摘要:
Disclosed is a semiconductor memory device having a data retention operating mode. When an entry into the data retention operating mode is performed, parity information on data of the memory cells is calculated and the error correction on the memory cells is carried out at a time of an exit from the data retention operating mode, by an ECC (Error Correction Circuit). The semiconductor memory device includes means for outputting from an NC pin flag information indicating that the semiconductor memory device is the one including the data retention operating mode, that the exit processing from the data retention operating mode is under way, and that the error correction cannot be performed.
摘要:
Disclosed is a semiconductor memory device having a data retention operating mode. When an entry into the data retention operating mode is performed, parity information on data of the memory cells is calculated and the error correction on the memory cells is carried out at a time of an exit from the data retention operating mode, by an ECC (Error Correction Circuit). The semiconductor memory device includes means for outputting from an NC pin flag information indicating that the semiconductor memory device is the one including the data retention operating mode, that the exit processing from the data retention operating mode is under way, and that the error correction cannot be performed.
摘要:
When a DRAM enters an operation mode in which only a data storing operation is performed, a check bit for error detection and correction for plural data is generated and stored. Refresh operation is performed in a refresh cycle which is made long within an allowable range of an error occurrence by an error correcting operation using the check bit. Before the DRAM returns to the normal operation mode from the data holding operation mode, an error bit is corrected by using the data and the check bit.
摘要:
When a DRAM enters an operation mode in which only a data storing operation is performed, a check bit for error detection and correction for plural data is generated and stored. Refresh operation is performed in a refresh cycle which is made long within an allowable range of an error occurrence by an error correcting operation using the check bit. Before the DRAM returns to the normal operation mode from the data holding operation mode, an error bit is corrected by using the data and the check bit.
摘要:
When a DRAM enters an operation mode in which only a data storing operation is performed, a check bit for error detection and correction for plural data is generated and stored. Refresh operation is performed in a refresh cycle which is made long within an allowable range of an error occurrence by an error correcting operation using the check bit. Before the DRAM returns to the normal operation mode from the data holding operation mode, an error bit is corrected by using the data and the check bit.
摘要:
When a DRAM enters an operation mode in which only a data storing operation is performed, a check bit for error detection and correction for plural data is generated and stored. Refresh operation is performed in a refresh cycle which is made long within an allowable range of an error occurrence by an error correcting operation using the check bit. Before the DRAM returns to the normal operation mode from the data holding operation mode, an error bit is corrected by using the data and the check bit.
摘要:
A dynamic RAM provided with a data retention mode intended for low power consumption is provided. In the data retention mode, the current supply capabilities of voltage generation circuits which generate decreased voltage, increased voltage, reference voltage, etc., are limited in the range in which information retention operation in memory cells can be maintained, and the number of selected memory mats in the data retention mode is increased with respect to that of memory mats selected in the normal read/write mode and refresh mode. Special modes such as the data retention mode are set by combining an address strobe signal and other control signals and dummy CBR refresh is executed to release the special mode.
摘要:
A memory cells are arranged at all intersections of a first word line and one line of a bit-line pair and all intersections of a second word line and the other line of the bit-line pair by arranging in parallel the first word line and the second word line consisting of different layers in the row direction with an identical pitch, and, also, alternately arranging the first word line and the second word line at an interval equal to a half of the pitch in the horizontal direction. Moreover, the selection MISFET of the memory cell is formed to have the vertical construction and the bit line located at the upper side of the substrate, where a channel region is formed, is shielded with a conductive film, a part of which forms the gate electrode.
摘要:
A period pulse corresponding to the shortest information retention time of those of dynamic memory cells is counted to form a refresh address to be assigned to a plurality of word lines. A carry signal outputted from the refresh address counter is divided by a divider. For each of said plurality of word lines assigned with the refresh address, one of a short period corresponding to an output pulse of a timer or a long period corresponding to the divided pulse from the divider is stored in a storage circuit as refresh time setting information. A memory cell refresh operation to be performed by the refresh address is made valid or invalid for each word line according to the refresh time setting information stored in the storage circuit and the refresh time setting information itself is made invalid by the output pulse of the divider.
摘要:
Pattern data of a phase shift mask can be inspected: (101) by separating and laying out pattern data of a phase shift mask in an actual pattern data layer, an auxiliary pattern data layer and a phase shift pattern data layer; (102) by inspecting and correcting only the data of the actual pattern of the actual pattern data layer; (108) by making data of an estimated pattern estimated to be transferred to a semiconductor wafer from the data of the synthetic data of the correct actual pattern data, the auxiliary pattern data and the phase shift pattern data, which are inspected and corrected; and (104) by comparing the estimated pattern data and the actual pattern data to inspect the data of the auxiliary pattern and the phase shift pattern.