Photosensitive resin composition comprising fullerene
    1.
    发明授权
    Photosensitive resin composition comprising fullerene 失效
    包含富勒烯的感光树脂组合物

    公开(公告)号:US5998089A

    公开(公告)日:1999-12-07

    申请号:US928337

    申请日:1997-09-12

    CPC分类号: G03F7/038 Y10S430/128

    摘要: Disclosed are a photosensitive resin composition containing a fullerene and a polymer compound bearing a functional group which can react with the fullerene under irradiation of visible light; method for forming negative-type picture elements comprising steps of: forming a layer composed of the above composition, irradiating the layer with visible light through a photo mask having a pattern transmitting the visible light as a part of the mask to cure portions of the layer irradiated by the visible light, and removing uncured portions of the layer to form a resist film having cured portions of the pattern: and a method for producing devices comprising steps of: forming a layer of the above composition on an image-forming layer provided on a substrate, irradiating the layer with visible light through a photo mask having a pattern transmitting the visible light as a part of the mask to cure portions of the layer irradiated by the visible light, removing uncured portions of the layer to form a resist film having cured portions of the pattern, etching exposed portions of the image-forming layer, and removing the resist film. The composition and methods of the present invention enable production of negative type picture elements and devices with light of visible range.

    摘要翻译: 公开了一种感光性树脂组合物,其含有富勒烯和具有能够在可见光照射下与富勒烯反应的官能团的高分子化合物; 用于形成负型图像元素的方法包括以下步骤:形成由上述组合物构成的层,通过具有透过可见光的图案的光掩模将可见光照射到该层上,作为掩模的一部分,以固化层的部分 通过可见光照射,并且去除该层的未固化部分以形成具有固化部分的图案的抗蚀剂膜;以及一种制造器件的方法,包括以下步骤:在设置在其上的图像形成层上形成上述组合物层 基板,通过具有透过可见光的图案作为掩模的一部分的光掩模照射该层,以固化由可见光照射的层的部分,除去该层的未固化部分以形成具有 蚀刻图案的固化部分,蚀刻图像形成层的暴露部分,以及去除抗蚀剂膜。 本发明的组合物和方法能够生产具有可见光范围的负型图像元件和器件。

    Printed wiring board and semiconductor device and processes to prepare the same
    2.
    发明授权
    Printed wiring board and semiconductor device and processes to prepare the same 失效
    印刷电路板和半导体器件及其制备方法

    公开(公告)号:US06709804B2

    公开(公告)日:2004-03-23

    申请号:US10368960

    申请日:2003-02-19

    IPC分类号: G03C173

    摘要: A printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device prepared by coating a substrate with a photosensitive resin composition comprising an oxygen sensitizer and a cis-diene-substituted polyamic acid or polyimide and forming fine patterns by exposure to radiation. Processes for producing a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device, which comprises coating a substrate with the photosensitive resin composition and forming fine patterns by crosslinking cis-diene by oxidation polycondensation with singlet oxygen generated by exposure of the oxygen sensitizer to radiation. The photosensitive resin composition is of the negative type and exhibits high sensitivity and high resolution. The photosensitive resin composition forms a resin layer having excellent heat resistance.

    摘要翻译: 印刷电路板,用于配置半导体芯片的基板和通过用包含氧敏感剂和顺式二烯取代的聚酰胺酸或聚酰亚胺的感光性树脂组合物涂布基板而制备的半导体装置,并通过暴露于辐射形成精细图案。 用于制造印刷线路板的方法,用于设置半导体芯片的基板和半导体器件,其包括用感光性树脂组合物涂布基材并通过与通过氧气曝光产生的单线态氧化缩聚反应顺式二烯来形成精细图案 敏化剂对辐射。 感光性树脂组合物为负型,显示出高灵敏度,高分辨率。 感光性树脂组合物形成耐热性优异的树脂层。

    PHOTOSENSITIVE RESIN COMPOSITION, PRINTED WIRING BOARD, SUBSTRATE FOR DISPOSING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND PROCESSES FOR PRODUCING A PRINTED WIRING BOARD, A SUBSTRATE FOR DISPOSING SEMICONDUCTOR CHIPS AND A SEMICONDUCTOR DEVICE
    3.
    发明授权
    PHOTOSENSITIVE RESIN COMPOSITION, PRINTED WIRING BOARD, SUBSTRATE FOR DISPOSING SEMICONDUCTOR CHIPS, SEMICONDUCTOR DEVICE AND PROCESSES FOR PRODUCING A PRINTED WIRING BOARD, A SUBSTRATE FOR DISPOSING SEMICONDUCTOR CHIPS AND A SEMICONDUCTOR DEVICE 失效
    感光性树脂组合物,印刷线路板,用于处理半导体芯片的基板,用于制造印刷电路板的半导体器件和工艺,用于处理半导体器件的衬底和半导体器件

    公开(公告)号:US06528231B1

    公开(公告)日:2003-03-04

    申请号:US09490627

    申请日:2000-01-24

    IPC分类号: G03C173

    摘要: A photosensitive resin composition comprising an oxygen sensitizer and a cis-diene-substituted polyamic acid or a polyimide. A printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device prepared by coating a substrate with the photosensitive resin composition and forming fine patterns by exposure to radiation. Processes for producing a printed wiring board, a substrate for disposing semiconductor chips and a semiconductor device, which comprise coating a substrate with the photosensitive resin composition and forming fine patterns by crosslinking cis-diene by oxidation polycondensation with singlet oxygen generated by exposure of the oxygen sensitizer to radiation. The photosensitive resin composition is of the negative type and exhibits high sensitivity and high resolution. The photosensitive resin composition can form a resin layer having excellent heat resistance.

    摘要翻译: 包含氧敏感剂和顺式二烯取代的聚酰胺酸或聚酰亚胺的感光性树脂组合物。 印刷电路板,用于设置半导体芯片的基板和通过用感光性树脂组合物涂布基板而制备的半导体器件,并且通过暴露于辐射形成精细图案。 制造印刷电路板的方法,用于设置半导体芯片的基板和半导体装置,其包括用感光性树脂组合物涂布基板并通过与通过氧气曝光产生的单线态的氧化缩聚来交联顺式二烯而形成精细图案 敏化剂对辐射。 感光性树脂组合物为负型,显示出高灵敏度,高分辨率。 感光性树脂组合物可以形成耐热性优异的树脂层。

    Fullerene epoxide and process for producing the same
    4.
    发明申请
    Fullerene epoxide and process for producing the same 审中-公开
    富勒烯环氧化物及其制备方法

    公开(公告)号:US20050154219A1

    公开(公告)日:2005-07-14

    申请号:US10498351

    申请日:2002-12-26

    IPC分类号: C07D493/20 C07D493/14

    CPC分类号: C07D493/20 B82Y30/00

    摘要: A fullerene epoxide denoted as C60O3, characterized by the presence of two epoxide groups in a single six-membered ring, and by the presence of one epoxide group in a six-membered ring adjacent to the six-membered ring in which said two epoxide groups are present or by the presence of one epoxide group in a six-membered ring one six-membered ring removed from the six-membered ring in which said two epoxide groups are present. The fullerene epoxide has three epoxide groups and has C1, C2, or Cs symmetry. A method of manufacturing fullerene epoxide comprising: separating a fraction containing only fullerene triepoxides-from a mixture of fullerene epoxides using silica gel, and separating the fraction containing only fullerene triepoxides thus obtained using a substance having p-p interaction to obtain fullerene epoxide according to any of claims 1 to 6. A method of separating fullerene epoxide characterized in that a fullerene epoxide mixture is separated using a substance having p-p interaction.

    摘要翻译: 表示为C 60 O 3 3的富勒烯环氧化物,其特征在于在单个六元环中存在两个环氧基团,并且在一个六元环中存在一个环氧基团 与六元环相邻的六元环,其中存在所述两个环氧基团或通过六元环中一个环氧基团的存在,从六元环除去六元环,其中所述两个环氧化物 组存在。 富勒烯环氧化物具有三个环氧基并具有C 1,C 2或C 2对称性。 一种制造富勒烯环氧化物的方法,包括:使用硅胶从富勒烯环氧化物的混合物中分离仅含有富勒烯三环氧化物的馏分,并且使用具有pp相互作用的物质分离仅含有富勒烯三环氧化物的馏分,以获得根据任何一种的富勒烯环氧化物 权利要求1至6所述的分离富勒烯环氧化物的方法,其特征在于使用具有pp相互作用的物质分离富勒烯环氧化物混合物。

    System and method of diagnosing particle formation
    8.
    发明授权
    System and method of diagnosing particle formation 失效
    诊断颗粒形成的系统和方法

    公开(公告)号:US06374194B1

    公开(公告)日:2002-04-16

    申请号:US09288667

    申请日:1999-04-09

    申请人: Kazuo Takeuchi

    发明人: Kazuo Takeuchi

    IPC分类号: G06F1130

    摘要: A particle formation diagnosing system monitors the condition of particle formation in each of reaction chambers 1 of a semiconductor device fabricating line on the basis of data provided by a pressure measuring device 2a, a temperature measuring device 2b and a differential mobility analyzer 3 combined with each reaction chamber 1. The operation record recording unit 4a of the computer system 4 records data on the relation between the values of the operation parameters of each reaction chamber 1 and the amount of particles formed in the reaction chamber. Then, the operating condition determining unit 4b determines the optimum values for the operation parameters of the reaction chamber which will reduce the possibility of particle formation to the least possible extent on the basis of the data recorded by the operation record recording unit 4a.

    摘要翻译: 颗粒形成诊断系统基于由压力测量装置2a,温度测量装置2b和差速迁移率分析仪3提供的数据监测半导体装置制造线的每个反应室1中的颗粒形成状况, 计算机系统4的操作记录记录单元4a记录关于每个反应室1的操作参数的值与在反应室中形成的颗粒的量之间的关系的数据。 然后,操作条件确定单元4b确定反应室的操作参数的最佳值,其将基于由操作记录记录单元4a记录的数据以最小程度降低颗粒形成的可能性。