摘要:
A semiconductor device is provided in connection with a semiconductor chip which has a plurality of bonding pads at a part corresponding to a centrally located area of the front or first main surface thereof, an organic insulator film which overlies the semiconductor chip and which has an opening in correspondence with the bonding pads, a plurality of leads which overly the organic insulator film, and a molding resin with which these constituents are sealed or packaged.
摘要:
The present invention provides a semiconductor integrated-circuit device capable of achieving higher-density integration and faster operation, and a CMOS circuit operational speeding-up method for easily achieving the operating speeds of CMOS circuits, including existing one.A signal transferring path includes a plurality of CMOS-constructed logic gate circuits provided between one pair of flip-flop circuits for acquiring and holding signals by use of clock signals. The signal transferring path includes a first and a second signal transferring path. The first signal transferring path is constituted by enhancement-type MOSFETs and has a signal transferring delay time equal to, or less than, a permissible signal transferring delay time. The second signal transferring path is configured such that, among the above-mentioned plurality of logic gate circuits, a logic gate circuit having a delay time longer than the above-mentioned permissible signal transferring delay time when constituted using enhancement-type MOSFETs is replaced with a depletion-type MOSFET so that the second signal transferring path may provide a signal transferring delay time equal to or less than the permissible signal transferring delay time mentioned above.
摘要:
A local integrated circuit device provides remote configuration access to one or more remote integrated circuit devices. The local integrated circuit device receives configuration access requests through at least two interfaces. The local integrated circuit device accesses a configuration space of one or more remote integrated circuit devices in accordance with the received configuration access requests.
摘要:
A voltage generating circuit for providing a prescribed voltage, such as 1/2V.sub.DD of the power source voltage V.sub.DD, wherein the capacity of the current and the response time of the voltage generating circuit is significantly improved. When the output voltage V.sub.OUT of the voltage generating circuit drops suddenly from a reference value 1/2V.sub.DD and goes below the lower limit of an allowable voltage level VM-, an n-type MOS transistor MN5A of an output voltage detecting circuit 14 turns on. The potential of the gate terminal for a p-type MOS transistor MP6A in a digital output circuit 16 is pulled to the level of the output voltage V.sub.OUT via the transistor MN5A that was turned on, and said p-type MOS transistor MP6A is turned on in the saturated area more or less perfectly. By virtue of a large amount of current flowing to the output side of a terminal side, namely the load circuit side, at an appropriate voltage from a power source terminal 18 via p-type MOS transistor MP6A which was turned on in the saturated area, a reduction in output voltage V.sub.OUT is stopped quickly and the output voltage is restored to the normal level within a short time.
摘要:
A voltage generating circuit in a semiconductor integrated circuit driven by two sorts of power supply voltages, includes a unit for generating plural sorts of signals; a unit for selecting one of the plural sorts of signals in response to an operation mode of the semiconductor integrated circuit; and a pumping unit for producing either a first predetermined voltage higher than the high power supply voltage among the two sorts of power supply voltages, or a second predetermined voltage lower than the low power supply voltage by a pumping operation based upon the signal selected by the selecting unit.
摘要:
A semiconductor memory device is provided which includes a plurality of data lines, at least one redundant data line, one common data line, a plurality of column switches installed between the plurality of data lines and the redundant data line and one common data line, and a column decoder for controlling the plurality of column switches. The column decoder operates to turn the column switch on. The column switch is connected to a plurality of data lines, excluding any defective data and redundant data lines during the test mode state.
摘要:
A pair of DRAM chips 1A and 1B are mounted opposedly to each other with wiring means such as lead frames put therebetween, the lead frames being substantially integral with external terminals 3B. Then, these DRAM chips and lead frames are connected together by the conventional wire bonding method. Each chip is bonded with an associated lead frame and each lead frame is disposed as plural lead frame conductors contacting mutually lead frame conductors associated with similarly function bonding pads, i.e. external terminals of the chips, of the other one of the pair of chips. Ones or plural pairs of the thus-connected DRAM chips and lead frames are stacked and corresponding leads of the lead frames are connected in common to form a laminate. The plural DRAM chips thus mounted are activated selectively in accordance with a predetermined chip selection signal. Additionally, partial DRAM chips capable of partially functioning normally are combined together by utilizing the above chip mounting method to constitute a single DRAM package.
摘要:
Each of a plurality of memory arrays is divided into a plurality of memory mats MAT00L-MAT07L to MAT10R-MAT17R in directions in which word lines and bit lines extend. First common data lines, that is, sub-IO lines, are provided which correspond to these memory mats and which are disposed in parallel to the word lines. Bit lines designating the corresponding memory mats are selectively connected to the first common data lines. Second common data lines, that is, main IO line groups MIOG0-MIOG7, are also provided and are disposed in parallel to the bit lines. Designated sub-IO lines are selectively connected to the second common data lines. Moreover, a plurality of main amplifiers forming a main amplifier unit MAU0 are orderly arranged in the direction in which the bit lines extend. These include a first main amplifier comprising a static current mirror amplifier which requires a relatively large operating current and a second main amplifier comprising a dynamic CMOS latch amplifier which requires only a relatively small operating current. These main amplifiers are put to proper use in conformity with the operating mode involved. By virtue of these arrangements, the number of parallel bits in a multibit parallel test mode of a dynamic RAM becomes expandable without being restricted by the number of the sub-IO lines correspondingly provided for each memory mat.
摘要:
A semiconductor device is provided in connection with a semiconductor chip which has a plurality of bonding pads at a part corresponding to a centrally located area of the front or first main surface thereof, an organic insulator film which overlies the semiconductor chip and which has an opening in correspondence with the bonding pads, a plurality of leads which overly the organic insulator film, and a molding resin with which these constituents are sealed or packaged.
摘要:
A semiconductor memory device is provided which includes a plurality of data lines coupled to memory cells and to a detecting arrangement for detecting if logical levels of each of the data lines coincide to each other or not. A test read arrangement is also provided which stores the same information, in advance, in plural memory cells so that if there is a defect in one of the memory cells, this can be detected by the detecting arrangement.