公开(公告)号：US5104480A

公开(公告)日：1992-04-14

申请号：US597255

申请日：1990-10-12

申请人： Robert J. Wojnarowski ,  Charles W. Eichelberger

发明人： Robert J. Wojnarowski ,  Charles W. Eichelberger

IPC分类号： B23K26/18 ,  B23K26/40 ,  H01C17/22 ,  H01C17/242 ,  H01L21/48 ,  H05K1/09 ,  H05K3/00 ,  H05K3/02 ,  H05K3/06 ,  H05K3/08 ,  H05K3/10 ,  H05K3/14 ,  H05K3/22 ,  H05K3/38

CPC分类号： H05K3/225 ,  B23K26/40 ,  H01C17/242 ,  H01L21/4846 ,  H05K3/027 ,  H05K3/062 ,  B23K2203/05 ,  B23K2203/08 ,  B23K2203/12 ,  B23K2203/14 ,  B23K2203/15 ,  B23K2203/16 ,  B23K2203/172 ,  B23K2203/26 ,  B23K2203/42 ,  B23K2203/50 ,  B23K2203/54 ,  H05K2201/0112 ,  H05K2201/0338 ,  H05K2201/2081 ,  H05K2203/0361 ,  H05K2203/0384 ,  H05K2203/173 ,  H05K2203/175 ,  H05K3/108 ,  H05K3/143 ,  H05K3/381 ,  H05K3/388

摘要： Conductive patterns may be formed on the surface of thermally inefficient substrates by depositing a uniform layer of metal thereover whose upper surface is substantially UV light absorbing followed by laser ablation of the deposited metal to leave the deposited metal only in the desired metal pattern. Thermally efficient substrates may be rendered thermally inefficient by the deposition of a thermally inefficient material thereon. That thermally inefficient material may be either electrically insulating or a metal. A two layer metallization comprising a first, thermally inefficient reactive metal and a second UV light absorbing metal is preferred. When disposed on a thermally inefficient substrate, this two layer metallization ablates reactively as the two layers burn off together. This laser ablation process substantially roughens the surface of polymer dielectrics and may be used to repair open traces in printed circuit structures.

公开(公告)号：US4732778A

公开(公告)日：1988-03-22

申请号：US902624

申请日：1986-09-02

申请人： Minoru Kawasaki

发明人： Minoru Kawasaki

IPC分类号： C23C26/00 ,  B23K9/04 ,  B23K26/00 ,  B23K26/34 ,  B23K35/28 ,  B23K35/32 ,  C22C1/00 ,  C22C1/02 ,  C23C24/10 ,  C23C26/02 ,  B23K9/06

CPC分类号： B23K35/327 ,  B23K26/32 ,  B23K26/34 ,  B23K35/286 ,  C23C26/02 ,  B23K2203/10 ,  B23K2203/15 ,  B23K2203/18

摘要： In a method for forming a covering composite layer on the surface of an aluminum alloy substrate, a powder mixture containing ceramic carbide of a metal, silicon and a metal element which forms with silicon an inter metallic compound having a specific gravity comparable with that of the ceramic carbide is disposed upon the surface of the aluminum alloy substrate, and then the powder mixture so disposed is irradiated with a laser, so that the silicon and the metal element which forms the inter metallic compound with silicon in the powder mixture and a surface portion of the aluminum alloy substrate are melted and fused together. The silicon expedites uniform distribution of the ceramic carbide particles in a molten surface layer of the aluminum alloy substrate by producing a melt of the inter metallic compound having a specific gravity comparable with the ceramic carbide, thereby preventing segregation of the ceramic carbide particles due to specific gravity difference, while highly uniformly dispersing the ceramic carbide particles are carried by the inter metallic compound having affinity toward the aluminum alloy due to silicon component.

摘要翻译： 在铝合金基板的表面上形成覆盖复合层的方法中，含有金属，硅和金属元素的陶瓷碳化物的粉末混合物，其与硅形成具有与 将陶瓷碳化物设置在铝合金基板的表面上，然后将如此设置的粉末混合物用激光照射，使得在该粉末混合物中与硅形成金属间化合物的硅和金属元素和表面部分 的铝合金基板熔化并熔合在一起。 该硅通过制造具有与陶瓷碳化物相当的比重的金属间化合物的熔体，从而加快了陶瓷碳化物颗粒在铝合金基体的熔融表面层中的均匀分布，从而防止了陶瓷碳化物颗粒由于具体的分离 重力差异，同时高度均匀分散陶瓷碳化物颗粒是由于硅成分对铝合金具有亲和力的金属间化合物承载的。