摘要:
A tape carrier package may include an interposer having a first surface and a second surface. The first surface of the interposer may be attached to an exposed active surface of a semiconductor chip. A heat sink may be attached to the second surface of the interposer.
摘要:
A tape carrier package may include an interposer having a first surface and a second surface. The first surface of the interposer may be attached to an exposed active surface of a semiconductor chip. A heat sink may be attached to the second surface of the interposer.
摘要:
A semiconductor package includes a semiconductor chip, a circuit board at which a wire pattern is formed, and a metal structure including a portion inserted through an opening of the circuit board and upon which the semiconductor chip rests. With the semiconductor chip in direct contact with the metal structure, thermal characteristics improve. With the circuit board supported by the metal structure, mechanical stability improves.
摘要:
A semiconductor package includes a semiconductor chip, a circuit board at which a wire pattern is formed, and a metal structure including a portion inserted through an opening of the circuit board and upon which the semiconductor chip rests. With the semiconductor chip in direct contact with the metal structure, thermal characteristics improve. With the circuit board supported by the metal structure, mechanical stability improves.
摘要:
A test handler is provided, which comprises a test tray, at least one opening unit, and a position changing apparatus. The test tray aligns a plurality of inserts on its side. Each insert loads at least one semiconductor device thereon. The opening unit opens inserts at one part of the one side of the test tray. The position changing apparatus moves at least one opening unit in such a way that the at least one opening units can be located at another part of the one side of the test tray, such that the at least one opening units can open inserts at said another part of the one side of the test tray. The present invention can reduce the number of replaced parts according to change in the semiconductor device size, production cost, and part replacement time.
摘要:
Provided are a cooker and a method for controlling the same. Levels driven by a plurality of heat sources are controlled by input driving levels of all the heat sources received by an input unit. Accordingly, there is an advantage in that foods are more swiftly cooked by the plurality of heat sources.
摘要:
An opener and a buffer table for a test handler are disclosed. The opener includes an opening plate, a plurality of pin blocks forming pairs, and at least one or more interval retaining apparatus for retaining an interval between the pin blocks forming a pair. Each of the pin blocks is movably coupled to the opening plate, and includes opening pins for releasing a holding state of a holding apparatus that holds semiconductor devices in a carrier board. Although semiconductor devices to be tested are altered in size and a carrier board loading with the semiconductor devices is thus replaced, the opener does not need to be replaced, thereby reducing the replacement cost and the waste of resources.
摘要:
A microwave oven is provided. A component generating relatively high temperature heat and a component generating a relatively low temperature heat are cooled by airflow divided and provided by a cooling part, thereby improving operation reliability and durability of a product.
摘要:
A test handler and method for operating a test handler for testing semiconductor devices are provided. The test handler includes a test tray located on one side of an opening apparatus in which a plurality of inserts are arrayed, wherein each insert comprises at least one semiconductor device loaded thereon, at least one opening unit for opening inserts at one part of the one side of the test tray, and a position changing apparatus comprises a motor including a driving pulley for moving at least one opening unit along a contact surface of the test tray such that the at least one opening unit changes positions on the test tray and is located at another part of the one side of the test tray in order to open inserts at the other part of the one side of the test tray.
摘要:
A reciprocating compressor comprises: a cylinder having an oil pocket on an inner circumferential surface of a piston insertion hole for inserting a piston with a predetermined width and depth; and a piston having a bearing portion protruding so as to slidably contact an inner circumferential surface of the piston insertion hole, and inserted into the piston insertion hole of the cylinder, wherein the bearing portion is formed to have a length shorter than that of the oil pocket of the cylinder. Accordingly, a frictional loss between the cylinder and the piston is reduced.