公开(公告)号：US07105909B2

公开(公告)日：2006-09-12

申请号：US10886965

申请日：2004-07-07

Applicant: Yu Lin ,  Ching-Chao Wang ,  Hung-Shen Chu

Inventor： Yu Lin ,  Ching-Chao Wang ,  Hung-Shen Chu

IPC: H01L29/00

CPC classification number: H05K3/38 ,  H05K1/0306 ,  H05K3/388

Abstract: A structural configuration and manufacture method is applied to manufacture electronic circuits on a ceramic substrate including capacitor and inductors for filters. The electronic circuits have strong bonding to securely adhere to the SOG-coated substrate when the SOG is cured at an elevated temperature supplemented with high nitrogen flow during the curing process. The SOG coated ceramic substrate shows excellent layer compatibilities during temperature variations because reduced differences of thermal coefficients between different layers.

Abstract translation: 应用结构构造和制造方法来制造包括用于滤波器的电容器和电感器的陶瓷基板上的电子电路。 当SOG在固化过程中在补充有高氮气流的升高的温度下固化时，电子电路具有牢固粘附以牢固地粘附到SOG涂覆的基底上。 SOG涂覆的陶瓷基板在温度变化期间显示出优异的层相容性，因为不同层之间的热系数的差异减小。

公开(公告)号：US20060049907A1

公开(公告)日：2006-03-09

申请号：US11156361

申请日：2005-06-20

Applicant: Chun-Tiao Liu

Inventor： Chun-Tiao Liu

IPC: H01F5/00

CPC classification number: H01F17/04 ,  H01F27/027 ,  H01F27/255 ,  H01F27/2828 ,  H01F27/292 ,  H01F2017/046 ,  H01F2017/048

Abstract: This invention discloses an inductor that includes a conducting wire composed of an alloy having temperature coefficients of resistance (TCR) approximately 0.0002 milliohm per Celsius degree or is lower. The inductive coil has a winding configuration provided for enclosure in a substantially rectangular box with a mid-plane extended along an elongated direction of the rectangular box wherein the conducting wire interesting at least twice near said mid-plane.

Abstract translation: 本发明公开了一种电感器，其包括由耐温度系数（TCR）约0.0002毫欧/摄氏度的合金构成的导线，或者更低。 感应线圈具有绕组配置，其被设置为围绕在矩形盒中的中间平面的大致矩形盒中，所述中间平面沿矩形盒的细长方向延伸，其中导线在所述中间平面附近有趣至少两次。

公开(公告)号：US20040239467A1

公开(公告)日：2004-12-02

申请号：US10447760

申请日：2003-05-28

Applicant: CYNTEC COMPANY

Inventor： Chun-Tiao Liu ,  Yi-Min Huang

IPC: H01F005/00

CPC classification number: H01F27/027 ,  H01F27/292 ,  H01F2017/046 ,  H01F2017/048

Abstract: This invention discloses a method for manufacturing an inductor by first press punching a first and a second layer of conductive plates into a first and second coil layers with a first and second inductor lead layers as single integrated layers. The manufacturing process further includes a step of overlapping and connecting the first and second coil layers to form an inductor. In a preferred embodiment, process of manufacturing further includes a step of mixing epoxy to bond with a highly magnetic material and pressure molding the bonding magnetic material around the coil layers to form an inductor.

Abstract translation: 本发明公开了一种用于制造电感器的方法，该方法首先将第一和第二导电板层压成第一和第二线圈层，第一和第二电感器引线层作为单个集成层。 制造工艺还包括重叠和连接第一和第二线圈层以形成电感器的步骤。 在优选实施例中，制造方法还包括将环氧树脂与高磁性材料混合并在线圈层周围加压成型接合磁性材料以形成电感器的步骤。

公开(公告)号：US5896081A

公开(公告)日：1999-04-20

申请号：US872564

申请日：1997-06-10

Applicant: Jackel Tzeng ,  Roger Hsieh ,  Duen-Jen Cheng

Inventor： Jackel Tzeng ,  Roger Hsieh ,  Duen-Jen Cheng

IPC: G01K7/18 ,  H01C7/10 ,  H01C17/00

CPC classification number: H01C17/006 ,  G01K7/183 ,  H01C7/10 ,  Y10T29/49082 ,  Y10T29/49085

Abstract: The present invention discloses a surface-mount resistance-temperature-detector (RTD) supported on a substrate. The surface-mount RTD includes a resistive strip disposed on a top surface of the substrate having a substantially linear temperature resistance coefficient (TCR) over a predetermined temperature range for measurement. The surface-mount RTD further includes two top terminals disposed on two opposite end on the top surface of the substrate wherein each of the top terminal connected to one end of the resistive strip. The surface-mount RTD further includes two bottom terminals disposed on a bottom surface of the substrate wherein each of the bottom terminals is disposed below one of the top terminals. The surface-mount RTD further includes two edge conductive plates each disposed on an edge surface of the substrate connected to one of the top terminals to a corresponding bottom terminal below. The surface-mount RTD further includes two surface mount solder electrodes wherein each solder electrode constituting a conductive layer overlying the top terminal, the edge conductive plate and the bottom terminal provided for performing a surface-mount soldering operation thereon. In a preferred embodiment, the surface-mount RTD further includes a passivation protective layer covering and protecting the resistive strip. In a preferred embodiment, the surface-mount RTD further includes two terminal-solder buffer pastes each disposed on top of the top surface terminal under the surface-mount solder electrode for buffering the top terminal and the solder electrode. In a preferred embodiment, the resistive strip is a platinum resistive strip having a temperature coefficient of resistance (TCR) ranging from 3000 to 3900 ppm/.degree.C.

Abstract translation: 本发明公开了一种支撑在基板上的表面安装电阻温度检测器（RTD）。 表面贴装RTD包括设置在基板的顶表面上的电阻条，该电阻条在预定的温度范围内具有基本线性的耐温系数（TCR），用于测量。 表面安装RTD还包括两个顶部端子，其设置在基板的顶表面上的两个相对端上，其中每个顶部端子连接到电阻带的一端。 表面安装RTD还包括设置在基板的底表面上的两个底部端子，其中每个底部端子设置在顶部端子之一的下方。 表面安装RTD还包括两个边缘导电板，每个边缘导电板设置在连接到顶部端子中的一个的基板的边缘表面上，到下面的相应的底部端子。 表面贴装RTD还包括两个表面贴装焊料电极，其中每个焊料电极构成覆盖顶部端子的导电层，边缘导电板和底部端子，用于在其上执行表面贴装焊接操作。 在优选实施例中，表面安装RTD还包括覆盖并保护电阻带的钝化保护层。 在优选实施例中，表面贴装RTD还包括两个末端焊料缓冲浆料，每个末端焊料缓冲浆料均设置在表面安装焊料电极下面的顶表面端子的顶部，用于缓冲顶部端子和焊料电极。 在优选实施例中，电阻条是具有3000至3900ppm /℃范围内的电阻温度系数（TCR）的铂电阻条。

公开(公告)号：US5850171A

公开(公告)日：1998-12-15

申请号：US692449

申请日：1996-08-05

Applicant: Barry Lin ,  Shih Chang Liao ,  Duen Jen Cheng

Inventor： Barry Lin ,  Shih Chang Liao ,  Duen Jen Cheng

IPC: H01C1/16 ,  H01C13/02 ,  H01L27/08 ,  H05K1/03 ,  H05K3/00 ,  H05K3/34 ,  H05K3/40 ,  H01C1/01 ,  H01C1/14

CPC classification number: H01C13/02 ,  H01C1/16 ,  H01L27/0802 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/403

Abstract: The present invention discloses a resistive circuit. The resistive circuit includes a plurality of resistor networks disposed on a substrate. The resistor networks also includes a plurality of resistive circuit elements. The resistor networks further includes a plurality of termination contacts each connected to one of the resistive circuit elements. Each of the termination contacts is disposed on an edge of the substrate and each of the termination contacts is separated from a next termination contact by an edge trench disposed on the edge of the substrate whereby a distance across the edge trench defining a pitch between the termination contacts.

Abstract translation: 本发明公开了一种电阻电路。 电阻电路包括设置在基板上的多个电阻网络。 电阻网络还包括多个电阻电路元件。 电阻网络还包括多个终端触点，每个终端触点都连接到电阻电路元件之一。 每个终端触点设置在衬底的边缘上，并且每个终端触点通过设置在衬底的边缘上的边缘沟槽与下一终端触点分开，从而跨越边缘沟槽的距离限定了终端之间的间距 联系人

公开(公告)号：US20060077020A1

公开(公告)日：2006-04-13

申请号：US10963705

申请日：2004-10-13

Applicant: Chung-Hsiung Wang ,  Keng-Hong Wang

Inventor： Chung-Hsiung Wang ,  Keng-Hong Wang

IPC: H01P1/203

CPC classification number: H01P1/20381

Abstract: A filter circuit that includes a thin film layer supported on a substrate serving as a medium layer for a capacitor formed between a top electrode layer and a bottom electrode layer formed above and below the thin film layer. The top electrode layer is patterned into microstrips for functioning as an inductor for the filter circuit.

Abstract translation: 一种滤波器电路，其包括薄膜层，该薄膜层支撑在形成在薄膜层上下形成的顶部电极层和底部电极层之间的用于形成电容器的介质层的基板上。 顶部电极层被图案化成微带，用作滤波器电路的电感器。

公开(公告)号：US6151771A

公开(公告)日：2000-11-28

申请号：US274736

申请日：1999-03-23

Applicant: Jackel Tzeng ,  Roger Hsieh ,  Duen-Jen Cheng

Inventor： Jackel Tzeng ,  Roger Hsieh ,  Duen-Jen Cheng

IPC: G01K7/18 ,  H01C7/10 ,  H01C17/00

CPC classification number: H01C17/006 ,  G01K7/183 ,  H01C7/10 ,  Y10T29/49082 ,  Y10T29/49085

Abstract: The present invention discloses a method for manufacturing a surface mount resistance-temperature-detector (RTD) on a substrate. The manufacture method includes the steps of (a) depositing a resistive thin film on a top surface of the substrate having a substantially linear temperature resistance coefficient (TCR) over a predetermined temperature range for temperature measurement; (b) patterning the resistive film into a plurality of resistive strips and a plurality of top terminals near two opposite edges on the top surface of the substrate with each resistive strip connected between two top terminals; (c) forming a bottom electrode on a bottom surface of the substrate underneath each of the top terminals; (d) depositing two edge conductive plates on edge surfaces of the substrate for connecting one of the top terminals to a bottom terminal thereunder; and (e) forming two surface mount solder electrodes with a conductive layer overlying the top terminal, the edge conductive plate and the bottom terminal provided for performing a surface-mount soldering operation thereon.

Abstract translation: 本发明公开了一种在基板上制造表面安装电阻温度检测器（RTD）的方法。 该制造方法包括以下步骤：（a）在具有基本上线性的耐温系数（TCR）的基板的顶表面上沉积电阻薄膜超过预定温度范围进行温度测量; （b）将电阻膜图案化成多个电阻条和位于基板顶表面两个相对边缘附近的多个顶端，每个电阻条连接在两个顶端之间; （c）在每个顶端子下面的衬底的底表面上形成底电极; （d）在所述基板的边缘表面上沉积两个边缘导电板，用于将所述顶部端子中的一个连接到其下面的底部端子; 和（e）形成两个表面贴装的焊料电极，其上覆盖着顶部端子，边缘导电板和底部端子，用于在其上执行表面贴装焊接操作。

公开(公告)号：US20090009281A1

公开(公告)日：2009-01-08

申请号：US11825488

申请日：2007-07-06

Applicant: Chung-Hsiung Wang ,  Yu-Liang Song ,  Qing-Feng Song ,  Yu-Qiao Li ,  Jian-Da Qiu ,  Meng Liu

Inventor： Chung-Hsiung Wang ,  Yu-Liang Song ,  Qing-Feng Song ,  Yu-Qiao Li ,  Jian-Da Qiu ,  Meng Liu

IPC: H01H85/04 ,  H01L21/44

CPC classification number: H01H85/006 ,  H01H69/022 ,  H01H85/0418 ,  H01H85/046 ,  H01H85/11 ,  H01H2085/0414

Abstract: A fuse element comprises a substrate having a top surface, a bottom surface opposite to said top surface, and side surfaces, a heat insulation layer including a first surface and a second surface opposite to said first surface, said first surface of said heat insulation layer disposed on said top surface of said substrate, and said second surface having a surface roughness, a protective layer disposed above said heat insulation layer, and a fuse layer disposed between said heat insulation layer and said protective layer.

Abstract translation: 熔丝元件包括具有顶表面，与所述顶表面相对的底表面和侧表面的基底，包括第一表面和与所述第一表面相对的第二表面的绝热层，所述绝热层的所述第一表面 设置在所述基板的所述顶表面上，所述第二表面具有表面粗糙度，设置在所述绝热层上方的保护层，以及设置在所述绝热层和所述保护层之间的熔丝层。

公开(公告)号：US20060034029A1

公开(公告)日：2006-02-16

申请号：US11204566

申请日：2005-08-15

Applicant: Chung Wang

Inventor： Chung Wang

IPC: H02H5/04

CPC classification number: G01R19/0092 ,  G01R19/32

Abstract: This invention discloses a current detector formed on a multiple-layered structure with a resistor supported thereon. The multiple-layered structure further includes a heat dissipation layer for dissipating heat generated from the resistor. In a preferred embodiment, the current detector further includes conductive blocks formed by a microelectronic casting process for functioning as part of electrodes for the current detector. In another preferred embodiment, the current detector further includes wrapping around electrodes each with a side conductive surface wrapping around a side surface of the multiple-layered structure.

Abstract translation: 本发明公开了一种形成在多层结构上的电流检测器，其上装有电阻器。 多层结构还包括用于耗散从电阻器产生的热量的散热层。 在优选实施例中，电流检测器还包括由微电子铸造工艺形成的导电块，用作电流检测器的电极的一部分。 在另一优选实施例中，电流检测器还包括围绕电极缠绕，每个电极具有围绕多层结构的侧表面缠绕的侧导电表面。

公开(公告)号：US20060049906A1

公开(公告)日：2006-03-09

申请号：US10937465

申请日：2004-09-08

Applicant: Chun-Tiao Liu ,  Stanely Chen ,  Roger Hsieh ,  Yimin Huang ,  Wei-Ching Chuang

Inventor： Chun-Tiao Liu ,  Stanely Chen ,  Roger Hsieh ,  Yimin Huang ,  Wei-Ching Chuang

IPC: H01F5/00

CPC classification number: H01F27/027 ,  H01F17/04 ,  H01F27/255 ,  H01F27/2828 ,  H01F27/292 ,  H01F2017/046 ,  H01F2017/048

Abstract: This invention discloses an inductor includes a conducting wire having a winding configuration provided for enclosure in a substantially rectangular box with a mid-plane extended along an elongated direction of the rectangular box wherein the conducting wire interesting at least twice near said mid-plane.

Abstract translation: 本发明公开了一种电感器，其包括具有绕组配置的导线，该绕组配置用于围绕矩形箱体围成矩形箱体，该中间板沿矩形箱体的细长方向延伸，其中导线在所述中间平面附近有趣至少两次。