Abstract:
An electrically alterable semiconductor memory comprises at least two substantially independent memory banks, and a first control circuit for controlling operations of electrical alteration of the content of the memory. The first control circuit permits the selective execution of an operation of electrical alteration of the content of one of the at least two memory banks. The memory also comprises second control circuit that permits, simultaneously with said operation of electrical alteration of the content of one of the at least two memory banks, a burst mode, page mode, or standard read operation for reading the content of the other memory bank.
Abstract:
A control circuit controls the operation of a brushless DC (BLDC) sensorless motor having a first terminal connected to a first winding, a second terminal connected to a second winding and a third terminal connected to a third winding. A driver circuit applies drive signals to the first and second terminals and places the third terminal in a high-impedance state. The drive signals include first drive signals at a first current amplitude and second drive signals at a second current amplitude different from the first current amplitude. A differencing circuit senses a first mutual inductance voltage at the third terminal in response to the first drive signals and senses a second mutual inductance voltage at the third terminal in response to the second drive signals. The differencing circuit further determines a difference between the first and second mutual inductance voltages and produces a difference signal that is used for zero-crossing detection and rotor position sensing.
Abstract:
A semiconductor package substrate suitable for supporting a damage-sensitive device and a package substrate core having an upper and a lower surface. At least one pair of metal layers coats the upper and lower surfaces of the package substrate core. One pair of solder mask layers coats the outer metal layers of the at least one pair of metal layers. A plurality of vias is formed across the package substrate core and the at least one pair of metal layers. Advantageously, the plurality of vias is substantially distributed according to a homogeneous pattern in an area that is to be covered by the damage-sensitive device. A method for the production of such semiconductor package substrate is also described.
Abstract:
A method of power point tracking for operating a photovoltaic power plant, which includes a DC-DC converter of the output voltage of a panel having a power switch driven by a PWM control signal of variable duty-cycle generated by a PWM control circuit, in discontinuous conduction mode or continuous conduction mode depending on the current load of the converter, is implemented by low cost analog circuits. The method does not require the use of any analog-to-digital conversion, digital processing or storage resources and may use a single voltage sensor.
Abstract:
An embodiment of the present disclosure relates to system comprises an encoding device. Said encoding device comprises a compression unit, a quantizer, a bit estimator, a bit rate encoder and a variable length encoder. An embodiment also is a method of encoding. Said method estimates a number of bits to encode a macroblock after compressing the data stream. Then the estimated bit encoded by a bit rate encoder and further quantized by the quantizer to get the final encoded bit stream. The number of bits required to encode a macroblock is estimated after the quantization process and before the encoding process. The macroblock bit estimator estimates the number of bits required to encode a particular macroblock depending on the quantized AC coefficients of that macroblock and the quantized AC coefficients of the neighboring frames normalized at a macroblock level.