摘要:
A ridge waveguide semiconductor laser includes an active layer, semiconductor layers on the active layer and having a ridge-shaped waveguide, an insulating film on the semiconductor layer, a first electrode layer in contact with the semiconductor layer through an opening in the insulating film, and a second electrode layer on the first electrode layer having a stripe shape and extending along the waveguide. A distance from an end face of a resonator of the laser to an edge of the second electrode layer does not exceed 20 μm.
摘要:
A laser device includes a double hetero-structure element constructed by depositing a p-type cladding layer, a quantum well active layer, an n-type thin first cladding layer and an n-type thick second cladding layer sequentially. A ridge-waveguide is shaped between two trenches formed in the second cladding layer. The first cladding layer serves as an etching stopper while etching the second cladding layer to form the two trenches. The trenches reach to or reach in vicinity to the surface of the first cladding layer. High-resistance regions may be formed in portions of the first cladding layer directly underneath the trenches. The thin first cladding layer, suppresses leakage current and improves the temperature characteristics and the operating speed characteristics of the laser device.
摘要:
A distributed feedback laser device includes a semiconductor base having a ridge waveguide structure projecting from its principal plane. The ridge waveguide structure extends with a predetermined width from one edge of the semiconductor base to an opposite edge. A diffraction grating layer is confined within the ridge structure. The ridge waveguide structure is formed by etching using an SiO2 film and a resist film as masks so that the diffraction grating layer is produced with substantially the same width as, or a less width than, the width of the ridge waveguide structure. A &lgr;/4 shift diffraction grating or a chirped diffraction grating is preferably employed.
摘要:
An electrode for a semiconductor device includes a gold-containing thin film and a gold-containing plated film on the thin film. The plated film covers the entire thin film. No open surface is present between the thin gold film and the gold plating so no excessive current concentration occurs in any area.
摘要:
A semiconductor laser device includes: an electrically insulating film, on the top face of a laser chip; and a metal film, on the electrically insulating film. The electrically insulating film and/or the metal film has, in plan, a polygonal shave with five or more apexes, each of the apexes having an interior angle less than 180 degrees. Stress due to a change of temperature during operation is reduced, resulting in a semiconductor laser device having a longer life and higher reliability.
摘要:
A semiconductor laser device includes: an electrically insulating film on the top face of a laser chip; and a metal film, on the electrically insulating film. The electrically insulating film and/or the metal film has, in plan, a polygonal shape with five or more apexes, each of the apexes having an interior angle less than 180 degrees. Stress due to a change of temperature during operation is reduced, resulting in a semiconductor laser device having a longer life and higher reliability.
摘要:
A method of making a semiconductor optical device, including an integrated laser diode and optical waveguide lens with a continuous resonator extending along a resonator length direction between a pair of resonator facets, includes forming a pair of dielectric films disposed on a surface of a substrate on which a semiconductor layer of the optical waveguide is to be grown, the dielectric films having a linear symmetry about a hypothetical line extending in the resonator length direction, having edges opposing each other and parallel to the hypothetical line, and widths perpendicular to the resonator length direction that gradually narrow toward one facet from a position in the resonator length direction of the films. A mask pattern that produces a precise layer thickness profile is easily designed.
摘要:
A semiconductor optical device includes an active layer, a current blocking layer on both sides of the active layer, and a cladding layer on both the active layer and the current blocking layer. The current blocking layer includes a buried layer, at least one intermediate layer of Al(Ga)InAs and a cover blocking layer. The cover blocking layer is located between the cladding layer and the Al(Ga)InAs layers and has a higher oxidation resistance than the Al(Ga)InAs layer. The current blocking layer is grown such that each Al(Ga)InAs layer is not exposed at the surface of the current blocking layer.
摘要:
A semiconductor optical device includes an active layer, a current blocking layer on both sides of the active layers and a cladding layer on both the active layer and the current blocking layer. The current blocking layer includes a buried layer, at least one intermediate layer of Al(Ga)InAs and a cover blocking layer. The cover blocking layer is located between the cladding layer and the Al(Ga)InAs layers and has a higher oxidation resistance than the Al(Ga)InAs layer. The current blocking layer is grown such that each Al(Ga)InAs layer is not exposed at the surface of the current blocking layer.
摘要:
A ridge waveguide distributed feedback laser includes a p-type InGaAsP grating layer having a p-type carrier density ranging from 1.5×1018 cm−3 to 4.0×10−3 cm−3 and preferably from 2.0×1018 cm−3 to 3.0×1018 cm−3. In combination with such raised levels of p-type carrier density in the InGaAsP grating layer, the p-type carrier density may also be enhanced both in a p-type InP layer between the grating layer and a contact layer, and in another p-type InP layer between the grating layer and a quantum well active layer, the density ranging from 1.5×1018 cm−3 to 4.0×1018 cm−3 and preferably from 2.0×1018 cm−3 to 3.0×1018 cm−3.
摘要翻译:脊波导分布反馈激光器包括p型InGaAsP光栅层,其具有范围为1.5×10 18 cm -3至4.0×10 -3 cm -3的p型载流子密度,优选为2.0×10 <18>厘米-3 -3.0×10 18 cm -3。 结合InGaAsP光栅层中p型载流子浓度的这种升高的水平,p型载流子密度也可以在光栅层和接触层之间的p型InP层中增强, 在光栅层和量子阱活性层之间的InP层的密度范围为1.5×10 18 cm -3至4.0×10 18 cm -3,优选为2.0×10 18 cm -3, 3> 3.0×10 18 cm -3。