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36 条记录 (耗时 0.03 秒)

    Shoe
    6.
    发明申请
    Shoe 有权
    鞋

    公开(公告)号：US20080112655A1

    公开(公告)日：2008-05-15

    申请号：US11793124

    申请日：2005-12-26

    申请人： Hiroshi Kanemitsu ,  Masaru Yoshikawa ,  Masaharu Hatta

    发明人： Hiroshi Kanemitsu ,  Masaru Yoshikawa ,  Masaharu Hatta

    IPC分类号： F16C33/10

    CPC分类号： F04B27/0886 ,  F05C2253/12 ,  F16C33/106 ,  F16C33/14 ,  Y10T74/18336

    摘要： A hemispherical shoe 4 is equipped with a sliding surface 4A which slides with a swash plate 3, and a hemispherical convex 4B. Hardening is performed by radiating a laser so that a lot of minute circles 6 may be drawn on the sliding surface 4A. Then, lapping is given to the sliding surface 4A and, finally buffing is given. Thereby, the lot of annular swelling portions 7′ and concavities 8′ are formed in positions of the circles 6, and further, lubricating oil passages 10′ which include net-like concavities are formed in the sliding surface 4A. A hardening part is formed of the lot of above-mentioned annular swelling portions 7′. The above-mentioned annular swelling portions 7′ are formed so that a ratio of an area of a total of all the above-described annular swelling portions 7′ occupies in an area of the sliding surface 4A which is a hardening object domain may become 0.3 to 0.8. It is possible to provide the shoe 4 which is good in seize resistance in comparison with the past.

    摘要翻译： 半球形鞋4配备有用斜盘3滑动的滑动面4A和半球形凸部B.通过照射激光进行硬化，使得可以在滑动面4上绘制大量的微小圆圈6 A.然后，对滑动面4A进行研磨，最后给出抛光。 由此，在圆6的位置上形成有多个环状的隆起部7'和凹部8'，在滑动面4B上形成有网状凹部的润滑油路10'。硬化部为 由许多上述环形隆起部分7'形成。 上述环形隆起部分7'形成为使得所有上述环形隆起部分7'的总面积的比例占据作为硬化对象域的滑动表面4A的区域中， 0.3〜0.8。 可以提供与过去相比具有良好抵抗力的鞋4。

    Polishing liquid
    7.
    发明授权
    Polishing liquid 有权
    抛光液

    公开(公告)号：US08715524B2

    公开(公告)日：2014-05-06

    申请号：US12036686

    申请日：2008-02-25

    申请人： Tetsuya Kamimura ,  Toshiyuki Saie ,  Masaru Yoshikawa

    发明人： Tetsuya Kamimura ,  Toshiyuki Saie ,  Masaru Yoshikawa

    IPC分类号： C09K13/00 ,  H01L21/302

    CPC分类号： C23F3/00 ,  C09G1/02 ,  H01L21/3212

    摘要： The invention provides a polishing liquid for polishing a barrier layer of a semiconductor integrated circuit, the polishing liquid comprising: a diquaternary ammonium cation; a corrosion inhibiting agent; and a colloidal silica, wherein the pH of the polishing liquid is in the range of 2.5 to 5.0. According to the invention, a polishing liquid capable of achieving a superior barrier layer polishing rate, as well as suppressing the occurrence of scratching due to the agglomeration of solid abrasive grains can be provided.

    摘要翻译： 本发明提供了一种用于抛光半导体集成电路的阻挡层的抛光液，该抛光液包括：二季铵阳离子; 腐蚀抑制剂; 和胶体二氧化硅，其中抛光液的pH在2.5至5.0的范围内。 根据本发明，可以提供能够实现优异的阻挡层研磨速度的抛光液，以及抑制由于固体磨粒的凝聚而引起的刮擦的发生。

    Sliding device
    8.
    发明授权
    Sliding device 有权
    滑动装置

    公开(公告)号：US07892656B2

    公开(公告)日：2011-02-22

    申请号：US11662249

    申请日：2005-09-29

    申请人： Hiroshi Kanemitsu ,  Masaru Yoshikawa ,  Masaharu Hatta

    发明人： Hiroshi Kanemitsu ,  Masaru Yoshikawa ,  Masaharu Hatta

    IPC分类号： B23P9/00 ,  F04B27/10

    CPC分类号： F04B27/1054 ,  F04B27/0886 ,  F05C2201/0475 ,  F05C2201/0487 ,  F05C2203/06 ,  F05C2251/10 ,  F05C2253/12 ,  F16H23/00 ,  Y10T74/18336 ,  Y10T428/12993

    摘要： A sliding device 1 is constituted of a swash plate 3 including a first sliding surface 3A and a semispherical shoe 4 sliding with the swash plate 3. The swash plate 3 is constituted of a base material 3B of high strength brass containing Mn and Si, and very small granular Mn—Si compounds 6 are exposed on an inside of the base material 3B and on the first sliding surface 3A (surface of the base material 3B). The above described swash plate 3 increases in exposure amount of the Mn—Si compounds 6 exposed on the first sliding surface 3A by applying etching to the base material 3B after cutting the base material 3B. The sliding device 1 is favorable in seizure resistance and has a low manufacturing cost as compared with conventional sliding devices.

    摘要翻译： 滑动装置1由包括与斜盘3滑动的第一滑动面3A和半球形鞋4的旋转斜盘3构成。斜盘3由含有Mn和Si的高强度黄铜的基材3B构成， 非常小的粒状Mn-Si化合物6暴露在基材3B的内部和第一滑动面3A（基材3B的表面）上。 上述斜盘3通过在切割基材3B之后对基材3B进行蚀刻而使暴露在第一滑动表面3A上的Mn-Si化合物6的曝光量增加。 与传统的滑动装置相比，滑动装置1的耐咬合性良好，制造成本低。