摘要:
In one aspect the invention provides a method for laser induced breakdown of a material with a pulsed laser beam where the material is characterized by a relationship of fluence breakdown threshold (F.sub.th) versus laser beam pulse width (T) that exhibits an abrupt, rapid, and distinct change or at least a clearly detectable and distinct change in slope at a predetermined laser pulse width value. The method comprises generating a beam of laser pulses in which each pulse has a pulse width equal to or less than the predetermined laser pulse width value. The beam is focused to a point at or beneath the surface of a material where laser induced breakdown is desired.The beam may be used in combination with a mask in the beam path. The beam or mask may be moved in the x, y, and Z directions to produce desired features. The technique can produce features smaller than the spot size and Rayleigh range due to enhanced damage threshold accuracy in the short pulse regime.
摘要:
The present invention relates to an adjustable laser and optic system for processing which includes a laser beam cutting machine for focusing a laser beam including a first base for supporting an overhead beam by a post, the overhead beam having a laser beam conduit, a mirror assembly and a condenser lens for focusing the laser beam. A laser generator is supported on a second base for generating and feeding the laser beam to the laser cutting machine. Thg laser generator has a laser beam outlet arranged in alignment with the axis of the beam conduit in the overhead beam such that the laser beam generated is delivered to the mirror assembly in a straight line. Also provided is an element for connecting the first base and the second base, and an adjustment device associated with the second base for horizontally adjusting the laser generator in relation to the cutting machine, and a workpiece positioning device mounted on the first base for feeding the workpiece to the processing zone.
摘要:
A method for high resolution maskless electroless plating is described. Preferential plating results from exposing those regions where plating is sought to an energy beam to increase the plating rate by a factor of 10.sup.3 to 10.sup.4. This enhancement is sufficient to make masking unnecessary.
摘要:
The output of a continuously pumped, Q-switched, Nd:YAG laser (10) is frequency converted to provide ultraviolet light (62) for forming vias (72, 74) in multi-layered targets (40). The parameters of the output pulses (62) are selected to facilitate substantially clean, simultaneous or sequential drilling or via formation in a wide variety of materials such as metals, organic dielectrics, and reinforcement materials having different thermal absorption characteristics in response to ultraviolet light. These parameters typically include at least two of the following criteria: high average power of greater than about 100 milliwatts measured over the beam spot area, a temporal pulse width shorter than about 100 nanoseconds, a spot diameter of less than about 50 microns, and a repetition rate of greater than about one kilohertz. The laser system (10) and method circumvent conventional depth of cut saturation limitations and can achieve an increased depth of cut per pulse in a target (40) formed of either single- or multi-layered material.
摘要:
A metal sheet is attached to a ceramic substrate utilizing a weld pad formed of tungsten layer that is preformed onto the substrate and features a faying surface coated with a gold film. The sheet is superposed onto the gold film and scanned with a laser beam to fuse the sheet and the gold, without fusing the tungsten, thereby avoiding spalling of the metal and microcracking of the ceramic.
摘要:
A method of treating an expanse of phosphor material to remove selected spots which have interfering luminescent properties. The method consists of isolating and identifying spots or areas considered to be objectionable as regards the desired function of the particular phosphor, and then focusing a laser beam of selected wavelength at each spot whereupon the phosphor material absorbs the laser generated radiant energy to develop heat energy sufficient to effect vaporization of the spot of phosphor material.
摘要:
The output of a continuously pumped, Q-switched, Nd:YAG laser (10) is frequency converted to provide ultraviolet light (62) for plating internal wall surfaces (79, 126) of vias (72, 74) in multilayered electronic devices (80). The parameters of the output pulses (62) are selected to facilitate substantially uniform deposition of plating material particles explosively vaporized from a substrate (124) onto the internal wall surface (79, 126). These parameters typically include at least two of the following criteria: high average power of greater than about 100 milliwatts measured over the beam spot area, a temporal pulse width shorter than about 100 nanoseconds, a spot diameter of less than about 50 microns, and a repetition rate of greater than about one kilohertz.
摘要:
In laser plasma coating, the feeding of the material to be applied is unsatisfactory. Too much material is blown away and not used for the coating. Moreover, the application is inhomogeneous, depending upon the direction in which the laser beam is moved. According to the invention, the material is introduced at an angle coaxial with the laser beam and the angular momentum is then braked at the latest at the position where the powder leaves the feed head.
摘要:
Conductive patterns may be formed on the surface of thermally inefficient substrates by depositing a uniform layer of metal thereover whose upper surface is substantially UV light absorbing followed by laser ablation of the deposited metal to leave the deposited metal only in the desired metal pattern. Thermally efficient substrates may be rendered thermally inefficient by the deposition of a thermally inefficient material thereon. That thermally inefficient material may be either electrically insulating or a metal. A two layer metallization comprising a first, thermally inefficient reactive metal and a second UV light absorbing metal is preferred. When disposed on a thermally inefficient substrate, this two layer metallization ablates reactively as the two layers burn off together. This laser ablation process substantially roughens the surface of polymer dielectrics and may be used to repair open traces in printed circuit structures.
摘要:
The method for decorative processing is performed with repetitively pulsed cross discharge at atmospheric pressure by CO.sub.2 -laser with pulse energy 1 to 5J, power density at operation from 1.10.sup.6 W/cm.sup.2 to 6.10.sup.7 W/cm.sup.2, pulse duration from 50 to 100 ns and average power 1 to 1000W whereby the mated area with one shot is from 0.5 to 2 cm.sup.2.The device for laser engraving comprises a base with mounted console, on which are fastened parallel elements and a screw that is seated in its upper end in a thrust and in its lower end it is linked by a hinge to an electric motor. There is a fork which is seated in parallel elements whereby to this fork by means of handle and fixator is fastened a slide with longitudinal channels and a plate for axial inclination per 15.degree.. To this slide is fastened a second electric motor, and on its axis is mounted a bearer on which is fastened a mask in which is fixed the item to be decorated. On the rotating bearer is fastened a disk on which are mounted 4 spokes with 4 springs and a replaceable stand.