公开(公告)号：US20080005442A1

公开(公告)日：2008-01-03

申请号：US11798489

申请日：2007-05-14

申请人： Stanford Crane ,  Maria Portuondo ,  Willard Erickson ,  Maurice Bizzarri

发明人： Stanford Crane ,  Maria Portuondo ,  Willard Erickson ,  Maurice Bizzarri

IPC分类号： G06F13/36

CPC分类号： G06F1/185 ,  G06F1/184 ,  G06F1/186 ,  G06F13/4045 ,  G06F13/409 ,  H01R12/57 ,  H01R12/58 ,  H01R12/737 ,  H05K1/0286 ,  H05K1/14 ,  H05K7/1084 ,  H05K7/1441 ,  H05K7/1442 ,  H05K7/1444 ,  H05K7/1445

摘要： A computer system architecture in which functionally compatible electronic components are located on modular printed circuit boards. Thus, a type of processor used by the system can be changed by replacing the printed circuit board incorporating the processor. Similarly a type of peripheral bus used can be changed simply by replacing the printed circuit board containing the peripheral controller. High-density connectors connect the circuit boards. Some embodiments of the invention use a single backplane. Other embodiments place peripheral slots on a second, passive backplane.

摘要翻译： 功能兼容的电子元件位于模块化印刷电路板上的计算机系统架构。 因此，可以通过替换包含处理器的印刷电路板来改变系统使用的一种处理器。 类似地，可以通过更换包含外围控制器的印刷电路板来简单地改变所使用的一种外围总线。 高密度连接器连接电路板。 本发明的一些实施例使用单个背板。 其他实施例将外围插槽放置在第二无源底板上。

公开(公告)号：US6031720A

公开(公告)日：2000-02-29

申请号：US970503

申请日：1997-11-14

申请人： Stanford W. Crane, Jr. ,  Lakshminarasimha Krishnapura ,  Moises Behar ,  Arindum Dutta ,  Kevin J. Link ,  Bill Ahearn

发明人： Stanford W. Crane, Jr. ,  Lakshminarasimha Krishnapura ,  Moises Behar ,  Arindum Dutta ,  Kevin J. Link ,  Bill Ahearn

IPC分类号： H01L23/36 ,  H01L23/467 ,  H05K7/20

CPC分类号： H01L23/467 ,  H01L2924/0002

摘要： A cooling system for a semiconductor die carrier is disclosed that includes a cooling fan disposed at a substantial distance from a semiconductor die carrier, a cooling duct including an inlet portion and an outlet portion, and a heat exchanger disposed on an upper surface of the semiconductor die carrier. The cooling duct inlet portion is attached to the cooling fan and the cooling duct outlet portion is disposed in close proximity to the heat exchanger. The cooling fan draws ambient air into the cooling duct and the ambient air exits the cooling duct outlet portion and passes in a heat exchange relationship with the heat exchanger.

摘要翻译： 公开了一种用于半导体管芯载体的冷却系统，其包括设置在与半导体管芯载体相当距离的冷却风扇，包括入口部分和出口部分的冷却管道，以及设置在半导体芯片的上表面上的热交换器 模具载体 冷却管道入口部分附接到冷却风扇，并且冷却管道出口部分靠近热交换器设置。 冷却风扇将环境空气吸入冷却管道中，并且环境空气离开冷却管出口部分并与热交换器以热交换关系通过。

公开(公告)号：US6016256A

公开(公告)日：2000-01-18

申请号：US970379

申请日：1997-11-14

申请人： Stanford W. Crane, Jr. ,  Lakshminarasimha Krishnapura ,  Yun Li ,  Moises Behar ,  Dan Fuoco ,  Bill Ahearn

发明人： Stanford W. Crane, Jr. ,  Lakshminarasimha Krishnapura ,  Yun Li ,  Moises Behar ,  Dan Fuoco ,  Bill Ahearn

IPC分类号： H01L25/18 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/07 ,  H05K5/00 ,  H01L23/053 ,  H01L23/057

CPC分类号： H01L23/5382 ,  H01L23/49861 ,  H01L23/5385 ,  H01L25/0655 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L24/48 ,  H01L24/49 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/30107

摘要： A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.

公开(公告)号：US5951665A

公开(公告)日：1999-09-14

申请号：US970502

申请日：1997-11-14

申请人： Stanford W. Crane, Jr. ,  Lakshminarasimha Krishnapura ,  Daniel Fuoco ,  Roy K. Lee ,  Kevin J. Link ,  Moises Behar ,  Arindum Dutta ,  William Cross

发明人： Stanford W. Crane, Jr. ,  Lakshminarasimha Krishnapura ,  Daniel Fuoco ,  Roy K. Lee ,  Kevin J. Link ,  Moises Behar ,  Arindum Dutta ,  William Cross

IPC分类号： G06F1/18 ,  G06F1/16 ,  G06F13/40 ,  H05K7/14

CPC分类号： G06F13/409

摘要： A computer system includes a bus system; a pluggable central processing unit circuit board, coupled to the bus system; a pluggable logic board coupled to the pluggable central processing unit circuit board through the bus system; a pluggable input/output board coupled to the pluggable logic board through the bus system; a first connector unit for directly connecting the pluggable central processing unit circuit board to a first predetermined location on the pluggable logic board; and a second connector unit for directly connecting the pluggable logic board to a predetermined location on the pluggable input/output board.

摘要翻译： 计算机系统包括总线系统; 耦合到总线系统的可插拔中央处理单元电路板; 可插拔逻辑板，其通过总线系统耦合到可插拔中央处理单元电路板; 通过总线系统耦合到可插拔逻辑板的可插拔输入/输出板; 第一连接器单元，用于将可插拔中央处理单元电路板直接连接到可插拔逻辑板上的第一预定位置; 以及用于将可插拔逻辑板直接连接到可插拔输入/输出板上的预定位置的第二连接器单元。

公开(公告)号：US5821457A

公开(公告)日：1998-10-13

申请号：US902032

申请日：1997-07-29

申请人： Joseph M. Mosley ,  Maria M. Portuondo

发明人： Joseph M. Mosley ,  Maria M. Portuondo

IPC分类号： H01L23/498 ,  H01L23/50 ,  H01L23/02

CPC分类号： H01L23/49861 ,  H01L23/50 ,  H01L24/49 ,  H01L2224/05554 ,  H01L2224/45138 ,  H01L2224/45144 ,  H01L2224/45164 ,  H01L2224/48091 ,  H01L2224/49109 ,  H01L2224/4943 ,  H01L2224/85444 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011

摘要： A semiconductor die carrier includes an insulative module; a plurality of electrically conductive leads extending from the insulative module; a semiconductor die housed with the insulative module; and at least one high frequency capacitor secured to the insulative module for facilitating transmission of high frequency signals carried to and from the semiconductor die on the electrically conductive leads.

摘要翻译： 半导体管芯载体包括绝缘模块; 从所述绝缘模块延伸的多个导电引线; 与绝缘模块一起容纳的半导体管芯; 以及固定到绝缘模块的至少一个高频电容器，用于便于传输在导电引线上和从半导体管芯上传输的高频信号。

公开(公告)号：US5781408A

公开(公告)日：1998-07-14

申请号：US685547

申请日：1996-07-24

申请人： Stanford W. Crane, Jr. ,  Maria M. Portuondo ,  Edward V. Cruz ,  Vincent R. Razo ,  Shaun Fynn

发明人： Stanford W. Crane, Jr. ,  Maria M. Portuondo ,  Edward V. Cruz ,  Vincent R. Razo ,  Shaun Fynn

IPC分类号： G06F1/16 ,  G06F1/18 ,  G06F1/20 ,  H05K7/20 ,  H05K5/00

CPC分类号： G06F1/20 ,  G06F1/16 ,  G06F1/18 ,  G06F1/181 ,  G06F1/183 ,  G06F2200/1639

摘要： A computer system includes an exterior casing having an opening therein to permit user access to peripheral devices, such as floppy drives, CD ROM drives, tape drives, or optical drives. A door driven by a reversible motor slides along the exterior casing to open and close the opening in the exterior casing. A user may activate a sensor provided on the exterior casing to selectively open or close the door. The sensor may be a light-sensitive sensor, a voice-activated sensor, or a proximity sensor. Alternatively or in addition, the user may open and close the door via a system processor, for example, by entering commands via a keyboard. The door may slide along tracks within the exterior casing. In addition, the door may be locked in a closed position and unlocked to allow opening.

摘要翻译： 计算机系统包括外壳，其中具有开口，以允许用户访问诸如软盘驱动器，CD ROM驱动器，磁带机或光驱的外围设备。 由可逆电动机驱动的门沿着外部壳体滑动以打开和关闭外部壳体中的开口。 用户可以激活设置在外壳上的传感器以选择性地打开或关闭门。 传感器可以是感光传感器，声音传感器或接近传感器。 或者或另外，用户可以经由系统处理器打开和关闭门，例如通过经由键盘输入命令。 门可以沿着外壳内的轨道滑动。 此外，门可以被锁定在关闭位置并且被解锁以允许打开。

公开(公告)号：US20020176238A1

公开(公告)日：2002-11-28

申请号：US10194074

申请日：2002-07-15

申请人： The Panda Project, Inc.

发明人： Stanford W. Crane JR. ,  Lakshminarasimha Krishnapura ,  Yun Li ,  Moises Behar ,  Dan Fuoco ,  Bill Ahearn

IPC分类号： H01R009/00

CPC分类号： H01L23/5382 ,  H01L23/49861 ,  H01L23/5385 ,  H01L24/48 ,  H01L24/49 ,  H01L25/0655 ,  H01L2224/48137 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/30107 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2224/85399

摘要： A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The end plate is made from a heat sink material, such as copper. Each interconnect die is positioned between a pair of the IC dies. Electrically conductive material connects the IC dies to the interconnect die, connects the IC dies to the conductive leads, and connects the interconnect dies to the conductive leads. The interconnect dies function to interconnect the IC dies and to interconnect the IC dies to the conductive leads. The interconnect die may be embodied by wiring layers formed on a silicon substrate.

摘要翻译： 多芯片模块包括具有绝缘侧壁和端板的壳体，从侧壁延伸的导电引线，安装到端板的集成电路（IC）模具和安装到端板的一个或多个互连模具。 端板由诸如铜的散热材料制成。 每个互连裸片位于一对IC芯片之间。 导电材料将IC芯片连接到互连裸片，将IC芯片连接到导电引线，并将互连裸片连接到导电引线。 互连管芯用于互连IC管芯并将IC管芯与导电引线互连。 互连裸片可以由形成在硅衬底上的布线层来实现。

公开(公告)号：US20020042225A1

公开(公告)日：2002-04-11

申请号：US10013661

申请日：2001-12-13

申请人： THE PANDA PROJECT

发明人： Stanford W. Crane JR. ,  Lakshminarasimha Krishnapura ,  Arindum Dutta ,  Kevin Link

IPC分类号： H02B001/01

CPC分类号： H01R12/7047 ,  H01R13/645

摘要： A male connector connects with a female connector to establish an electrical connection. The male and female connectors each include a connector housing having hold-down tabs at opposite ends thereof for securing the connector housing to a substrate. The hold-down tabs are staggered or diagonally located such that one hold-down tab is proximal a first side of the connector housing and the other hold-down is proximal a second side of the connector housing. The staggered or diagonally-located hold-down tabs stabilize the connector housing against rocking or other movement on the substrate. The arrangement of hold-down tabs also permits the connector housing to nest or merge with another similarly-designed connector housing. The nested or merged connector housing conserve substrate space and permit a higher density of contacts in a given space on the substrate, whether the space is at an edge or in an interior of the substrate. The male and female connector housings include side walls having complementary polarization features. The polarization features on the female connector housing may be formed on a detachable polarization cap. A side of the male connector housing includes a stop member for providing a positive stop for the female connector and to prevent rocking. The stop member is configured to permit side-to-side nesting of male connector housings.

公开(公告)号：US5941617A

公开(公告)日：1999-08-24

申请号：US970434

申请日：1997-11-14

申请人： Stanford W. Crane, Jr. ,  Daniel J. Michalski ,  Moises Behar

发明人： Stanford W. Crane, Jr. ,  Daniel J. Michalski ,  Moises Behar

IPC分类号： B44C5/04 ,  G06F1/16 ,  G06F1/18 ,  A47B97/00

CPC分类号： G06F1/181 ,  B44C5/04 ,  B44C5/0415 ,  B44C5/0446 ,  G06F1/16

摘要： Disclosed is a decorative panel for attachment to the exterior of a computer enclosure including a fastener receiving portion for facilitating attachment of the decorative panel to an outer surface of the computer enclosure, a plurality of irregular geometric shaped surface depressions on a first surface of the decorative panel fixed in an ornamental arrangement, and at least one bore which extends completely through the decorative panel adapted to allow air to flow through the decorative panel and into an interior of the computer enclosure.

摘要翻译： 公开了一种用于附接到计算机外壳的外部的装饰板，其包括用于便于将装饰板附接到计算机外壳的外表面的紧固件接收部分，在装饰的第一表面上的多个不规则几何形状的表面凹陷 固定在装饰布置中的至少一个孔，以及至少一个完全延伸穿过装饰板的孔，其适于允许空气流过装饰板并进入计算机外壳的内部。

公开(公告)号：US5661631A

公开(公告)日：1997-08-26

申请号：US487104

申请日：1995-06-07

申请人： Stanford W. Crane, Jr.

发明人： Stanford W. Crane, Jr.

IPC分类号： G06F1/18 ,  H05K1/02 ,  H05K1/14 ,  H05K7/14 ,  G06F1/16 ,  H05K7/10

CPC分类号： G06F1/185 ,  G06F1/184 ,  G06F1/186 ,  H05K7/1455 ,  H05K1/0266 ,  H05K1/14

摘要： A computer system includes a computer cabinet, a plurality of printed circuit boards housed within the computer cabinet, a processor secured to at least one of the printed circuit boards, a power supply cabinet remote from the computer cabinet, a power supply housed within the power supply cabinet and a signal interconnect unit, coupled to the computer cabinet and the power supply cabinet, for providing an electrical path between the computer cabinet and the power supply cabinet. The printed circuit boards and the slots into which they are inserted have corresponding color code labels. The purpose of this is to clearly identify the location of the slot which corresponds to the printed circuit board of the same color.

摘要翻译： 计算机系统包括计算机机柜，容纳在计算机机柜内的多个印刷电路板，固定到至少一个印刷电路板的处理器，远离计算机机柜的电源柜，容纳在电源内的电源 供电柜和信号互连单元，耦合到计算机机柜和电源柜，用于在计算机机柜和电源柜之间提供电气路径。 印刷电路板及其插入的插槽具有相应的颜色代码标签。 其目的是清楚地识别与相同颜色的印刷电路板相对应的槽的位置。