公开(公告)号：US07910429B2

公开(公告)日：2011-03-22

申请号：US10821100

申请日：2004-04-07

申请人： Zhong Dong ,  Chuck Jang ,  Ching-Hwa Chen ,  Chunchieh Huang ,  Jin-Ho Kim ,  Vei-Han Chan ,  Chung Wai Leung ,  Chia-Shun Hsiao ,  George Kovall ,  Steven Ming Yang

发明人： Zhong Dong ,  Chuck Jang ,  Ching-Hwa Chen ,  Chunchieh Huang ,  Jin-Ho Kim ,  Vei-Han Chan ,  Chung Wai Leung ,  Chia-Shun Hsiao ,  George Kovall ,  Steven Ming Yang

IPC分类号： H01L21/336

CPC分类号： H01L21/28273 ,  H01L29/42328 ,  H01L29/513 ,  H01L29/7881

摘要： Conventional fabrication of sidewall oxide around an ONO-type memory cell stack usually produces Bird's Beak because prior to the fabrication, there is an exposed sidewall of the ONO-type memory cell stack that exposes side parts of a plurality of material layers respectively composed of different materials. Certain materials in the stack such as silicon nitrides are more difficult to oxidize than other materials in the stack such polysilicon. As a result oxidation does not proceed uniformly along the multi-layered height of the sidewall. The present disclosure shows how radical-based fabrication of sidewall dielectric can help to reduce the Bird's Beak formation. More specifically, it is indicated that short-lived oxidizing agents (e.g., atomic oxygen) are able to better oxidize difficult to oxidize materials such as silicon nitride and the it is indicated that the short-lived oxidizing agents alternatively or additionally do not diffuse as deeply through already oxidized layers of the sidewall such as silicon oxide layers. As a result, a more uniform sidewall dielectric can be fabricated with more uniform breakdown voltages along it height.

摘要翻译： 通常在ONO型存储单元堆叠周围制造侧壁氧化物通常产生鸟喙，因为在制造之前，存在ONO型存储单元堆叠的暴露的侧壁，其暴露分别由不同的多个材料层组成的多个材料层的侧面部分 材料 堆叠中的某些材料如氮化硅比堆叠中的其它材料更难以氧化，这样的多晶硅。 结果，氧化不沿着侧壁的多层高度均匀地进行。 本公开显示了基于侧壁电介质的基于基础的制造有助于减少鸟喙形成。 更具体地，表明短寿命氧化剂（例如原子氧）能够更好地氧化难以氧化的材料如氮化硅，并且表明短寿命氧化剂交替地或另外不扩散为 深深地通过侧壁的已氧化层，例如氧化硅层。 结果，可以制造更均匀的侧壁电介质，沿其高度具有更均匀的击穿电压。

公开(公告)号：US20060017092A1

公开(公告)日：2006-01-26

申请号：US10898273

申请日：2004-07-23

申请人： Zhong Dong ,  Chuck Jang ,  Ching-Hwa Chen ,  Chia-Shun Hsiao

发明人： Zhong Dong ,  Chuck Jang ,  Ching-Hwa Chen ,  Chia-Shun Hsiao

IPC分类号： H01L21/8242 ,  H01L21/336

CPC分类号： H01L27/11526 ,  H01L21/28273 ,  H01L27/105 ,  H01L27/11546 ,  H01L29/42324

摘要： Conventional fabrication of top oxide in an ONO-type memory cell stack usually produces Bird's Beak. Certain materials in the stack such as silicon nitrides are relatively difficult to oxidize. As a result oxidation does not proceed uniformly along the multi-layered height of the ONO-type stack. The present disclosure shows how radical-based fabrication of top-oxide of an ONO stack (i.e. by ISSG method) can help to reduce formation of Bird's Beak. More specifically, it is indicated that short-lived oxidizing agents (e.g., atomic oxygen) are able to better oxidize difficult to oxidize materials such as silicon nitride and the it is indicated that the short-lived oxidizing agents alternatively or additionally do not diffuse deeply through already oxidized layers of the ONO stack such as the lower silicon oxide layer. As a result, a more uniform top oxide dielectric can be fabricated with more uniform breakdown voltages along its height. Additionally, adjacent low and high voltage transistors may benefit from simultaneous formation of their gate dielectrics with use of the radical-based oxidizing method.

摘要翻译： ONO型记忆体堆叠中的顶层氧化物的常规制造通常产生Bird's Beak。 叠层中的某些材料如氮化硅相对难以氧化。 因此，氧化不会沿着ONO型堆叠的多层高度均匀地进行。 本公开显示了如何基于根基的ONO堆叠的顶部氧化物的制造（即通过ISSG方法）可以帮助减少Bird's Beak的形成。 更具体地，表明短寿命氧化剂（例如原子氧）能够更好地氧化难以氧化的材料，例如氮化硅，并且表明短寿命氧化剂交替地或另外不会扩散深 通过已经氧化的ONO堆叠层，例如较低的氧化硅层。 结果，可以制造更均匀的顶部氧化物电介质，沿其高度具有更均匀的击穿电压。 此外，相邻的低压和高压晶体管可以受益于使用基于自由基的氧化方法同时形成其栅极电介质。

公开(公告)号：US20050227437A1

公开(公告)日：2005-10-13

申请号：US10821100

申请日：2004-04-07

申请人： Zhong Dong ,  Chuck Jang ,  Ching-Hwa Chen ,  Chunchieh Huang ,  Jin-Ho Kim ,  Vei-Han Chan ,  Chung Leung ,  Chia-Shun Hsiao ,  George Kovall ,  Steven Yang

发明人： Zhong Dong ,  Chuck Jang ,  Ching-Hwa Chen ,  Chunchieh Huang ,  Jin-Ho Kim ,  Vei-Han Chan ,  Chung Leung ,  Chia-Shun Hsiao ,  George Kovall ,  Steven Yang

IPC分类号： H01L21/28 ,  H01L21/336 ,  H01L29/423 ,  H01L29/51 ,  H01L29/788

CPC分类号： H01L21/28273 ,  H01L29/42328 ,  H01L29/513 ,  H01L29/7881

摘要： Conventional fabrication of sidewall oxide around an ONO-type memory cell stack usually produces Bird's Beak because prior to the fabrication, there is an exposed sidewall of the ONO-type memory cell stack that exposes side parts of a plurality of material layers respectively composed of different materials. Certain materials in the stack such as silicon nitrides are more difficult to oxidize than other materials in the stack such polysilicon. As a result oxidation does not proceed uniformly along the multi-layered height of the sidewall. The present disclosure shows how radical-based fabrication of sidewall dielectric can help to reduce the Bird's Beak formation. More specifically, it is indicated that short-lived oxidizing agents (e.g., atomic oxygen) are able to better oxidize difficult to oxidize materials such as silicon nitride and the it is indicated that the short-lived oxidizing agents alternatively or additionally do not diffuse as deeply through already oxidized layers of the sidewall such as silicon oxide layers. As a result, a more uniform sidewall dielectric can be fabricated with more uniform breakdown voltages along it height.

摘要翻译： 通常在ONO型存储单元堆叠周围制造侧壁氧化物通常产生鸟喙，因为在制造之前，存在ONO型存储单元堆叠的暴露的侧壁，其暴露分别由不同的多个材料层组成的多个材料层的侧面部分 材料 堆叠中的某些材料如氮化硅比堆叠中的其它材料更难以氧化，这样的多晶硅。 结果，氧化不沿着侧壁的多层高度均匀地进行。 本公开显示了基于侧壁电介质的基于基础的制造有助于减少鸟喙形成。 更具体地，表明短寿命氧化剂（例如原子氧）能够更好地氧化难以氧化的材料如氮化硅，并且表明短寿命氧化剂交替地或另外不扩散为 深深地通过侧壁的已氧化层，例如氧化硅层。 结果，可以制造更均匀的侧壁电介质，沿其高度具有更均匀的击穿电压。

公开(公告)号：US07297597B2

公开(公告)日：2007-11-20

申请号：US10898273

申请日：2004-07-23

申请人： Zhong Dong ,  Chuck Jang ,  Ching-Hwa Chen ,  Chia-Shun Hsiao

发明人： Zhong Dong ,  Chuck Jang ,  Ching-Hwa Chen ,  Chia-Shun Hsiao

IPC分类号： H01L21/336

CPC分类号： H01L27/11526 ,  H01L21/28273 ,  H01L27/105 ,  H01L27/11546 ,  H01L29/42324

摘要： Conventional fabrication of top oxide in an ONO-type memory cell stack usually produces Bird's Beak. Certain materials in the stack such as silicon nitrides are relatively difficult to oxidize. As a result oxidation does not proceed uniformly along the multi-layered height of the ONO-type stack. The present disclosure shows how radical-based fabrication of top-oxide of an ONO stack (i.e. by ISSG method) can help to reduce formation of Bird's Beak. More specifically, it is indicated that short-lived oxidizing agents (e.g., atomic oxygen) are able to better oxidize difficult to oxidize materials such as silicon nitride and the it is indicated that the short-lived oxidizing agents alternatively or additionally do not diffuse deeply through already oxidized layers of the ONO stack such as the lower silicon oxide layer. As a result, a more uniform top oxide dielectric can be fabricated with more uniform breakdown voltages along its height. Additionally, adjacent low and high voltage transistors may benefit from simultaneous formation of their gate dielectrics with use of the radical-based oxidizing method.

摘要翻译： ONO型记忆体堆叠中的顶层氧化物的常规制造通常产生Bird's Beak。 叠层中的某些材料如氮化硅相对难以氧化。 因此，氧化不会沿着ONO型堆叠的多层高度均匀地进行。 本公开显示了如何基于根基的ONO堆叠的顶部氧化物的制造（即通过ISSG方法）可以帮助减少Bird's Beak的形成。 更具体地，表明短寿命氧化剂（例如原子氧）能够更好地氧化难以氧化的材料，例如氮化硅，并且表明短寿命氧化剂交替地或另外不会扩散深 通过已经氧化的ONO堆叠层，例如较低的氧化硅层。 结果，可以制造更均匀的顶部氧化物电介质，沿其高度具有更均匀的击穿电压。 此外，相邻的低压和高压晶体管可以受益于使用基于自由基的氧化方法同时形成其栅极电介质。

公开(公告)号：US07323729B2

公开(公告)日：2008-01-29

申请号：US11431087

申请日：2006-05-04

申请人： Zhong Dong ,  Chuck Jang ,  Chia-Shun Hsiao

发明人： Zhong Dong ,  Chuck Jang ,  Chia-Shun Hsiao

IPC分类号： H01L29/76

CPC分类号： H01L21/02164 ,  H01L21/02211 ,  H01L21/02271 ,  H01L21/02337 ,  H01L21/28158 ,  H01L21/3105 ,  H01L21/31612

摘要： A method and apparatus are disclosed for reducing the concentration of chlorine and/or other bound contaminants within a semiconductor oxide composition that is formed by chemical vapor deposition (CVD) using a semiconductor-element-providing reactant such as dichlorosilane (DCS) and an oxygen-providing reactant such as N2O. In one embodiment, a DCS-HTO film is annealed by heating N2O gas to a temperature in the range of about 825° C. to about 950° C. so as to trigger exothermic decomposition of the N2O gas and flowing the heated gas across the DCS-HTO film so that disassociated atomic oxygen radicals within the heated N2O gas can transfer disassociating energy to chlorine atoms bound within the DCS-HTO film and so that the atomic oxygen radicals can fill oxygen vacancies within the semiconductor-oxide matrix of DCS-HTO film. An improved ONO structure may be formed with the annealed DCS-HTO film for use in floating gate or other memory applications.

摘要翻译： 公开了一种方法和装置，用于降低通过化学气相沉积（CVD）形成的半导体氧化物组合物中的氯和/或其它结合的污染物的浓度，所述半导体氧化物组合物使用提供半导体元素的反应物如二氯硅烷（DCS）和氧 提供反应物如N 2 O。 在一个实施方案中，通过将N 2 O 2气体加热至约825℃至约950℃的温度来退火DCS-HTO膜，以引发放热分解 N 2 O气体并使加热的气体流过DCS-HTO膜，使得加热的N 2 O气体内的解离的原子氧自由基能够将分解能量转移到结合的氯原子上 在DCS-HTO膜内，使得原子氧自由基可以填充DCS-HTO膜的半导体氧化物基质内的氧空位。 可以用退火的DCS-HTO膜形成改进的ONO结构，用于浮动栅极或其他存储器应用中。

公开(公告)号：US07071127B2

公开(公告)日：2006-07-04

申请号：US10442759

申请日：2003-05-20

申请人： Zhong Dong ,  Chuck Jang ,  Chia-Shun Hsiao

发明人： Zhong Dong ,  Chuck Jang ,  Chia-Shun Hsiao

IPC分类号： H01L21/469

CPC分类号： H01L21/02164 ,  H01L21/02211 ,  H01L21/02271 ,  H01L21/02337 ,  H01L21/28158 ,  H01L21/3105 ,  H01L21/31612

摘要： A method and apparatus are disclosed for reducing the concentration of chlorine and/or other bound contaminants within a semiconductor oxide composition that is formed by chemical vapor deposition (CVD) using a semiconductor-element-providing reactant such as dichlorosilane (DCS) and an oxygen-providing reactant such as N2O. In one embodiment, a DCS-HTO film is annealed by heating N2O gas to a temperature in the range of about 825° C. to about 950° C. so as to trigger exothermic decomposition of the N2O gas and flowing the heated gas across the DCS-HTO film so that disassociated atomic oxygen radicals within the heated N2O gas can transfer disassociating energy to chlorine atoms bound within the DCS-HTO film and so that the atomic oxygen radicals can fill oxygen vacancies within the semiconductor-oxide matrix of DCS-HTO film. An improved ONO structure may be formed with the annealed DCS-HTO film for use in floating gate or other memory applications.

摘要翻译： 公开了一种方法和装置，用于降低通过化学气相沉积（CVD）形成的半导体氧化物组合物中的氯和/或其它结合的污染物的浓度，所述半导体氧化物组合物使用提供半导体元素的反应物如二氯硅烷（DCS）和氧 提供反应物如N 2 O。 在一个实施方案中，通过将N 2 O 2气体加热至约825℃至约950℃的温度来退火DCS-HTO膜，以引发放热分解 N 2 O气体并使加热的气体流过DCS-HTO膜，使得加热的N 2 O气体内的解离的原子氧自由基能够将分解能量转移到结合的氯原子上 在DCS-HTO膜内，使得原子氧自由基可以填充DCS-HTO膜的半导体氧化物基质内的氧空位。 可以用退火的DCS-HTO膜形成改进的ONO结构，用于浮动栅极或其他存储器应用中。

公开(公告)号：US20060211270A1

公开(公告)日：2006-09-21

申请号：US11431087

申请日：2006-05-04

申请人： Zhong Dong ,  Chuck Jang ,  Chia-Shun Hsiao

发明人： Zhong Dong ,  Chuck Jang ,  Chia-Shun Hsiao

IPC分类号： H01L21/31

CPC分类号： H01L21/02164 ,  H01L21/02211 ,  H01L21/02271 ,  H01L21/02337 ,  H01L21/28158 ,  H01L21/3105 ,  H01L21/31612

摘要： A method and apparatus are disclosed for reducing the concentration of chlorine and/or other bound contaminants within a semiconductor oxide composition that is formed by chemical vapor deposition (CVD) using a semiconductor-element-providing reactant such as dichlorosilane (DCS) and an oxygen-providing reactant such as N2O. In one embodiment, a DCS-HTO film is annealed by heating N2O gas to a temperature in the range of about 825° C. to about 950 ° C. so as to trigger exothermic decomposition of the N2O gas and flowing the heated gas across the DCS-HTO film so that disassociated atomic oxygen radicals within the heated N2O gas can transfer disassociating energy to chlorine atoms bound within the DCS-HTO film and so that the atomic oxygen radicals can fill oxygen vacancies within the semiconductor-oxide matrix of DCS-HTO film. An improved ONO structure may be formed with the annealed DCS-HTO film for use in floating gate or other memory applications.

摘要翻译： 公开了一种方法和装置，用于降低通过化学气相沉积（CVD）形成的半导体氧化物组合物中的氯和/或其它结合的污染物的浓度，所述半导体氧化物组合物使用提供半导体元素的反应物如二氯硅烷（DCS）和氧 提供反应物如N 2 O。 在一个实施方案中，通过将N 2 O 2气体加热至约825℃至约950℃的温度来退火DCS-HTO膜，以引发放热分解 N 2 O气体并使加热的气体流过DCS-HTO膜，使得加热的N 2 O气体内的解离的原子氧自由基能够将分解能量转移到结合的氯原子上 在DCS-HTO膜内，使得原子氧自由基可以填充DCS-HTO膜的半导体氧化物基质内的氧空位。 可以用退火的DCS-HTO膜形成改进的ONO结构，用于浮动栅极或其他存储器应用中。

公开(公告)号：US07375027B2

公开(公告)日：2008-05-20

申请号：US10964317

申请日：2004-10-12

申请人： Kuei-Chang Tsai ,  Chunyuan Chao ,  Chia-Shun Hsiao

发明人： Kuei-Chang Tsai ,  Chunyuan Chao ,  Chia-Shun Hsiao

IPC分类号： H01L21/4763

CPC分类号： H01L21/76805 ,  H01L21/76802 ,  H01L21/76831

摘要： A contact via to a surface of a semiconductor material is provided, the contact via having a sidewall which is produced by anisotropically etching a dielectric layer which is placed on via openings. A protective layer is provided on the surface of the semiconductor material. To protect the substrate, an initial etch through an interlayer dielectric is performed to create an initial via which extends toward, but not into the substrate. At least a portion of the protective layer is retained on the substrate. In another step, the final contact via is created. During this step the protective layer is penetrated to open a via to the surface of the semiconductor material.

摘要翻译： 提供了通过半导体材料的表面的接触通孔，该接触通孔具有通过各向异性蚀刻放置在通孔上的电介质层产生的侧壁。 在半导体材料的表面上设置有保护层。 为了保护衬底，进行通过层间电介质的初始蚀刻，以产生向衬底延伸但不延伸到衬底中的初始通孔。 保护层的至少一部分保留在基板上。 在另一步中，创建最终的联系人通道。 在该步骤期间，保护层被穿透以将通孔打开到半导体材料的表面。

公开(公告)号：US20060079080A1

公开(公告)日：2006-04-13

申请号：US10964317

申请日：2004-10-12

申请人： Kuei-Chang Tsai ,  Chunyuan Chao ,  Chia-Shun Hsiao

发明人： Kuei-Chang Tsai ,  Chunyuan Chao ,  Chia-Shun Hsiao

IPC分类号： H01L21/4763

CPC分类号： H01L21/76805 ,  H01L21/76802 ,  H01L21/76831

摘要： A contact via to a surface of a semiconductor material is provided, the contact via having a sidewall which is produced by anisotropically etching a dielectric layer which is placed on via openings. A protective layer is provided on the surface of the semiconductor material. To protect the substrate, an initial etch through an interlayer dielectric is performed to create an initial via which extends toward, but not into the substrate. At least a portion of the protective layer is retained on the substrate. In another step, the final contact via is created. During this step the protective layer is penetrated to open a via to the surface of the semiconductor material.

摘要翻译： 提供了通过半导体材料的表面的接触通孔，该接触通孔具有通过各向异性蚀刻放置在通孔上的电介质层产生的侧壁。 在半导体材料的表面上设置保护层。 为了保护衬底，进行通过层间电介质的初始蚀刻，以产生向衬底延伸但不延伸到衬底中的初始通孔。 保护层的至少一部分保留在基板上。 在另一步中，创建最终的联系人通道。 在该步骤期间，保护层被穿透以将通孔打开到半导体材料的表面。

公开(公告)号：US07300745B2

公开(公告)日：2007-11-27

申请号：US10772520

申请日：2004-02-04

申请人： Chia-Shun Hsiao ,  Chunchieh Huang ,  Jin-Ho Kim ,  Kuei-Chang Tsai ,  Barbara Haselden ,  Daniel C. Wang

发明人： Chia-Shun Hsiao ,  Chunchieh Huang ,  Jin-Ho Kim ,  Kuei-Chang Tsai ,  Barbara Haselden ,  Daniel C. Wang

IPC分类号： H01L29/66 ,  H01L21/336

CPC分类号： H01L27/11539 ,  H01L27/115 ,  H01L27/11526

摘要： Nonvolatile memory wordlines (160) are formed as sidewall spacers on sidewalls of control gate structures (280). Each control gate structure may contain floating and control gates (120, 140), or some other elements. Pedestals (340) are formed adjacent to the control gate structures before the conductive layer (160) for the wordlines is deposited. The pedestals will facilitate formation of the contact openings (330.1) that will be etched in an overlying dielectric (310) to form contacts to the wordlines. The pedestals can be dummy structures. A pedestal can physically contact two wordlines.

摘要翻译： 非易失性存储器字线（160）形成为控制栅极结构（280）的侧壁上的侧壁间隔物。 每个控制栅极结构可以包含浮动和控制栅极（120,140）或一些其它元件。 在用于字线的导电层（160）被沉积之前，基座（340）形成为与控制栅极结构相邻。 基座将有助于形成将在上覆电介质（310）中蚀刻的接触开口（330.1），以形成与字线的接触。 基座可以是虚拟结构。 基座可以物理接触两个字线。