摘要:
Capacitors are formed in the trenches made in an interlayer insulator made of silicon oxide. An insulating film (e.g., a silicon nitride film) is provided on the sides of each trench of the interlayer insulator. A storage electrode made of ruthenium or the like is provided in each trench of the interlayer insulator. A capacitor insulating film made of BSTO or the like is formed on the storage electrode. A plate electrode made of ruthenium or the like is formed on the capacitor insulating film. The plate electrode is common to all capacitors provided. Any two adjacent capacitors are electrically isolated by the interlayer insulator and the insulating film provided on the sides of the trenches of the interlayer insulator.
摘要:
Capacitors are formed in the trenches made in an interlayer insulator made of silicon oxide. An insulating film (e.g., a silicon nitride film) is provided on the sides of each trench of the interlayer insulator. A storage electrode made of ruthenium or the like is provided in each trench of the interlayer insulator. A capacitor insulating film made of BSTO or the like is formed on the storage electrode. A plate electrode made of ruthenium or the like is formed on the capacitor insulating film. The plate electrode is common to all capacitors provided. Any two adjacent capacitors are electrically isolated by the interlayer insulator and the insulating film provided on the sides of the trenches of the interlayer insulator.
摘要:
Capacitors are formed in the trenches made in an interlayer insulator made of silicon oxide. An insulating film (e.g., a silicon nitride film) is provided on the sides of each trench of the interlayer insulator. A storage electrode made of ruthenium or the like is provided in each trench of the interlayer insulator. A capacitor insulating film made of BSTO or the like is formed on the storage electrode. A plate electrode made of ruthenium or the like is formed on the capacitor insulating film. The plate electrode is common to all capacitors provided. Any two adjacent capacitors are electrically isolated by the interlayer insulator and the insulating film provided on the sides of the trenches of the interlayer insulator.
摘要:
A pair of rim portions (4a) and (4b) is formed in the shape of a discontinuous segmental circular ring, which includes cutout portions (8a) and (8b), respectively, at one position. The cutout portions of the respective rim portions are concentrically disposed so as to face each other with a predetermined interval therebetween in an axial direction while having the same phase in a circumferential direction. A plurality of pillar portions (6) form pockets (10) where rollers (14) are retained. An expandable elastic connecting portion (12), which connects one end portion (84a) of one rim portion in the circumferential direction to the other end portion (82b) of the other rim portion in the circumferential direction, is provided at the pair of rim portions.
摘要:
A floor system includes a plurality of panels placed on a base floor. A space is formed between the panels and the base floor for laying cables. A plurality of sliding plates are arranged on the base floor. A plurality of supports are provided and each support of the plurality of supports is arranged on each of the sliding plates so as to freely slide. The plurality of panels are supported by the plurality of supports by being fixed on a pedestal of the each support of the plurality of supports. The plurality of panels are hence connected to each other to form a single floor surface. The dynamic coefficient of friction between the bottom of the supports and the sliding plates is selected to be a value within a range of 0.09 to 0.25.
摘要:
A semiconductor memory device comprises a semiconductor substrate having memory cell area, a plurality of trenches selectively formed in the memory cell area aligning in certain intervals and a plurality of memory cell arrays provided in the memory cell area, wherein each of the memory cell arrays comprises a plurality of MOS transistors connected in a serial array and a plurality of capacitors each formed in a corresponding one of the trenches. Each of the transistors has a gate electrode above the substrate with a gate insulating film formed therebetween and source and drain regions formed in the substrate on both sides of the gate electrode. Each of the capacitors includes a charge storage layer formed on an inner wall of each of the trenches and connected integrally to one of the source and drain regions of each of the transistors, a capacitor insulating film formed on the charge storage layer and a capacitor electrode formed on the capacitor insulating film so as to bury each of the trenches and extending to the surface of the substrate, which is formed on the surface of the substrate except for at least formation areas of the transistors.
摘要:
The present invention provides a single-split cage capable of continuously holding a plurality of rolling elements stably for a long time by eliminating the difference in the strength between split regions, by maintaining the strength of the entire cage uniform in the circumferential direction and by maintaining the dimensional accuracy between the split regions constant at the time of molding and also capable of improving load capacity and achieving low cost for assembly. A split section 10 for splitting at one portion in the circumferential direction is formed at regions (split regions 10a and 10b) extending between pockets 2p adjacent to each other in the circumferential direction, engagement sections being engageable with each other are provided at the circumferential central position between the pockets and on a one-side split face Sa and the other-side split face Sb formed by splitting the regions, and in a state in which both the engagement sections are engaged with each other, predetermined clearances are formed between the one-side split face and the other-side split face and between the engagement sections.
摘要:
The present invention provides a single-split cage capable of continuously holding a plurality of rolling elements stably for a long time by eliminating the difference in the strength between split regions, by maintaining the strength of the entire cage uniform in the circumferential direction and by maintaining the dimensional accuracy between the split regions constant at the time of molding and also capable of improving load capacity and achieving low cost for assembly. A split section 10 for splitting at one portion in the circumferential direction is formed at regions (split regions 10a and 10b) extending between pockets 2p adjacent to each other in the circumferential direction, engagement sections being engageable with each other are provided at the circumferential central position between the pockets and on a one-side split face Sa and the other-side split face Sb formed by splitting the regions, and in a state in which both the engagement sections are engaged with each other, predetermined clearances are formed between the one-side split face and the other-side split face and between the engagement sections.
摘要:
According to one embodiment, a semiconductor storage device includes a plurality of parallel first interconnects extending in a first direction, a plurality of parallel second interconnects which extend in a second direction perpendicular to the first direction and which make a two-level crossing with respect to the first interconnects, and memory cell structures provided in regions where the first interconnects and the second interconnects make two-level crossings, the memory cell structures being connected on one end to the first interconnects and connected on the other end to the second interconnects, the memory cell structure including a variable resistive element and a non-ohmic element which are connected in series, wherein the endmost first interconnect is disconnected in at least one portion.