Abstract:
This invention pertains to a color coatings blender apparatus to be used for color composition customization for the application of color coatings on 2D and 3D surfaces. The apparatus is comprised of a main body and interchangeable inserts all with central blender chambers and primary and secondary ports, and interchangeable spindles; the configurations of which are governed by coating technical characteristics. This invention integrates gradient specific programmable computer digital processes to function as internal editors, manipulate information and present the operator with multiple options and production overrides. This invention will make data analysis more interactive by utilizing existing external software applications as editors and expanding the process of visual communications for multiple purposes. While the blender apparatus, complete with external selectable appurtenances, can be used manually, it can also be combined with a programmable computer for producing physical gradient layers.
Abstract:
Semiconductor component or device is provided which includes a current barrier element and for which the impedance may be tuned (i.e. modified, changed, etc.) using a focused heating source.
Abstract:
Semiconductor component or device is provided which includes a current barrier element and for which the impedance may be tuned (i.e. modified, changed, etc.) using a focused heating source.
Abstract:
The invention relates to a method of iteratively, selectively tuning the impedance of integrated semiconductor devices, by modifying the dopant profile of a region of low dopant concentration by controlled diffusion of dopants from one or more adjacent regions of higher dopant concentration through the melting action of a focussed heating source, for example a laser. In particular the method is directed to increasing the dopant concentration of the region of lower dopant concentration, but may also be adapted to decrease the dopant concentration of the region.
Abstract:
A method is provided for tuning (i.e. modifying, changing) the impedance of semiconductor components or devices using a focused heating source. The method may be exploited for finely tuning the impedance of semiconductor components or devices, by modifying the dopant profile of a region of low dopant concentration (i.e. increasing the dopant concentration) by diffusion of dopants from adjacent regions of higher dopant concentration through the melting action of a focused heating source, for example a laser. The present invention is in particular directed to the use of lasers in relation to circuits for the creation of conductive links and pathways where none existed before. The present invention more particularly relates to a means wherein impedance modification (i.e. trimming or tuning) may advantageously be carried out as a function of the location of one or more conductive bridge(s) along the length of a gap region.
Abstract:
A method is provided for tuning (i.e. modifying, changing) the impedance of semiconductor components or devices using a focused heating source. The method may be exploited for finely tuning the impedance of semiconductor components or devices, by modifying the dopant profile of a region of low dopant concentration (i.e. increasing the dopant concentration) by diffusion of dopants from adjacent regions of higher dopant concentration through the melting action of a focused heating source, for example a laser. The present invention is in particular directed to the use of lasers in relation to circuits for the creation of conductive links and pathways where none existed before. The present invention more particularly relates to a means wherein impedance modification (i.e. trimming or tuning) may advantageously be carried out as a function of the location of one or more conductive bridge(s) along the length of a gap region.
Abstract:
A method is provided for tuning (i.e. modifying, changing) the impedance of semiconductor components or devices using a focused heating source. The method may be exploited for finely tuning the impedance of semiconductor components or devices, by modifying the dopant profile of a region of low dopant concentration (i.e. increasing the dopant concentration) by diffusion of dopants from adjacent regions of higher dopant concentration through the melting action of a focused heating source, for example a laser. The present invention is in particular directed to the use of lasers in relation to circuits for the creation of conductive links and pathways where none existed before. The present invention more particularly relates to a means wherein impedance modification (i.e. trimming or tuning) may advantageously be carried out as a function of the location of one or more conductive bridge(s) along the length of a gap region.
Abstract:
A method and apparatus is disclosed for performing a multi-equalization of a transmitted signal on a channel having varying characteristics comprising equalizing the transmitted signal using a plurality of setting defining a plurality of equalizing functions to provide a corresponding plurality of symbol signal, synchronizing each of the plurality of symbol signals to provide a plurality of synchronized signals, selecting at least one of the plurality of synchronized signals according to at least one transmission performance criterion and providing the selected one of the plurality of synchronized signals.
Abstract:
In a method of data transmission according to one embodiment of the invention, data transitions on adjacent conductors are separated in time. In a method of data transmission according to another embodiment of the invention, signals on adjacent conductive paths pass through different alternating sequences of inversions and regenerations. In a method of data transmission according to a further embodiment of the invention, data transitions having the same clock dependence are separated in space.
Abstract:
A multicomputer chip has a common bus and up to ten microcomputers connected in parallel to the common bus via routers contained in the microcomputers. The common bus can be connected to an external bus by means of a router mounted on or off the chip. Any defective computer found during testing can be rendered inactive by assigning it an unused address and, in this way, the remaining computers are unaffected. Instead of providing each multicomputer on a separate chip, a complete wafer may be manufactured so that it contains many of the multicomputers. A hierarchical bus system interconnects the multicomputers so as to permit efficient routing of data between the various computers.