公开(公告)号：US06720618B2

公开(公告)日：2004-04-13

申请号：US10055947

申请日：2002-01-28

申请人： Yusuke Kawaguchi ,  Norio Yasuhara ,  Syotaro Ono ,  Shinichi Hodama ,  Akio Nakagawa

发明人： Yusuke Kawaguchi ,  Norio Yasuhara ,  Syotaro Ono ,  Shinichi Hodama ,  Akio Nakagawa

IPC分类号： H01L2976

CPC分类号： H01L21/26513 ,  H01L29/04 ,  H01L29/0653 ,  H01L29/0847 ,  H01L29/0878 ,  H01L29/1045 ,  H01L29/1095 ,  H01L29/41 ,  H01L29/4175 ,  H01L29/42372 ,  H01L29/42376 ,  H01L29/66659 ,  H01L29/66712 ,  H01L29/7802 ,  H01L29/7835

摘要： A power MOSFET device comprising a low resistance substrate of the first conductivity type, a high resistance epitaxial layer of the first conductivity type formed on the low resistance substrate, a base layer of the second conductivity type formed in a surface region of the high resistance epitaxial layer, a source region of the first conductivity type formed in a surface region of the base layer, a gate insulating film formed on the surface of the base layer so as to contact the source region, a gate electrode formed on the gate insulating film, and an LDD layer of the first conductivity type formed on the surface of the high resistance epitaxial layer oppositely relative to the source region and the gate electrode, wherein the LDD layer and the low resistance substrate are connected to each other by the high resistance epitaxial layer.

摘要翻译： 一种功率MOSFET器件，包括第一导电类型的低电阻衬底，形成在低电阻衬底上的第一导电类型的高电阻外延层，形成在高电阻外延表面区域中的第二导电类型的基极层 形成在基底层的表面区域中的第一导电类型的源极区域，形成在基极层的表面上以与源极区域接触的栅极绝缘膜，形成在栅极绝缘膜上的栅电极， 以及形成在所述高电阻外延层的与所述源极区域和所述栅极电极相反的表面上的所述第一导电类型的LDD层，其中所述LDD层和所述低电阻衬底通过所述高电阻外延层彼此连接 。

公开(公告)号：US20080251838A1

公开(公告)日：2008-10-16

申请号：US12118159

申请日：2008-05-09

申请人： Syotaro Ono ,  Yoshihiro Yamaguchi ,  Yusuke Kawaguchi ,  Kazutoshi Nakamura ,  Norio Yasuhara ,  Kenichi Matsushita ,  Shinichi Hodama ,  Akio Nakagawa

发明人： Syotaro Ono ,  Yoshihiro Yamaguchi ,  Yusuke Kawaguchi ,  Kazutoshi Nakamura ,  Norio Yasuhara ,  Kenichi Matsushita ,  Shinichi Hodama ,  Akio Nakagawa

IPC分类号： H01L29/78

CPC分类号： H01L29/7802 ,  H01L21/26586 ,  H01L29/0653 ,  H01L29/0696 ,  H01L29/0847 ,  H01L29/0878 ,  H01L29/1095 ,  H01L29/402 ,  H01L29/407 ,  H01L29/42368 ,  H01L29/42376 ,  H01L29/4238 ,  H01L29/66712 ,  H01L29/7809

摘要： A semiconductor device includes: a semiconductor substrate, at least a surface portion thereof serving as a low-resistance drain layer of a first conductivity type; a first main electrode connected to the low-resistance drain layer; a high-resistance epitaxial layer of a second-conductivity type formed on the low-resistance drain layer; a second-conductivity type base layer selectively formed on the high-resistance epitaxial layer; a first-conductivity type source layer selectively formed in a surface portion of the second-conductivity type base layer; a trench formed in a region sandwiched by the second-conductivity type base layers with a depth extending from the surface of the high-resistance epitaxial layer to the semiconductor substrate; a jfet layer of the first conductivity type formed on side walls of the trench; an insulating layer formed in the trench; an LDD layer of the first-conductivity type formed in a surface portion of the second-conductivity type base layer so as to be connected to the first-conductivity type jfet layer around a top face of the trench; a control electrode formed above the semiconductor substrate so as to be divided into a plurality of parts, and formed on a gate insulating film formed on a part of the surface of the LDD layer, on surfaces of end parts of the first-conductivity type source layer facing each other across the trench, and on a region of the surface of the second-conductivity type base layer sandwiched by the LDD layer and the first-conductivity type source layer; and a second main electrode in ohmic contact with the first-conductivity type source layer and the second-conductivity type base layer so as to sandwich the control electrode.

摘要翻译： 半导体器件包括：半导体衬底，至少其表面部分用作第一导电类型的低电阻漏极层; 连接到所述低电阻漏极层的第一主电极; 形成在低电阻漏极层上的第二导电类型的高电阻外延层; 选择性地形成在高电阻外延层上的第二导电型基极层; 选择性地形成在所述第二导电型基底层的表面部分中的第一导电型源极层; 在由所述第二导电型基底层夹持的区域中形成的沟槽，其深度从所述高电阻外延层的表面延伸到所述半导体衬底; 形成在沟槽的侧壁上的第一导电类型的jfet层; 形成在沟槽中的绝缘层; 形成在第二导电型基底层的表面部分中的第一导电类型的LDD层，以便围绕沟槽的顶面连接到第一导电型jfet层; 控制电极，其形成在所述半导体衬底上，以被分成多个部分，并形成在形成在所述LDD层的一部分表面上的栅极绝缘膜上，所述第一导电型源的端部 并且在由LDD层和第一导电型源极层夹在第二导电型基底层的表面的区域上， 以及与所述第一导电型源极层和所述第二导电型基极欧姆接触以便夹持所述控制电极的第二主电极。

公开(公告)号：US07026214B2

公开(公告)日：2006-04-11

申请号：US10957692

申请日：2004-10-05

申请人： Norio Yasuhara ,  Syotaro Ono ,  Kazutoshi Nakamura ,  Yusuke Kawaguchi ,  Shinichi Hodama ,  Akio Nakagawa

发明人： Norio Yasuhara ,  Syotaro Ono ,  Kazutoshi Nakamura ,  Yusuke Kawaguchi ,  Shinichi Hodama ,  Akio Nakagawa

IPC分类号： H01L21/00

CPC分类号： H01L29/402 ,  H01L21/26586 ,  H01L29/1045 ,  H01L29/1079 ,  H01L29/1083 ,  H01L29/41725 ,  H01L29/4175 ,  H01L29/41758 ,  H01L29/41766 ,  H01L29/41775 ,  H01L29/456 ,  H01L29/66636 ,  H01L29/66659 ,  H01L29/78 ,  H01L29/7835

摘要： A semiconductor device includes a first semiconductor region having a first conductivity type, a second semiconductor region formed on the first semiconductor region and having the first conductivity type, a third semiconductor region formed in a surface of the second semiconductor region and having a second conductivity type, a fourth semiconductor region formed in the surface of the second semiconductor region and having the second conductivity type, and a gate structure formed on the second and fourth semiconductor region. The semiconductor device further includes a conductive member arranged in the trench extending from a surface of the fourth semiconductor region to the first semiconductor region, the trench having one sidewall surface flush with a sidewall surface of the gate structure.

公开(公告)号：US07663186B2

公开(公告)日：2010-02-16

申请号：US12118159

申请日：2008-05-09

申请人： Syotaro Ono ,  Yoshihiro Yamaguchi ,  Yusuke Kawaguchi ,  Kazutoshi Nakamura ,  Norio Yasuhara ,  Kenichi Matsushita ,  Shinichi Hodama ,  Akio Nakagawa

发明人： Syotaro Ono ,  Yoshihiro Yamaguchi ,  Yusuke Kawaguchi ,  Kazutoshi Nakamura ,  Norio Yasuhara ,  Kenichi Matsushita ,  Shinichi Hodama ,  Akio Nakagawa

IPC分类号： H01L29/76 ,  H01L29/94

CPC分类号： H01L29/7802 ,  H01L21/26586 ,  H01L29/0653 ,  H01L29/0696 ,  H01L29/0847 ,  H01L29/0878 ,  H01L29/1095 ,  H01L29/402 ,  H01L29/407 ,  H01L29/42368 ,  H01L29/42376 ,  H01L29/4238 ,  H01L29/66712 ,  H01L29/7809

摘要： A semiconductor device includes: a substrate, a surface portion thereof serving as a drain layer; a first main electrode connected to the drain layer; an epitaxial layer formed on the drain layer; a base layer formed on the epitaxial layer; a source layer formed in a base layer surface portion; an insulated trench sandwiched by base layers; a JFET layer formed on trench side walls; an LDD layer formed in a base layer surface portion and connected to the JFET layer around a top face of the trench; a control electrode formed on a gate insulating film formed on an LDD layer surface part, on surfaces of source layer end parts facing each other across the trench, and on a base layer region sandwiched by the LDD and source layers; and a second main electrode connected to the source and base layers sandwiching the control electrode.

摘要翻译： 半导体器件包括：衬底，用作漏极层的表面部分; 连接到漏极层的第一主电极; 形成在漏极层上的外延层; 形成在外延层上的基底层; 形成在基层表面部分中的源极层; 由基层夹住的绝缘沟槽; 形成在沟槽侧壁上的JFET层; LDD层，其形成在基底表面部分中并且围绕所述沟槽的顶面连接到所述JFET层; 形成在形成在LDD层表面部分上的栅极绝缘膜上的控制电极，在沟槽之间彼此面对的源极层部分的表面上以及由LDD和源极层夹持的基极层区域; 以及连接到夹持控制电极的源极和基极层的第二主电极。

公开(公告)号：US07061060B2

公开(公告)日：2006-06-13

申请号：US10388509

申请日：2003-03-17

申请人： Norio Yasuhara ,  Syotaro Ono ,  Kazutoshi Nakamura ,  Yusuke Kawaguchi ,  Shinichi Hodama ,  Akio Nakagawa

发明人： Norio Yasuhara ,  Syotaro Ono ,  Kazutoshi Nakamura ,  Yusuke Kawaguchi ,  Shinichi Hodama ,  Akio Nakagawa

IPC分类号： H01L29/76

CPC分类号： H01L29/402 ,  H01L21/26586 ,  H01L29/1045 ,  H01L29/1079 ,  H01L29/1083 ,  H01L29/41725 ,  H01L29/4175 ,  H01L29/41758 ,  H01L29/41766 ,  H01L29/41775 ,  H01L29/456 ,  H01L29/66636 ,  H01L29/66659 ,  H01L29/78 ,  H01L29/7835

摘要： A semiconductor device includes a first semiconductor region having a first conductivity type, a second semiconductor region formed on the first semiconductor region and having the first conductivity type, a third semiconductor region formed in a surface of the second semiconductor region and having a second conductivity type, a fourth semiconductor region formed in the surface of the second semiconductor region and having the second conductivity type, and a gate structure formed on the second and fourth semiconductor region. The semiconductor device further includes a conductive member arranged in the trench extending from a surface of the fourth semiconductor region to the first semiconductor region, the trench having one sidewall surface flush with a sidewall surface of the gate structure.

公开(公告)号：US06552389B2

公开(公告)日：2003-04-22

申请号：US10013874

申请日：2001-12-13

申请人： Norio Yasuhara ,  Syotaro Ono ,  Kazutoshi Nakamura ,  Yusuke Kawaguchi ,  Shinichi Hodama ,  Akio Nakagawa

发明人： Norio Yasuhara ,  Syotaro Ono ,  Kazutoshi Nakamura ,  Yusuke Kawaguchi ,  Shinichi Hodama ,  Akio Nakagawa

IPC分类号： H01L2976

CPC分类号： H01L29/402 ,  H01L21/26586 ,  H01L29/1045 ,  H01L29/1079 ,  H01L29/1083 ,  H01L29/41725 ,  H01L29/4175 ,  H01L29/41758 ,  H01L29/41766 ,  H01L29/41775 ,  H01L29/456 ,  H01L29/66636 ,  H01L29/66659 ,  H01L29/78 ,  H01L29/7835

摘要： A semiconductor device includes a first semiconductor region having a first conductivity type, a second semiconductor region formed on the first semiconductor region and having the first conductivity type, a third semiconductor region formed in a surface of the second semiconductor region and having a second conductivity type, a fourth semiconductor region formed in the surface of the second semiconductor region and having the second conductivity type, and a gate structure formed on the second and fourth semiconductor region. The semiconductor device further includes a conductive member arranged in the trench extending from a surface of the fourth semiconductor region to the first semiconductor region, the trench having one sidewall surface flush with a sidewall surface of the gate structure.

公开(公告)号：US07061048B2

公开(公告)日：2006-06-13

申请号：US10790137

申请日：2004-03-02

申请人： Yusuke Kawaguchi ,  Norio Yasuhara ,  Syotaro Ono ,  Shinichi Hodama ,  Akio Nakagawa

发明人： Yusuke Kawaguchi ,  Norio Yasuhara ,  Syotaro Ono ,  Shinichi Hodama ,  Akio Nakagawa

IPC分类号： H01L27/96

CPC分类号： H01L21/26513 ,  H01L29/04 ,  H01L29/0653 ,  H01L29/0847 ,  H01L29/0878 ,  H01L29/1045 ,  H01L29/1095 ,  H01L29/41 ,  H01L29/4175 ,  H01L29/42372 ,  H01L29/42376 ,  H01L29/66659 ,  H01L29/66712 ,  H01L29/7802 ,  H01L29/7835

摘要： A power MOSFET device comprising a low resistance substrate of the first conductivity type, a high resistance epitaxial layer of the first conductivity type formed on the low resistance substrate, a base layer of the second conductivity type formed in a surface region of the high resistance epitaxial layer, a source region of the first conductivity type formed in a surface region of the base layer, a gate insulating film formed on the surface of the base layer so as to contact the source region, a gate electrode formed on the gate insulating film, and an LDD layer of the first conductivity type formed on the surface of the high resistance epitaxial layer oppositely relative to the source region and the gate electrode, wherein the LDD layer and the low resistance substrate are connected to each other by the high resistance epitaxial layer.

公开(公告)号：US20050056890A1

公开(公告)日：2005-03-17

申请号：US10957692

申请日：2004-10-05

申请人： Norio Yasuhara ,  Syotaro Ono ,  Kazutoshi Nakamura ,  Yusuke Kawaguchi ,  Shinichi Hodama ,  Akio Nakagawa

发明人： Norio Yasuhara ,  Syotaro Ono ,  Kazutoshi Nakamura ,  Yusuke Kawaguchi ,  Shinichi Hodama ,  Akio Nakagawa

IPC分类号： H01L21/265 ,  H01L21/336 ,  H01L29/06 ,  H01L29/10 ,  H01L29/40 ,  H01L29/417 ,  H01L29/45 ,  H01L29/78 ,  H01L29/76

CPC分类号： H01L29/402 ,  H01L21/26586 ,  H01L29/1045 ,  H01L29/1079 ,  H01L29/1083 ,  H01L29/41725 ,  H01L29/4175 ,  H01L29/41758 ,  H01L29/41766 ,  H01L29/41775 ,  H01L29/456 ,  H01L29/66636 ,  H01L29/66659 ,  H01L29/78 ,  H01L29/7835

摘要： A semiconductor device includes a first semiconductor region having a first conductivity type, a second semiconductor region formed on the first semiconductor region and having the first conductivity type, a third semiconductor region formed in a surface of the second semiconductor region and having a second conductivity type, a fourth semiconductor region formed in the surface of the second semiconductor region and having the second conductivity type, and a gate structure formed on the second and fourth semiconductor region. The semiconductor device further includes a conductive member arranged in the trench extending from a surface of the fourth semiconductor region to the first semiconductor region, the trench having one sidewall surface flush with a sidewall surface of the gate structure.

摘要翻译： 半导体器件包括具有第一导电类型的第一半导体区域，形成在第一半导体区域上并且具有第一导电类型的第二半导体区域，形成在第二半导体区域的表面中并具有第二导电类型的第三半导体区域 形成在第二半导体区域的表面上并具有第二导电类型的第四半导体区域以及形成在第二和第四半导体区域上的栅极结构。 半导体器件还包括布置在从第四半导体区域的表面延伸到第一半导体区域的沟槽中的导电构件，沟槽具有与栅极结构的侧壁表面齐平的一个侧壁表面。

公开(公告)号：US06878992B2

公开(公告)日：2005-04-12

申请号：US10091423

申请日：2002-03-07

申请人： Yusuke Kawaguchi ,  Norio Yasuhara ,  Kazutoshi Nakamura ,  Akio Nakagawa ,  Syotaro Ono

发明人： Yusuke Kawaguchi ,  Norio Yasuhara ,  Kazutoshi Nakamura ,  Akio Nakagawa ,  Syotaro Ono

IPC分类号： H01L21/28 ,  H01L21/336 ,  H01L29/41 ,  H01L29/423 ,  H01L29/78 ,  H01L29/76 ,  H01L29/94 ,  H01L31/062

CPC分类号： H01L29/66666 ,  H01L29/42368 ,  H01L29/7828

摘要： A power MOSFET comprises, between source and drain electrodes, a low resistive semiconductor substrate of a first conductivity type, a drift layer of the first conductivity type formed on the semiconductor substrate, a high resistive epitaxial layer of the first conductivity type formed on the drift layer, trenches formed to extend from a surface of the epitaxial layer into the drift layer, gate electrodes buried in the trenches with gate insulating films interposed between the gate electrodes and walls of the trenches, low resistive source layers of the first conductivity type formed in a surface region of the epitaxial layer adjacent to the gate insulating films, and a base layer of a second conductivity type formed in the surface region of the epitaxial layer, wherein the epitaxial layer intervening between the trenches is depleted in a case where 0 volt is applied between the source electrode and the gate electrodes.

摘要翻译： 功率MOSFET在源极和漏极之间包括第一导电类型的低电阻半导体衬底，形成在半导体衬底上的第一导电类型的漂移层，形成在漂移上的第一导电类型的高电阻外延层 形成为从外延层的表面延伸到漂移层中的沟槽，埋入沟槽中的栅电极，栅极绝缘膜插入在栅电极和沟槽的壁之间，形成在第一导电类型的低电阻源层 与栅极绝缘膜相邻的外延层的表面区域和形成在外延层的表面区域中的第二导电类型的基极层，其中在0伏特的情况下，介于沟槽之间的外延层被耗尽 施加在源电极和栅电极之间。

公开(公告)号：US20080035992A1

公开(公告)日：2008-02-14

申请号：US11836383

申请日：2007-08-09

申请人： Yusuke KAWAGUCHI ,  Yoshihiro Yamaguchi ,  Syotaro Ono ,  Akio Nakagawa ,  Miwako Akiyama ,  Kazuya Nakayama ,  Masakazu Yamaguchi

发明人： Yusuke KAWAGUCHI ,  Yoshihiro Yamaguchi ,  Syotaro Ono ,  Akio Nakagawa ,  Miwako Akiyama ,  Kazuya Nakayama ,  Masakazu Yamaguchi

IPC分类号： H01L29/78

CPC分类号： H01L29/7813 ,  H01L21/2815 ,  H01L29/0634 ,  H01L29/0696 ,  H01L29/1095 ,  H01L29/41766 ,  H01L29/42356 ,  H01L29/4236 ,  H01L29/42368 ,  H01L29/42376 ,  H01L29/66734 ,  H01L29/7828

摘要： This semiconductor device comprises a drift layer of a first conductivity type formed on a drain layer of a first conductivity type, and a drain electrode electrically connected to the drain layer. A semiconductor base layer of a second conductivity type is formed in a surface of the drift layer, and a source region of a first conductivity type is further formed in the semiconductor base layer.A source electrode is electrically connected to the source region and a semiconductor base layer. Plural gate electrodes are formed through a gate insulation film so that a semiconductor base layer may be sandwiched by the gate electrodes. The width of the semiconductor base layer sandwiched by the gate electrodes is 0.3 micrometers or less.

摘要翻译： 该半导体器件包括形成在第一导电类型的漏极层上的第一导电类型的漂移层和电连接到漏极层的漏电极。 在漂移层的表面上形成第二导电类型的半导体基底层，并且在半导体基底层中进一步形成第一导电类型的源极区。 源电极电连接到源区和半导体基层。 多个栅电极通过栅极绝缘膜形成，使得半导体基底层可以被栅电极夹持。 被栅电极夹持的半导体基底层的宽度为0.3微米以下。