摘要:
A method for producing a composite sealing element, in particular for forming a seal at a retractable pane of a vehicle window, wherein the composite sealing element is produced from at least one extruded element portion and at least one element part formed by injection molding in a mold cavity of a mold, with the element part being molded onto an end face, bounding the mold cavity, of the extruded portion. A change in the dimensions of the composite sealing element as a result of the length of the extruded element portion differing from the nominal value is counteracted by changing the arrangement of the end face of the extruded element portion with respect to the mold cavity.
摘要:
A device for applying a coating on a component where the component includes an inner surface, an outer surface, and end surfaces. The coating device includes a supporting pedestal, a UV light-transparent cover plate, a first pumping device, and an injecting device. The supporting pedestal is configured for holding the inner surface of the component, the end surfaces and the outer surface are exposed in the forming cavity. A through hole is defined in the center of the pedestal and a forming cavity is defined between the cover plate and the component when the cover plate is placed and secured on the pedestal. The first pumping device applies suction to the through hole to hold the component on the pedestal and the injecting device injects UV light-curable coating material in liquid form into the forming cavity.
摘要:
A method is disclosed for the manufacture of an optoelectronic component. A substrate has a first primary face and a second primary face that lies opposite the first primary face. A semiconductor body that is capable of emitting electromagnetic radiation from a front side is attached to the first primary face of the substrate. A covering that is transparent to the radiation from the optoelectronic semiconductor body is applied to at least the front side of the semiconductor body. The covering is given the form of an optical element by using a closed cavity that is shaped with the contour of the optical element.
摘要:
A method for injection molding of resin or rubber at an insert positioned in a lower mold injects and fills melted resin or rubber into a cavity of an upper mold through a gate. The lower metal mold has a flexible supporting member supporting the mold insert. The supporting member is vertically movable in a recess formed on the upper surface of the lower mold. The underside thereof is supported by the tip ends of shafts of pressing members that operate independently. The movable supporting member is moved while being pressed by the respective shafts of the pressing members to the upper mold at a plurality of positions. The resin or rubber is molded when the upper surface of the insert uniformly contacts the underside of the upper mold by bending of the movable supporting member.
摘要:
A method of injection molding material around the surface of an object. The method involves positioning the object within the cavity of a first mold and holding the object through the use of a plurality of clamping mechanisms. Material is injection molded about the surface of the object such that the material encompasses the object's surface except for points of contact between the clamping mechanisms and the object. A plurality of protrusions, formed of injection molded material and extending outwardly from the surface of the object, are formed during the injection molding process. Thereafter the object is removed from the first mold cavity and positioned within the cavity of a second mold. The object is secured within the second mold cavity through engagement of the outwardly extending protrusions with the second mold. Additional material is then injection molded about the surface of the object with the additional material encompassing the object except for points of contact between the outwardly extending protrusions and the second mold.
摘要:
A molding machine for encapsulating electronic devices mounted on one side of a substrate, and having a ball-grid array, pin-grid array, or land-grid array on the opposite side, has a two member biased floating plate apparatus to compensate for variations in substrate thickness, and a gas collection/venting apparatus for relieving gases emitted from the non-encapsulated underside of the substrate.
摘要:
An insert molding method and mold has an upper mold and a lower mold disposed to oppose each other. The cavity at the upper mold side is filled with molten resin or rubber material injected through a gate to perform injection molding of the resin or rubber around an insert set at the lower mold side. A movable supporting member sets the insert, and is fitted in a recessed part formed on the upper face of the lower mold. The position of the center of gravity at the lower face of the movable supporting member is supported and pressed towards the upper mold side by the tip of a shaft of a pressing mechanism. A gap is between the side face part of the recessed part and the side face part of the movable supporting member to cause the movable supporting member to tilt about the point at which the movable supporting member is pressed and supported by the shaft inside the recessed part so that the upper face of the insert will be in uniform surface contact with the lower face of the upper mold.
摘要:
A resin sealing mold for semiconductor devices, which is designed to thoroughly accommodate board thickness variations and prevent formation of burrs and which is easy to maintain. To this end, a plurality of pistons (42) supporting, at one of their respective ends, lower mold cavities (56) have the other ends thereof slidably inserted in hydraulic cylinder blocks installed on lower mold sets (40).
摘要:
An insert molding method and mold has an upper mold and a lower mold disposed to oppose each other. The cavity at the upper mold side is filled with molten resin or rubber material injected through a gate to perform injection molding of the resin or rubber around an insert set at the lower mold side. A movable supporting member sets the insert, and is fitted in a recessed part formed on the upper face of the lower mold. The position of the center of gravity at the lower face of the movable supporting member is supported and pressed towards the upper mold side by the tip of a shaft of a pressing mechanism. A gap is between the side face part of the recessed part and the side face part of the movable supporting member to cause the movable supporting member to tilt about the point at which the movable supporting member is pressed and supported by the shaft inside the recessed part so that the upper face of the insert will be in uniform surface contact with the lower face of the upper mold.
摘要:
The present invention relates to an insert molding method for injection molding of resin or rubber at an insert set in a lower mold by injecting and filling melted resin or rubber into a cavity of an upper mold through a gate in a state where the upper mold and lower mold are disposed so as to be opposed to each other, and the invention relates to a metal mold therefor, wherein a movable supporting member having flexibility, on which the above-described insert is placed, is vertically movably disposed in a recess formed on the upper surface of the above-described lower mold, and the underside thereof is supported by the tip ends of shafts of a plurality of pressing means that independently operate, and the corresponding movable supporting member is moved while being pressed by the respective shafts of the corresponding pressing means to the upper mold at a plurality of positions, and molding is carried out in a state where the upper surface of the above-described insert is uniformly brought into contact with the underside of the upper mold by bending deformation of the corresponding movable supporting member.