve, and the protrusion electrodes in cross section in a longitudinal direction of the conductive wirings define a rectangular shape. The conductive wirings include a first conductive wiring having a wiring width of W1 and a second conductive wiring having a wiring width of W2 larger than W1, and the protrusion electrode on the first conductive wiring and the protrusion electrode on the second conductive wiring have a substantially same height. The wiring board is capable of supporting conductive wirings with a practically enough strength to withstand a stress applied during the connection between the protrusion electrodes of the film base and electrode pads of a semiconductor element, providing sufficient connection stability and coping with a narrow pitch of the semiconductor element.

摘要翻译： 布线基板分别包括膜基底，在基底上排列的多个导电布线，以及在导电配线的端部附近由电镀金属形成的突出电极。 在导电配线的宽度方向上的突起电极的两侧的两侧部的外表面形成曲线，导电配线的纵向截面的突起电极形成矩形。 导电布线包括布线宽度为W 1的第一导电布线和布线宽度为W 2大于W 1的第二导电布线，第一导电布线上的突起电极和第二导线上的突起电极 具有基本相同的高度。 布线板能够以足够的强度支撑导电布线，以承受在薄膜基底的突起电极和半导体元件的电极焊盘之间的连接期间施加的应力，提供足够的连接稳定性并且应对窄的间距 半导体元件。

公开(公告)号：US20120018861A1

公开(公告)日：2012-01-26

申请号：US13190042

申请日：2011-07-25

申请人： Yukihiro KOZAKA ,  Hiroyuki Imamura

发明人： Yukihiro KOZAKA ,  Hiroyuki Imamura

IPC分类号： H01L23/495

CPC分类号： H01L23/49572 ,  H01L23/36 ,  H01L23/4006 ,  H01L24/50 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2924/00

摘要： A tape carrier substrate includes: a tape carrier base 1; a first terminal section 2A including a plurality of first terminals 2a arranged with one another in a first direction W; a second terminal section 2B including a plurality of second terminals 2b; and first and second conductive wires 3a and 3b. A plurality of slits 7 arranged with one another in the first direction are provided in the tape carrier base. An interval between one of the plurality of slits placed at one end in the first direction and a corresponding end of the tape carrier base in the first direction and an interval between another one of the plurality of slits placed at the other end in the first direction and a corresponding end of the tape carrier base in the first direction are greater than an interval between adjacent ones of the plurality of slits.

摘要翻译： 带载基板包括：载带基座1; 包括在第一方向W上彼此配置的多个第一端子2a的第一端子部分2A; 包括多个第二端子2b的第二端子部分2B; 以及第一和第二导线3a和3b。 在带状基座上设置有沿第一方向彼此配置的多个狭缝7。 在第一方向上的一端放置的多个狭缝中的一个与第一方向上的带载体的相应端部之间的间隔和在第一方向上位于另一端的另一个狭缝之间的间隔 并且所述带载基座在所述第一方向上的对应端部大于所述多个狭缝中的相邻端部之间的间隔。