公开(公告)号：US20060220244A1

公开(公告)日：2006-10-05

申请号：US11082298

申请日：2005-03-17

Applicant: Szu Lu ,  Hsin-Hui Lee ,  Chung Wang ,  Mirng-Ji Lii

Inventor： Szu Lu ,  Hsin-Hui Lee ,  Chung Wang ,  Mirng-Ji Lii

IPC: H01L23/48

CPC classification number: H01L24/10 ,  H01L23/3114 ,  H01L23/49816 ,  H01L24/13 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05559 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/00011 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2224/81805 ,  H01L2924/013

Abstract: A semiconductor package assembly comprises a first conductive pad on a semiconductor substrate; a second conductive pad on a package substrate; a bump physically coupled between the first conductive pad and the second conductive pad, wherein the bump is substantially lead-free or high-lead-containing; the bump has a first interface with the first conductive pad, the first interface having a first linear dimension; the bump has a second interface with the second conductive pad, the second interface having a second linear dimension; and wherein the ratio of the first linear dimension and the second linear dimension is between about 0.7 and about 1.7.

Abstract translation: 半导体封装组件包括半导体衬底上的第一导电焊盘; 封装衬底上的第二导电焊盘; 物理耦合在所述第一导电焊盘和所述第二导电焊盘之间的突起，其中所述突起基本上是无铅或高含铅的; 所述凸块具有与所述第一导电焊盘的第一界面，所述第一界面具有第一线性尺寸; 所述凸块具有与所述第二导电焊盘的第二接口，所述第二接口具有第二线性尺寸; 并且其中所述第一线性尺寸和所述第二线性尺寸的比率在约0.7和约1.7之间。

公开(公告)号：US07930051B2

公开(公告)日：2011-04-19

申请号：US12108407

申请日：2008-04-23

Applicant: David B. Adair ,  James V. Burrell ,  Charles Chao ,  Mohan K. Gupta ,  Melissa Hirota ,  Patrick Jaillet ,  Lalit Jain ,  John Kealoha, III ,  Ryan K. Kita ,  Quang N. Mai ,  Dirk Niemeyer ,  Nirod Samal ,  Chung Wang ,  Flora F. Wang ,  Andrea L. Whobrey

Inventor： David B. Adair ,  James V. Burrell ,  Charles Chao ,  Mohan K. Gupta ,  Melissa Hirota ,  Patrick Jaillet ,  Lalit Jain ,  John Kealoha, III ,  Ryan K. Kita ,  Quang N. Mai ,  Dirk Niemeyer ,  Nirod Samal ,  Chung Wang ,  Flora F. Wang ,  Andrea L. Whobrey

IPC: G06F19/00 ,  G06F15/02 ,  G06F17/50 ,  G06F9/46 ,  G06F9/44 ,  G05B19/418 ,  G06Q10/00 ,  A01K5/02

CPC classification number: G06Q10/087 ,  G06Q10/063 ,  G06Q10/0631 ,  G06Q10/06311 ,  G06Q10/06312 ,  G06Q10/06315 ,  G06Q10/0875 ,  G06Q30/0201

Abstract: A method and system for allowing a vehicle dealer and manufacturer to match dealer orders and manufacturing plant shipments easily and equitably are disclosed. The method significantly decreases processing time, saving valuable time, money, and manpower resources. An automated linear expression calculation for determining and balancing vehicle allocation allows for equitable balancing of manufacturing plant orders and efficient optimization. The linear expression calculation may be performed in an iterative series of steps. The linear expression calculation handles a plurality of attribute features, thereby accommodating a plurality of dealer requests and vehicle options. The linear expression calculation creates a matrix representing the plurality of attribute features, and with each iteration the values within the matrix are refined and optimized, with the resulting matrix representing an optimized and balanced allocation of manufacturing plant production orders among a plurality of manufacturing plants.

Abstract translation: 公开了一种允许车辆经销商和制造商容易且公平地匹配经销商订单和制造工厂出货的方法和系统。 该方法大大减少了处理时间，节省了宝贵的时间，金钱和人力资源。 用于确定和平衡车辆分配的自动线性表达式计算允许制造工厂订单和有效优化的公平平衡。 线性表达式计算可以以迭代的一系列步骤来执行。 线性表达式计算处理多个属性特征，从而容纳多个经销商请求和车辆选项。 线性表达式计算创建表示多个属性特征的矩阵，并且通过每次迭代，矩阵内的值被精炼和优化，所得到的矩阵表示多个制造工厂之间的制造工厂生产订单的优化和平衡的分配。

公开(公告)号：US07179487B1

公开(公告)日：2007-02-20

申请号：US09336259

申请日：1999-06-18

Applicant: Jindrich Kopecek ,  Russell Stewart ,  Karin Caldwell ,  Chung Wang ,  Chih-Hu Ho

Inventor： Jindrich Kopecek ,  Russell Stewart ,  Karin Caldwell ,  Chung Wang ,  Chih-Hu Ho

IPC: A61K9/00 ,  A61K38/03 ,  A61K38/16

CPC classification number: A61K9/06 ,  A61K38/00 ,  A61K47/42

Abstract: A stimuli-responsive, hybrid hydrogel wherein the bulk of the polymer is made up of relatively inexpensive water soluble polymer strands crosslinked by protein domains. The responsiveness of the gel is controlled or modulated by the protein component.The physical and biological properties of the hydrogel are determined by specifically designed or engineered protein domains.The crosslinking of the protein domains to the water soluble polymers is by means of non-covalent bonding such as chelation or coordination bonding, biotin-avidin bonding, protein—protein interaction and protein-ligand interaction, or by means of covalent bonding. Methods of making and using the polymer-protein hydrogels are disclosed in this application.

Abstract translation: 一种刺激响应性混合型水凝胶，其中大部分聚合物由相对便宜的由蛋白质结构域交联的水溶性聚合物链构成。 凝胶的响应性由蛋白质组分控制或调节。 水凝胶的物理和生物学性质通过专门设计或改造的蛋白质结构域来确定。 蛋白质结构域与水溶性聚合物的交联是通过非共价键合，例如螯合或配位键合，生物素 - 抗生物素蛋白键合，蛋白质 - 蛋白质相互作用和蛋白质 - 配体相互作用，或通过共价键。 在本申请中公开了制备和使用聚合物 - 蛋​​白质水凝胶的方法。

公开(公告)号：US5859125A

公开(公告)日：1999-01-12

申请号：US891316

申请日：1997-07-09

Applicant: Evert van der Heide ,  Gerrit Vietje ,  Chung Wang

Inventor： Evert van der Heide ,  Gerrit Vietje ,  Chung Wang

IPC: C08G81/00 ,  B32B21/08 ,  C08G67/02 ,  C08K5/17 ,  C08L73/00 ,  C08L97/02 ,  C09J173/00 ,  C08L87/00

CPC classification number: C09J173/00 ,  B32B21/08 ,  C08G67/02 ,  C08K5/17 ,  C08L73/00 ,  C08L97/02 ,  Y10S524/906 ,  Y10S525/939 ,  Y10T428/24066 ,  Y10T428/31895 ,  Y10T428/31989

Abstract: An emulsion of a copolymer of carbon monoxide with an olefinically unsaturated compound dispersed in an aqueous diluent; a curable resin composition in the form of an oil-in-water emulsion comprising a copolymer of carbon monoxide with an olefinically unsaturated compound and a curing agent; and a process for producing a laminated wood composite comprising applying said curable resin composition onto wood parts of the composite, bringing the wood parts of the composite together such that curable resin composition is positioned between adjacent wood parts, and curing the curable resin such that after curing cured resin adheres adjacent wood parts to one another.

Abstract translation: 一氧化碳与分散在水性稀释剂中的烯属不饱和化合物的共聚物的乳液; 包含一氧化碳与烯属不饱和化合物的共聚物和固化剂的水包油乳液形式的可固化树脂组合物; 以及一种生产层压木材复合材料的方法，包括将所述可固化树脂组合物施加到复合材料的木材部分上，使复合材料的木材部分在一起，使得可固化树脂组合物位于相邻的木材部件之间，并固化可固化树脂， 固化的固化树脂将相邻的木质部分粘附在一起。

公开(公告)号：US20070238283A1

公开(公告)日：2007-10-11

申请号：US11278684

申请日：2006-04-05

Applicant: Chih-Chiang Chen ,  Chender Huang ,  Pei-Haw Tsao ,  Chung Wang ,  Wen Huang

Inventor： Chih-Chiang Chen ,  Chender Huang ,  Pei-Haw Tsao ,  Chung Wang ,  Wen Huang

IPC: H01L21/44

CPC classification number: H01L24/12 ,  H01L24/02 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01006 ,  H01L2924/01022 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14

Abstract: An under bump metallurgy (UBM) structure formed over a bond pad and for use in conjunction with a solder ball, provides an upper copper layer over a subjacent composite film that includes a nickel film over a further copper film over a titanium film. One or more reflow operations are used to form a molten solder ball and conditions are selected to ensure that all of the copper from the upper copper layer is dissolved within the molten solder. For SnAg leadfree solder, this leads to the formation of SnAgCu-like leadfree solder. The resulting interface between the solder ball and the nickel layer includes regularly spaced Cu6Sn5 nodules as intermetallics but is free of Ni3Sn4 which can spall into the molten solder causing reliability problems.

Abstract translation: 在接合焊盘上形成并与焊球结合使用的凸块下金属（UBM）结构在下层复合膜上提供上铜层，该复合膜在钛膜上的另外的铜膜上包括镍膜。 使用一个或多个回流操作来形成熔融焊球，并且选择条件以确保来自上铜层的所有铜都溶解在熔融焊料中。 对于SnAg无铅焊料，这导致形成SnAgCu样无铅焊料。 焊球和镍层之间的所得界面包括金属间化合物的规则间隔的Cu 6 N 5 N结，但不含Ni 3 Sn， SUB> 4 ，其可以剥落到熔融焊料中引起可靠性问题。

公开(公告)号：US20060063365A1

公开(公告)日：2006-03-23

申请号：US10948073

申请日：2004-09-23

Applicant: Chung Wang ,  Chien-Hsiun Lee

Inventor： Chung Wang ,  Chien-Hsiun Lee

IPC: H01L21/44

CPC classification number: H01L24/05 ,  H01L2224/05082 ,  H01L2224/05624 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/00014

Abstract: A method of manufacturing a semiconductor device and structure thereof. The method includes providing a workpiece, the workpiece having at least one conductive pad partially exposed through an opening in a passivation layer, the passivation layer having a top surface and the opening in the passivation layer having sidewalls. A barrier layer is formed over the at least one conductive pad, wherein the barrier layer lines the sidewalls of the opening in the passivation layer and is disposed over a top portion of the passivation layer proximate the opening. A conductive cap is formed over the barrier layer within the opening in the passivation layer, and the conductive cap is recessed to a height below the top surface of the passivation layer. The conductive cap may be used for testing with a probe or may be used for wire-bonding.

Abstract translation: 一种半导体器件的制造方法及其结构。 该方法包括提供工件，工件具有通过钝化层中的开口部分地暴露的至少一个导电焊盘，钝化层具有顶表面，钝化层中的开口具有侧壁。 在所述至少一个导电焊盘上形成阻挡层，其中所述阻挡层与所述钝化层中的所述开口的侧壁相连，并设置在所述钝化层的靠近所述开口的顶部。 在钝化层的开口内的势垒层上方形成导电帽，并且导电帽凹陷到钝化层的顶表面下方的高度。 导电帽可用于使用探针进行测试，也可用于引线接合。

公开(公告)号：US5869571A

公开(公告)日：1999-02-09

申请号：US63583

申请日：1998-04-21

Applicant: Evert van der Heide ,  Gerrit Vietje ,  Chung Wang

Inventor： Evert van der Heide ,  Gerrit Vietje ,  Chung Wang

IPC: C08G81/00 ,  B32B21/08 ,  C08G67/02 ,  C08K5/17 ,  C08L73/00 ,  C08L97/02 ,  C09J173/00 ,  C08L51/08

CPC classification number: C09J173/00 ,  B32B21/08 ,  C08G67/02 ,  C08K5/17 ,  C08L73/00 ,  C08L97/02 ,  Y10S524/906 ,  Y10S525/939 ,  Y10T428/24066 ,  Y10T428/31895 ,  Y10T428/31989

Abstract: An emulsion of a copolymer of carbon monoxide with an olefinically unsaturated compound dispersed in an aqueous diluent; a curable resin composition in the form of an oil-in-water emulsion comprising a copolymer of carbon monoxide with an olefinically unsaturated compound and a curing agent; and a polymer which is produced by grafting a polymer comprising poly(ethene oxide) moiety in its molecular structure onto a copolymer of carbon monoxide with an olefinically compound.

Abstract translation: 一氧化碳与分散在水性稀释剂中的烯属不饱和化合物的共聚物的乳液; 包含一氧化碳与烯属不饱和化合物的共聚物和固化剂的水包油乳液形式的可固化树脂组合物; 以及通过将其分子结构中包含聚（乙烯氧化物）部分的聚合物接枝到一氧化碳与烯属化合物的共聚物上而制备的聚合物。

公开(公告)号：US07994032B2

公开(公告)日：2011-08-09

申请号：US12845496

申请日：2010-07-28

Applicant: Shang-Yi Chiang ,  Chung Wang ,  Shou-Gwo Wuu ,  Dun-Nian Yaung

Inventor： Shang-Yi Chiang ,  Chung Wang ,  Shou-Gwo Wuu ,  Dun-Nian Yaung

IPC: H01L21/38

CPC classification number: H01L27/14623 ,  H01L27/14627 ,  H01L27/14643 ,  H01L27/14685 ,  H01L27/148

Abstract: The present disclosure provides an image sensor semiconductor device. The semiconductor device includes a substrate having a front surface and a back surface; a plurality of sensor elements formed on the front surface of the substrate, each of the plurality of sensor elements configured to receive light directed towards the back surface; and an aluminum doped feature formed in the substrate and disposed horizontally between two adjacent elements of the plurality of sensor elements and vertically between the back surface and the plurality of sensor elements.

Abstract translation: 本公开提供了一种图像传感器半导体器件。 半导体器件包括具有前表面和后表面的衬底; 形成在所述基板的前表面上的多个传感器元件，所述多个传感器元件中的每一个被配置为接收朝向所述后表面的光; 以及形成在所述基板中并且水平放置在所述多个传感器元件的两个相邻元件之间并且垂直地位于所述背表面和所述多个传感器元件之间的铝掺杂特征。

公开(公告)号：US07791170B2

公开(公告)日：2010-09-07

申请号：US11456291

申请日：2006-07-10

Applicant: Shang-Yi Chiang ,  Chung Wang ,  Shou-Gwo Wuu ,  Dun-Nian Yaung

Inventor： Shang-Yi Chiang ,  Chung Wang ,  Shou-Gwo Wuu ,  Dun-Nian Yaung

IPC: H01L25/065

CPC classification number: H01L27/14623 ,  H01L27/14627 ,  H01L27/14643 ,  H01L27/14685 ,  H01L27/148

Abstract: The present disclosure provides an image sensor semiconductor device. The semiconductor device includes a substrate having a front surface and a back surface; a plurality of sensor elements formed on the front surface of the substrate, each of the plurality of sensor elements configured to receive light directed towards the back surface; and an aluminum doped feature formed in the substrate and disposed horizontally between two adjacent elements of the plurality of sensor elements and vertically between the back surface and the plurality of sensor elements.

Abstract translation: 本公开提供了一种图像传感器半导体器件。 半导体器件包括具有前表面和后表面的衬底; 形成在所述基板的前表面上的多个传感器元件，所述多个传感器元件中的每一个被配置为接收朝向所述后表面的光; 以及形成在所述基板中并且水平放置在所述多个传感器元件的两个相邻元件之间并且垂直地位于所述背表面和所述多个传感器元件之间的铝掺杂特征。

公开(公告)号：US20080319820A1

公开(公告)日：2008-12-25

申请号：US12108407

申请日：2008-04-23

Applicant: David B. Adair ,  James V. Burrell ,  Charles Chao ,  Mohan K. Gupta ,  Melissa Hirota ,  Patrick Jaillet ,  Lalit Jain ,  John Kealoha, III ,  Ryan K. Kita ,  Quang N. Mai ,  Dirk Niemeyer ,  Nirod N. Samal ,  Chung Wang ,  Flora F. Wang ,  Andrea L. Whobrey

Inventor： David B. Adair ,  James V. Burrell ,  Charles Chao ,  Mohan K. Gupta ,  Melissa Hirota ,  Patrick Jaillet ,  Lalit Jain ,  John Kealoha, III ,  Ryan K. Kita ,  Quang N. Mai ,  Dirk Niemeyer ,  Nirod N. Samal ,  Chung Wang ,  Flora F. Wang ,  Andrea L. Whobrey

IPC: G06Q10/00

CPC classification number: G06Q10/087 ,  G06Q10/063 ,  G06Q10/0631 ,  G06Q10/06311 ,  G06Q10/06312 ,  G06Q10/06315 ,  G06Q10/0875 ,  G06Q30/0201

Abstract: A method and system for allowing a vehicle dealer and manufacturer to match dealer orders and manufacturing plant shipments easily and equitably are disclosed. The method significantly decreases processing time, saving valuable time, money, and manpower resources. An automated linear expression calculation for determining and balancing vehicle allocation allows for equitable balancing of manufacturing plant orders and efficient optimization. The linear expression calculation may be performed in an iterative series of steps. The linear expression calculation handles a plurality of attribute features, thereby accommodating a plurality of dealer requests and vehicle options. The linear expression calculation creates a matrix representing the plurality of attribute features, and with each iteration the values within the matrix are refined and optimized, with the resulting matrix representing an optimized and balanced allocation of manufacturing plant production orders among a plurality of manufacturing plants.

Abstract translation: 公开了一种允许车辆经销商和制造商容易且公平地匹配经销商订单和制造工厂出货的方法和系统。 该方法大大减少了处理时间，节省了宝贵的时间，金钱和人力资源。 用于确定和平衡车辆分配的自动线性表达式计算允许制造工厂订单和有效优化的公平平衡。 线性表达式计算可以以迭代的一系列步骤来执行。 线性表达式计算处理多个属性特征，从而容纳多个经销商请求和车辆选项。 线性表达式计算创建表示多个属性特征的矩阵，并且通过每次迭代，矩阵内的值被精炼和优化，所得到的矩阵表示多个制造工厂之间的制造工厂生产订单的优化和平衡的分配。