公开(公告)号：US5542600A

公开(公告)日：1996-08-06

申请号：US232022

申请日：1994-04-26

申请人： Shigeki Kobayashi ,  Norihito Yamamoto

发明人： Shigeki Kobayashi ,  Norihito Yamamoto

IPC分类号： B23K1/00 ,  B23K3/03 ,  B23K3/08 ,  B25J9/16 ,  G05B19/418 ,  H05K13/04 ,  H05K13/08 ,  B23K1/19

CPC分类号： H05K13/0486 ,  B23K1/0016 ,  B23K3/033 ,  B23K3/08 ,  B25J9/16 ,  G05B19/41865 ,  G05B19/41875 ,  G05B19/41885 ,  H05K13/08 ,  B23K2201/42 ,  G05B2219/31096 ,  G05B2219/31296 ,  G05B2219/31355 ,  G05B2219/31446 ,  G05B2219/32121 ,  G05B2219/32127 ,  G05B2219/32145 ,  G05B2219/32146 ,  G05B2219/32147 ,  G05B2219/32148 ,  G05B2219/32151 ,  G05B2219/32173 ,  G05B2219/32174 ,  G05B2219/32175 ,  G05B2219/32186 ,  G05B2219/32192 ,  G05B2219/32229 ,  G05B2219/32231 ,  G05B2219/32232 ,  G05B2219/45235 ,  G05B2219/50064 ,  Y02P90/04 ,  Y02P90/10 ,  Y02P90/20 ,  Y02P90/22 ,  Y02P90/26 ,  Y02P90/265

摘要： Soldering condition information such as the position and angle of a soldering iron, amount of solder supplied and heating time is stored beforehand, for each grouping of parts, in a part classification table (26) for soldering purposes. Parts to be mounted on a board are stored, in correspondence with the board ID, on a floppy disk of a floppy disk device (24). When the board ID is entered, the parts to be mounted on the board are displayed on a display unit (23). The operator reads out the part classification table (26) for soldering purposes and designates soldering correction information that corresponds to the part groups to which the parts belong. As a result, a teach-data table (27) in which soldering condition information has been stored in correspondence with the parts is created. Soldering is executed automatically in accordance with the teach-data table (27).

摘要翻译： PCT No.PCT / JP92 / 01448 Sec。 371日期1994年04月26日 102（e）日期1994年4月26日PCT提交1992年11月9日PCT公布。 出版物WO93 / 09654 日期1993年5月13日焊接条件信息如烙铁的位置和角度，供应的焊料量和加热时间预先存储在用于焊接目的的部件分类表（26）中。 将要安装在板上的部件与板ID相对应地存储在软盘设备（24）的软盘上。 当输入板ID时，将要安装在板上的部件显示在显示单元（23）上。 操作人员为了焊接目的读出零件分类表（26），并指定与零件所属部件组对应的焊接修正信息。 结果，产生了与部件对应地存储焊接条件信息的教学数据表（27）。 根据教学数据表（27）自动执行焊接。

公开(公告)号：US07960187B2

公开(公告)日：2011-06-14

申请号：US12048129

申请日：2008-03-13

申请人： Noriaki Shimizu

发明人： Noriaki Shimizu

IPC分类号： H01L21/00

CPC分类号： G05B19/4067 ,  G05B2219/32231 ,  G05B2219/37224 ,  G05B2219/50102 ,  G05B2219/50104 ,  H01L21/67276

摘要： The present invention provides a recovery processing method to restore the substrate processing apparatus to an operating state after correcting an abnormality having occurred in the substrate processing apparatus in operation and having resulted in a stop in the operation, comprising a substrate retrieval step in which substrate salvage processing is first executed for a wafer W left in a chamber in the substrate processing apparatus in correspondence to the extent to which the wafer has been processed at the time of the operation stop and the substrate having undergone the substrate salvage processing is then retrieved into the cassette storage container and an apparatus internal state restoration step in which the states inside the individual chambers of the substrate processing apparatus are restored.

摘要翻译： 本发明提供一种恢复处理方法，用于在操作中校正在基板处理装置中发生的异常并且导致操作停止之后将基板处理装置恢复到操作状态，包括基板回收步骤，其中基板回收 首先对于在基板处理装置的室中留下的晶片W进行处理，对应于在操作停止时晶片已被处理的程度，然后将经过基板补救处理的基板检索到 盒式存储容器和装置内部状态恢复步骤，其中恢复基板处理装置的各个室内的状态。

公开(公告)号：US20080223298A1

公开(公告)日：2008-09-18

申请号：US12048129

申请日：2008-03-13

申请人： Noriaki SHIMIZU

发明人： Noriaki SHIMIZU

IPC分类号： B05C11/00 ,  C23F1/08 ,  H01L21/66

CPC分类号： G05B19/4067 ,  G05B2219/32231 ,  G05B2219/37224 ,  G05B2219/50102 ,  G05B2219/50104 ,  H01L21/67276

摘要： The present invention provides a recovery processing method to restore the substrate processing apparatus to an operating state after correcting an abnormality having occurred in the substrate processing apparatus in operation and having resulted in a stop in the operation, comprising a substrate retrieval step in which substrate salvage processing is first executed for a wafer W left in a chamber in the substrate processing apparatus in correspondence to the extent to which the wafer has been processed at the time of the operation stop and the substrate having undergone the substrate salvage processing is then retrieved into the cassette storage container and an apparatus internal state restoration step in which the states inside the individual chambers of the substrate processing apparatus are restored.

摘要翻译： 本发明提供了一种恢复处理方法，用于在操作中校正在基板处理装置中发生的异常并且导致操作停止之后将基板处理装置恢复到操作状态，包括基板回收步骤，其中基板回收 首先对于在基板处理装置的室中留下的晶片W进行处理，对应于在操作停止时晶片已被处理的程度，然后将经过基板补救处理的基板检索到 盒式存储容器和装置内部状态恢复步骤，其中恢复基板处理装置的各个室内的状态。

公开(公告)号：US07364922B2

公开(公告)日：2008-04-29

申请号：US11337464

申请日：2006-01-24

申请人： Noriaki Shimizu

发明人： Noriaki Shimizu

IPC分类号： H01L21/00

CPC分类号： G05B19/4067 ,  G05B2219/32231 ,  G05B2219/37224 ,  G05B2219/50102 ,  G05B2219/50104 ,  H01L21/67276

摘要： The present invention provides a recovery processing method to restore the substrate processing apparatus to an operating state after correcting an abnormality having occurred in the substrate processing apparatus in operation and having resulted in a stop in the operation, comprising a substrate retrieval step in which substrate salvage processing is first executed for a wafer W left in a chamber in the substrate processing apparatus in correspondence to the extent to which the wafer has been processed at the time of the operation stop and the substrate having undergone the substrate salvage processing is then retrieved into the cassette storage container and an apparatus internal state restoration step in which the states inside the individual chambers of the substrate processing apparatus are restored.

摘要翻译： 本发明提供了一种恢复处理方法，用于在操作中校正在基板处理装置中发生的异常并且导致操作停止之后将基板处理装置恢复到操作状态，包括基板回收步骤，其中基板回收 首先对于在基板处理装置的室中留下的晶片W进行处理，对应于在操作停止时晶片已被处理的程度，然后将经过基板补救处理的基板检索到 盒式存储容器和装置内部状态恢复步骤，其中恢复基板处理装置的各个室内的状态。

公开(公告)号：US20060162660A1

公开(公告)日：2006-07-27

申请号：US11337464

申请日：2006-01-24

申请人： Noriaki Shimizu

发明人： Noriaki Shimizu

IPC分类号： C23C16/00 ,  H01L21/66 ,  H01L21/306 ,  C23F1/00

CPC分类号： G05B19/4067 ,  G05B2219/32231 ,  G05B2219/37224 ,  G05B2219/50102 ,  G05B2219/50104 ,  H01L21/67276

摘要： The present invention provides a recovery processing method to restore the substrate processing apparatus to an operating state after correcting an abnormality having occurred in the substrate processing apparatus in operation and having resulted in a stop in the operation, comprising a substrate retrieval step in which substrate salvage processing is first executed for a wafer W left in a chamber in the substrate processing apparatus in correspondence to the extent to which the wafer has been processed at the time of the operation stop and the substrate having undergone the substrate salvage processing is then retrieved into the cassette storage container and an apparatus internal state restoration step in which the states inside the individual chambers of the substrate processing apparatus are restored.

摘要翻译： 本发明提供一种恢复处理方法，用于在操作中校正在基板处理装置中发生的异常并且导致操作停止之后将基板处理装置恢复到操作状态，包括基板回收步骤，其中基板回收 首先对于在基板处理装置的室中留下的晶片W进行处理，对应于在操作停止时晶片已被处理的程度，然后将经过基板补救处理的基板检索到 盒式存储容器和装置内部状态恢复步骤，其中恢复基板处理装置的各个室内的状态。

公开(公告)号：US06571145B1

公开(公告)日：2003-05-27

申请号：US09558061

申请日：2000-04-26

申请人： Sadayuki Matsumiya ,  Yukio Mawake ,  Yukio Yatabe

发明人： Sadayuki Matsumiya ,  Yukio Mawake ,  Yukio Yatabe

IPC分类号： G06F1900

CPC分类号： G05B19/41875 ,  G05B2219/32192 ,  G05B2219/32231 ,  G05B2219/32391 ,  G05B2219/45213 ,  G05B2219/50171 ,  Y02P90/083 ,  Y02P90/087 ,  Y02P90/18 ,  Y02P90/185 ,  Y02P90/22 ,  Y02P90/28

摘要： A manufacturing system of the present invention comprises NC machine tools 21-2n each for processing a work in accordance with a process program having a process condition; a measuring device 3 for measuring the work processed by the NC machine tools 21-2n; and computers 5, 81-8n for modifying the process condition of the process program on the basis of a measured result from the measuring device 3. The computer 5 produces a correction data file for modifying the process condition on the basis of the measured result from the measuring device 3. The correction data file is a file that contains correction values for each of processed parts stored in variables capable of being referred directly or indirectly from the process program. The correction data file is transferred to the NC controllers 91-9n prior to the NC machine tools 21-2n processing the work. The NC controllers 91-9n modify the process condition by the process program with reference to the correction values stored in the variables of the transferred correction data file.

摘要翻译： 本发明的制造系统包括NC机床21-2n，每个用于根据具有处理条件的处理程序处理工件; 用于测量由NC机床21-2n处理的作业的测量装置3; 以及用于基于来自测量装置3的测量结果来修改处理程序的处理状态的计算机5,81-8n。计算机5产生校正数据文件，用于基于来自测量装置3的测量结果来修改处理条件 校正数据文件是包含存储在能够从处理程序直接或间接引用的变量中的每个处理部分的校正值的文件。 在NC机床21-2n处理工件之前，将校正数据文件传送到NC控制器91-9n。 NC控制器91-9n参照存储在传送的校正数据文件的变量中的校正值通过处理程序来修改处理条件。