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公开(公告)号：US20120038061A1
公开(公告)日：2012-02-16
申请号：US12856632
申请日：2010-08-14
申请人： Michael Z. Su , Gamal Rafai-Ahmed , Bryan Black
发明人： Michael Z. Su , Gamal Rafai-Ahmed , Bryan Black
CPC分类号： H01L23/49827 , H01L23/49816 , H01L23/49894 , H01L24/11 , H01L24/14 , H01L24/17 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/1132 , H01L2224/1146 , H01L2224/1147 , H01L2224/13082 , H01L2224/13099 , H01L2224/1403 , H01L2224/1414 , H01L2224/14143 , H01L2224/16145 , H01L2224/16148 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81193 , H01L2225/06513 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/3511 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor chip device includes a first semiconductor chip adapted to be stacked with a second semiconductor chip wherein the second semiconductor chip includes a side and first and second conductor structures projecting from the side. The first semiconductor chip includes a first edge, a first conductor pad, a first conductor pillar positioned on but laterally offset from the first conductor pad toward the first edge and that has a first lateral dimension and is adapted to couple to one of the first and second conductor structures, a second conductor pad positioned nearer the first edge than the first conductor pad, and a second conductor pillar positioned on but laterally offset from the second conductor pad and that has a second lateral dimension larger than the first lateral dimension and is adapted to couple to the other of the first and second conductor structures.
摘要翻译： 一种半导体芯片器件包括适于与第二半导体芯片堆叠的第一半导体芯片，其中第二半导体芯片包括侧面以及从侧面突出的第一和第二导体结构。 第一半导体芯片包括第一边缘，第一导体焊盘，第一导体柱，其位于第一导体焊盘朝向第一边缘但横向偏移并且具有第一横向尺寸并且适于耦合到第一和第 第二导体结构，位于比第一导体焊盘更靠近第一边缘的第二导体焊盘，以及定位在第二导体焊盘但是横向偏离第二导体焊盘并且具有大于第一横向尺寸的第二横向尺寸的第二导体柱，并且适于 耦合到第一和第二导体结构中的另一个。
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公开(公告)号：US20170025357A1
公开(公告)日：2017-01-26
申请号：US14808798
申请日：2015-07-24
IPC分类号： H01L23/538 , H01L21/66 , H01L23/00
CPC分类号： H01L23/5386 , H01L22/32 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L2224/0401 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/14132 , H01L2224/14133 , H01L2224/14142 , H01L2224/14143 , H01L2224/16057 , H01L2224/16105 , H01L2224/16106 , H01L2224/17051 , H01L2224/171 , H01L2224/17106 , H01L2225/06513 , H01L2924/381 , H01L2924/3841 , H01L2924/00014 , H01L2924/014
摘要： A semiconductor chip includes a semiconductor body having an active device region, one or more metallization layers insulated from the semiconductor body and configured to carry one or more of ground, power and signals to the active device region, and a plurality of contact terminals formed in or disposed on an outermost one of the metallization layers and configured to provide external electrical access to the semiconductor chip. A minimum distance between adjacent ones of the contact terminals is defined for the semiconductor chip. One or more groups of adjacent ones of the contact terminals have an electrical or functional commonality and a pitch less than the defined minimum distance. A single shared solder joint can connect two or more of the contact terminals of the semiconductor chip to one or more of contact terminals of a substrate such as a circuit board, an interposer or another semiconductor chip.
摘要翻译： 半导体芯片包括具有有源器件区域的半导体本体，与半导体本体绝缘的一个或多个金属化层，并且被配置为将一个或多个接地，功率和信号传送到有源器件区域，以及多个接触端子形成在 或设置在最外面的一个金属化层上并被配置为提供对半导体芯片的外部电接入。 为半导体芯片定义相邻接触端子之间的最小距离。 接触端子中的一组或多组相邻接触端子具有电气或功能通用性以及小于限定的最小距离的间距。 单个共用焊点可以将半导体芯片的两个或更多个接触端子连接到诸如电路板，插入器或其它半导体芯片的衬底的一个或多个接触端子。
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公开(公告)号：US20130161814A1
公开(公告)日：2013-06-27
申请号：US13773844
申请日：2013-02-22
申请人： Michael Z. Su , Gamal Refai-Ahmed , Bryan Black
发明人： Michael Z. Su , Gamal Refai-Ahmed , Bryan Black
IPC分类号： H01L23/498
CPC分类号： H01L23/49827 , H01L23/49816 , H01L23/49894 , H01L24/11 , H01L24/14 , H01L24/17 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/1132 , H01L2224/1146 , H01L2224/1147 , H01L2224/13082 , H01L2224/13099 , H01L2224/1403 , H01L2224/1414 , H01L2224/14143 , H01L2224/16145 , H01L2224/16148 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81193 , H01L2225/06513 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/3511 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor chip device includes a first semiconductor chip adapted to be stacked with a second semiconductor chip wherein the second semiconductor chip includes a side and first and second conductor structures projecting from the side. The first semiconductor chip includes a first edge, a first conductor pad, a first conductor pillar positioned on but laterally offset from the first conductor pad toward the first edge and that has a first lateral dimension and is adapted to couple to one of the first and second conductor structures, a second conductor pad positioned nearer the first edge than the first conductor pad, and a second conductor pillar positioned on but laterally offset from the second conductor pad and that has a second lateral dimension larger than the first lateral dimension and is adapted to couple to the other of the first and second conductor structures.
摘要翻译： 一种半导体芯片器件包括适于与第二半导体芯片堆叠的第一半导体芯片，其中第二半导体芯片包括侧面以及从侧面突出的第一和第二导体结构。 第一半导体芯片包括第一边缘，第一导体焊盘，第一导体柱，其位于第一导体焊盘朝向第一边缘但横向偏移并且具有第一横向尺寸并且适于耦合到第一和第 第二导体结构，位于比第一导体焊盘更靠近第一边缘的第二导体焊盘，以及定位在第二导体焊盘但是横向偏离第二导体焊盘并且具有大于第一横向尺寸的第二横向尺寸的第二导体柱，并且适于 耦合到第一和第二导体结构中的另一个。
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4.发明授权公开(公告)号：US08394672B2
公开(公告)日：2013-03-12
申请号：US12856632
申请日：2010-08-14
申请人： Michael Z. Su , Gamal Refai-Ahmed , Bryan Black
发明人： Michael Z. Su , Gamal Refai-Ahmed , Bryan Black
CPC分类号： H01L23/49827 , H01L23/49816 , H01L23/49894 , H01L24/11 , H01L24/14 , H01L24/17 , H01L24/81 , H01L25/0657 , H01L25/50 , H01L2224/1132 , H01L2224/1146 , H01L2224/1147 , H01L2224/13082 , H01L2224/13099 , H01L2224/1403 , H01L2224/1414 , H01L2224/14143 , H01L2224/16145 , H01L2224/16148 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81193 , H01L2225/06513 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15311 , H01L2924/3511 , H01L2924/00014 , H01L2924/00
摘要： A semiconductor chip device includes a first semiconductor chip adapted to be stacked with a second semiconductor chip wherein the second semiconductor chip includes a side and first and second conductor structures projecting from the side. The first semiconductor chip includes a first edge, a first conductor pad, a first conductor pillar positioned on but laterally offset from the first conductor pad toward the first edge and that has a first lateral dimension and is adapted to couple to one of the first and second conductor structures, a second conductor pad positioned nearer the first edge than the first conductor pad, and a second conductor pillar positioned on but laterally offset from the second conductor pad and that has a second lateral dimension larger than the first lateral dimension and is adapted to couple to the other of the first and second conductor structures.
摘要翻译： 一种半导体芯片器件包括适于与第二半导体芯片堆叠的第一半导体芯片，其中第二半导体芯片包括侧面以及从侧面突出的第一和第二导体结构。 第一半导体芯片包括第一边缘，第一导体焊盘，第一导体柱，其位于第一导体焊盘朝向第一边缘但横向偏移并且具有第一横向尺寸并且适于耦合到第一和第 第二导体结构，位于比第一导体焊盘更靠近第一边缘的第二导体焊盘，以及定位在第二导体焊盘但是横向偏离第二导体焊盘并且具有大于第一横向尺寸的第二横向尺寸的第二导体柱，并且适于 耦合到第一和第二导体结构中的另一个。
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