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    Inductive heating device
    3.
    发明授权
    Inductive heating device 有权
    感应加热装置

    公开(公告)号：US08957354B2

    公开(公告)日：2015-02-17

    申请号：US13123339

    申请日：2009-05-13

    申请人： Atsushi Fujita ,  Makoto Imai ,  Hideki Sadakata ,  Yuta Miura ,  Shinichiro Sumiyoshi

    发明人： Atsushi Fujita ,  Makoto Imai ,  Hideki Sadakata ,  Yuta Miura ,  Shinichiro Sumiyoshi

    IPC分类号： H05B6/04 ,  H05B6/06

    CPC分类号： H05B6/062 ,  H05B2213/05

    摘要： Disclosed is an inductive heating device which can lower losses in the device and readily provide cooling, wherein a controller is operated in a first control mode which controls the operation so that a unipolar first switching element and a unipolar second switching element conduct alternately when one of a bipolar third switching element and a bipolar fourth switching element is conducting and the other is disconnected when an aluminum object to be heated is heated, and in a second control mode in which the conduction of the first switching element and the fourth switching element and the conduction of the second switching element and the third switching element alternate when an iron object to be heated is heated.

    摘要翻译： 公开了一种感应加热装置，其可以降低装置中的损耗并容易地提供冷却，其中控制器以控制操作的第一控制模式操作，使得当单极第一开关元件和单极第二开关元件之一 当加热的铝物体被加热时，双极性第三开关元件和双极性第四开关元件导通，另一个断开，并且在第一控制模式中，第一开关元件和第四开关元件以及 当被加热的铁物体被加热时，第二开关元件和第三开关元件的导通交替。

    SEMICONDUCTOR MODULE
    5.
    发明申请
    SEMICONDUCTOR MODULE 审中-公开
    半导体模块

    公开(公告)号：US20140151872A1

    公开(公告)日：2014-06-05

    申请号：US14095592

    申请日：2013-12-03

    申请人： Takaoki Ogawa ,  Makoto Imai ,  Shizuyasu Matsubayashi

    发明人： Takaoki Ogawa ,  Makoto Imai ,  Shizuyasu Matsubayashi

    IPC分类号： H01L23/40

    CPC分类号： H01L23/4006 ,  H01L25/074 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A semiconductor module includes semiconductor device, at least one cooler, at least one fastening member. The semiconductor device has a flat shape. The at least one cooler is arranged adjacent to the semiconductor device. The at least one fastening member has a pressure-contact part that is configured to apply a pressure to the at least one cooler. Furthermore, the at least one fastening member fastens a layered body including the semiconductor device and the at least one cooler in a layer direction of the layered body. A dent configured to accommodate the pressure-contact part is provided in the at least one cooler.

    摘要翻译： 半导体模块包括半导体器件，至少一个冷却器，至少一个紧固构件。 半导体器件具有扁平形状。 至少一个冷却器被布置成与半导体器件相邻。 所述至少一个紧固构件具有被配置为向所述至少一个冷却器施加压力的压力接触部分。 此外，至少一个紧固构件在层叠体的层方向上紧固包括半导体装置和至少一个冷却器的层叠体。 构造成容纳压力接触部分的凹陷设置在至少一个冷却器中。

    Power module
    6.
    发明授权
    Power module 有权
    电源模块

    公开(公告)号：US08254133B2

    公开(公告)日：2012-08-28

    申请号：US12663813

    申请日：2008-06-12

    申请人： Makoto Imai

    发明人： Makoto Imai

    IPC分类号： H05K1/14

    CPC分类号： H01L25/072 ,  H01L23/04 ,  H01L23/473 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/48091 ,  H01L2224/48108 ,  H01L2224/48157 ,  H01L2224/48464 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    摘要： Provided is a power module capable of welding a snubber capacitor without causing melting damage to a resin housing by welding heat. When leads of a snubber capacitor are respectively welded to upper surfaces of the specific portions of a P-pole bus bar and an N-pole bus bar, the welding heat generated at the specific portions of the P-pole bus bar and the N-pole bus bar is respectively radiated from openings, through which the lower surfaces of the specific portions of the P-pole bus bar and the N-pole bus bar are exposed. As a result, the snubber capacitor can be later appended by welding without causing melting damage to the resin housing due to the welding heat. During welding, a separate cooling head is inserted into the openings to forcibly cool the lower surfaces of the specific portions of the P-pole bus bar and the N-pole bus bar respectively, so that the melting damage to a resin housing can be more reliably avoided.

    摘要翻译： 提供了能够焊接缓冲电容器而不会通过焊接热而对树脂壳体造成熔融损伤的电力模块。 当缓冲电容器的引线分别焊接在P极母线和N极母线的特定部分的上表面时，在P极母线和N极母线的特定部分产生的焊接热， 极母线从开口分别辐射，P极母线和N极母线的特定部分的下表面露出。 结果，缓冲电容器可以随后通过焊接而附加，而不会由于焊接热而对树脂壳体造成熔融损坏。 在焊接过程中，将一个单独的冷却头插入开口，以分别强制地冷却P极汇流条和N极汇流条的特定部分的下表面，使得对树脂外壳的熔化损伤可以更多 可靠地避免。

    IMAGE PICKUP APPARATUS, MANUFACTURING METHOD THEREOF, AND MOBILE TERMINAL
    8.
    发明申请
    IMAGE PICKUP APPARATUS, MANUFACTURING METHOD THEREOF, AND MOBILE TERMINAL 审中-公开
    图像拾取装置，其制造方法和移动终端

    公开(公告)号：US20100025792A1

    公开(公告)日：2010-02-04

    申请号：US12521092

    申请日：2008-01-09

    申请人： Kiyohiko Yamada ,  Makoto Imai ,  Hiroshi Nishizawa

    发明人： Kiyohiko Yamada ,  Makoto Imai ,  Hiroshi Nishizawa

    IPC分类号： H01L31/0232 ,  H01L21/50

    CPC分类号： G02B27/0006 ,  G02B13/001 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2924/0002 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H01L2924/00

    摘要： Degradation of a picked-up image quality occurs because of entry or a move of dust in the internal space of an image pickup apparatus. An image pickup apparatus for decreasing degradation of the image quality by capturing dust is provided. An image pickup apparatus 18 having a lens block 19 containing a lens 2, a semiconductor image pickup device 4 mounted on one face of a board 1, and a translucent member 5 mounted on an opposite face is characterized in that it has a gap 24 to allow a solution 23 with an adhesive dissolved to penetrate outside an optically effective range outside the space surrounded by the semiconductor image pickup device 4, the translucent member 5, and the board 1.

    摘要翻译： 由于图像拾取装置的内部空间中的灰尘的进入或移动而发生拾取图像质量的降低。 提供一种用于通过捕获灰尘来降低图像质量劣化的图像拾取装置。 具有透镜块19的摄像装置18，安装在基板1的一面上的半导体图像拾取装置4和安装在相对的面上的透光部件5的特征在于，具有间隙24〜 允许具有溶解的粘合剂的溶液23渗透到由半导体图像拾取装置4，半透明构件5和板1包围的空间外部的光学有效范围之外。

    Invasion Detection Device
    9.
    发明申请
    Invasion Detection Device 审中-公开
    入侵检测装置

    公开(公告)号：US20080061969A1

    公开(公告)日：2008-03-13

    申请号：US11572814

    申请日：2005-08-04

    申请人： Takaaki Okude ,  Hiroyuki Ogino ,  Hirofumi Inui ,  Naofumi Nakatani ,  Makoto Imai ,  Ryuta Kondou ,  Noriyuki Yoneno

    发明人： Takaaki Okude ,  Hiroyuki Ogino ,  Hirofumi Inui ,  Naofumi Nakatani ,  Makoto Imai ,  Ryuta Kondou ,  Noriyuki Yoneno

    IPC分类号： G08B13/00

    CPC分类号： G08B13/126 ,  G08B13/10 ,  G08B13/122

    摘要： To provide an intrusion detection device that can be easily mounted, has less influence of rain or snow, has a weather resistance, and can cope with various shapes. In the intrusion detection device of the present invention, pressure sensitive means (14) that is a flexible cable-like piezoelectric sensor is stored in a packet (13) in a sealed state, and mounted on a wall-like structure (11) such as a veranda, a balcony or a fence for the domicile. Since the packet is slidable, the pressure sensitive means is sufficiently deformed when the wall-like structure (11) is pressed, so that the sensor can make the detection reliably.

    摘要翻译： 为了提供易于安装的入侵检测装置，具有较小的雨或雪的影响，具有耐候性，并且可以应付各种形状。 在本发明的入侵检测装置中，作为柔性线状压电传感器的压敏装置（14）以密封状态存储在包装盒（13）中，并安装在壁状结构（11）上， 作为阳台，阳台或住所的围栏。 由于分组是可滑动的，所以当按压壁状结构（11）时，压敏装置充分变形，使得传感器能够可靠地进行检测。

    SEMICONDUCTOR DEVICE
    10.
    发明申请
    SEMICONDUCTOR DEVICE 审中-公开
    半导体器件

    公开(公告)号：US20150295489A1

    公开(公告)日：2015-10-15

    申请号：US14443532

    申请日：2012-12-25

    申请人： Makoto IMAI

    发明人： Makoto Imai

    IPC分类号： H02M1/32 ,  H02M3/337 ,  H01L23/528 ,  H01L27/06 ,  H01L23/525

    CPC分类号： H02M1/32 ,  H01L23/5256 ,  H01L23/528 ,  H01L27/0629 ,  H02M3/158 ,  H02M3/337 ,  H02M2001/325

    摘要： A semiconductor device presented herein includes a first wiring including a first end and a second end configured to receive a voltage lower than a voltage of the first end. The semiconductor device includes a second wiring including a third end connected to the first end, and a fourth end connected to the second end. The semiconductor device includes a switching element set on the first wiring, a capacitor set on the second wiring, and a fuse portion set on the second wiring and positioned on a third end side of the capacitor. The semiconductor device includes a potential sensing portion connected to the second wiring between the fuse portion and the capacitor and configured to sense a potential of a connection point thereof.

    摘要翻译： 本文提出的半导体器件包括第一布线，其包括第一端和被配置为接收低于第一端的电压的电压的第二端。 半导体器件包括第二布线，其包括连接到第一端的第三端和连接到第二端的第四端。 半导体器件包括设置在第一布线上的开关元件，设置在第二布线上的电容器和设置在第二布线上且位于电容器的第三端侧的熔丝部分。 半导体器件包括电位检测部分，其连接到熔丝部分和电容器之间的第二布线，并被配置为感测其连接点的电位。