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公开(公告)号：US20170025357A1
公开(公告)日：2017-01-26
申请号：US14808798
申请日：2015-07-24
IPC分类号： H01L23/538 , H01L21/66 , H01L23/00
CPC分类号： H01L23/5386 , H01L22/32 , H01L24/05 , H01L24/06 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L2224/0401 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/14132 , H01L2224/14133 , H01L2224/14142 , H01L2224/14143 , H01L2224/16057 , H01L2224/16105 , H01L2224/16106 , H01L2224/17051 , H01L2224/171 , H01L2224/17106 , H01L2225/06513 , H01L2924/381 , H01L2924/3841 , H01L2924/00014 , H01L2924/014
摘要： A semiconductor chip includes a semiconductor body having an active device region, one or more metallization layers insulated from the semiconductor body and configured to carry one or more of ground, power and signals to the active device region, and a plurality of contact terminals formed in or disposed on an outermost one of the metallization layers and configured to provide external electrical access to the semiconductor chip. A minimum distance between adjacent ones of the contact terminals is defined for the semiconductor chip. One or more groups of adjacent ones of the contact terminals have an electrical or functional commonality and a pitch less than the defined minimum distance. A single shared solder joint can connect two or more of the contact terminals of the semiconductor chip to one or more of contact terminals of a substrate such as a circuit board, an interposer or another semiconductor chip.
摘要翻译： 半导体芯片包括具有有源器件区域的半导体本体，与半导体本体绝缘的一个或多个金属化层，并且被配置为将一个或多个接地，功率和信号传送到有源器件区域，以及多个接触端子形成在 或设置在最外面的一个金属化层上并被配置为提供对半导体芯片的外部电接入。 为半导体芯片定义相邻接触端子之间的最小距离。 接触端子中的一组或多组相邻接触端子具有电气或功能通用性以及小于限定的最小距离的间距。 单个共用焊点可以将半导体芯片的两个或更多个接触端子连接到诸如电路板，插入器或其它半导体芯片的衬底的一个或多个接触端子。
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公开(公告)号：US09184144B2
公开(公告)日：2015-11-10
申请号：US13187694
申请日：2011-07-21
申请人： Zhongping Bao , James D. Burrell , Shiqun Gu
发明人： Zhongping Bao , James D. Burrell , Shiqun Gu
CPC分类号： H01L24/14 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/742 , H01L24/81 , H01L2224/0345 , H01L2224/0401 , H01L2224/05011 , H01L2224/05015 , H01L2224/05017 , H01L2224/05558 , H01L2224/056 , H01L2224/1146 , H01L2224/13012 , H01L2224/13013 , H01L2224/13014 , H01L2224/13015 , H01L2224/13017 , H01L2224/13018 , H01L2224/13082 , H01L2224/131 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1403 , H01L2224/14051 , H01L2224/141 , H01L2224/14142 , H01L2224/16057 , H01L2224/17051 , H01L2224/81211 , H01L2224/814 , H01L2224/81801 , H01L2924/01006 , H01L2924/01029 , H01L2924/014 , H01L2924/3512 , H01L2924/00015 , H01L2924/00014 , H01L2924/00012
摘要： Pillars having a directed compliance geometry are arranged to couple a semiconductor die to a substrate. The direction of maximum compliance of each pillar may be aligned with the direction of maximum stress caused by unequal thermal expansion and contraction of the semiconductor die and substrate. Pillars may be designed and constructed with various shapes having particular compliance characteristics and particular directions of maximum compliance. The shape and orientation of the pillars may be selected as a function of their location on a die to accommodate the direction and magnitude of stress at their location. A method includes fabricating pillars with particular shapes by patterning to increase surface of materials upon which the pillar is plated or deposited.
摘要翻译： 具有定向柔性几何形状的支柱布置成将半导体管芯耦合到衬底。 每个支柱的最大顺应性的方向可以与由半导体管芯和衬底的不等的热膨胀和收缩引起的最大应力的方向一致。 支柱可以被设计和构造成各种形状，具有特定的顺应特性和最大顺应性的特定方向。 可以选择支柱的形状和取向作为它们在模具上的位置的函数，以适应其位置处的应力的方向和大小。 一种方法包括通过图案化来制造具有特定形状的柱，以增加柱被镀或沉积的材料的表面。
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公开(公告)号：US20060162959A1
公开(公告)日：2006-07-27
申请号：US11388100
申请日：2006-03-22
申请人： Jason Garcia , John Beatty
发明人： Jason Garcia , John Beatty
IPC分类号： H05K1/09
CPC分类号： H05K3/3436 , H01L24/13 , H01L24/14 , H01L24/17 , H01L24/81 , H01L2224/0401 , H01L2224/05554 , H01L2224/05647 , H01L2224/13013 , H01L2224/13014 , H01L2224/13015 , H01L2224/13078 , H01L2224/13099 , H01L2224/13111 , H01L2224/14051 , H01L2224/14141 , H01L2224/14142 , H01L2224/14145 , H01L2224/14146 , H01L2224/14177 , H01L2224/14505 , H01L2224/16 , H01L2224/16227 , H01L2224/81801 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15312 , H01L2924/3511 , H05K3/3426 , H05K2201/068 , H05K2201/10242 , H05K2201/10909 , Y02P70/613 , Y10T29/49126 , Y10T29/49147 , Y10T29/49149 , Y10T29/49204 , Y10T29/49222 , H01L2924/00014
摘要： According to one aspect of the invention, an electronic assembly is provided. The electronic assembly includes a first substrate having an integrated circuit formed therein and a second substrate. The first and second substrates are interconnected by a plurality of bi-material interconnects that are electrically connected to the integrated circuit and have a first component comprising a conductive first material with a first coefficient of thermal expansion and a second component comprising a second material with a second coefficient of thermal expansion. The first and second components are connected and shaped such that when the temperature of the bi-material interconnects changes the interconnects each bend towards the first or second component. When the temperature of the second substrate increases, the second substrate expands away from a central portion thereof. The bi-material interconnects are arranged such that the bi-material interconnects bend away from the central portion of the second substrate.
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公开(公告)号：US20100252855A1
公开(公告)日：2010-10-07
申请号：US12742559
申请日：2008-11-13
申请人： Hidenori Kamei
发明人： Hidenori Kamei
IPC分类号： H01L33/62
CPC分类号： H01L33/647 , H01L24/14 , H01L24/17 , H01L33/14 , H01L33/38 , H01L33/62 , H01L33/642 , H01L2224/0401 , H01L2224/05109 , H01L2224/05568 , H01L2224/05624 , H01L2224/05644 , H01L2224/05673 , H01L2224/0603 , H01L2224/06051 , H01L2224/06102 , H01L2224/1403 , H01L2224/1411 , H01L2224/14132 , H01L2224/14142 , H01L2224/14152 , H01L2224/14177 , H01L2224/14179 , H01L2224/16225 , H01L2224/16227 , H01L2224/17107 , H01L2224/81192 , H01L2924/00014 , H01L2924/0002 , H01L2924/01004 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2933/0016 , H01L2924/0105 , H01L2924/053 , H01L2924/00 , H01L2224/05552
摘要： In semiconductor light-emitting devices in which a light-emitting layer is formed on one surface of a substrate, and an n-side electrode and a p-side electrode are formed over the same surface of the substrate as the light-emitting layer, heat generated by a semiconductor light-emitting element needs to be dissipated to a submount. However, it is extremely complicated to fabricate connection members serving also as heat dissipating members and to control fabrication of the connection members, according to semiconductor light-emitting elements having electrodes of various sizes and shapes. By increasing the density of p-side bumps near the n-side electrode, the heat transfer area from the semiconductor light-emitting element to the submount is increased near the n-side electrode, whereby the heat dissipation effect is enhanced.
摘要翻译： 在衬底的一个表面上形成发光层的半导体发光器件和在发光层的衬底的相同表面上形成n侧电极和p侧电极的半导体发光器件中， 需要将由半导体发光元件产生的热耗散到基台。 然而，根据具有各种尺寸和形状的电极的半导体发光元件，制造也用作散热构件的连接构件并且控制连接构件的制造是非常复杂的。 通过增加n侧电极附近的p侧凸块的密度，在n侧电极附近增加了从半导体发光元件到副安装座的传热面积，从而提高了散热效果。
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公开(公告)号：US07421778B2
公开(公告)日：2008-09-09
申请号：US11388100
申请日：2006-03-22
申请人： Jason A. Garcia , John J. Beatty
发明人： Jason A. Garcia , John J. Beatty
IPC分类号： H05K3/36
CPC分类号： H05K3/3436 , H01L24/13 , H01L24/14 , H01L24/17 , H01L24/81 , H01L2224/0401 , H01L2224/05554 , H01L2224/05647 , H01L2224/13013 , H01L2224/13014 , H01L2224/13015 , H01L2224/13078 , H01L2224/13099 , H01L2224/13111 , H01L2224/14051 , H01L2224/14141 , H01L2224/14142 , H01L2224/14145 , H01L2224/14146 , H01L2224/14177 , H01L2224/14505 , H01L2224/16 , H01L2224/16227 , H01L2224/81801 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15312 , H01L2924/3511 , H05K3/3426 , H05K2201/068 , H05K2201/10242 , H05K2201/10909 , Y02P70/613 , Y10T29/49126 , Y10T29/49147 , Y10T29/49149 , Y10T29/49204 , Y10T29/49222 , H01L2924/00014
摘要： According to one aspect of the invention, an electronic assembly is provided. The electronic assembly includes a first substrate having an integrated circuit formed therein and a second substrate. The first and second substrates are interconnected by a plurality of bi-material interconnects that are electrically connected to the integrated circuit and have a first component comprising a conductive first material with a first coefficient of thermal expansion and a second component comprising a second material with a second coefficient of thermal expansion. The first and second components are connected and shaped such that when the temperature of the bi-material interconnects changes the interconnects each bend towards the first or second component. When the temperature of the second substrate increases, the second substrate expands away from a central portion thereof. The bi-material interconnects are arranged such that the bi-material interconnects bend away from the central portion of the second substrate.
摘要翻译： 根据本发明的一个方面，提供一种电子组件。 电子组件包括其中形成有集成电路的第一基板和第二基板。 第一和第二基板通过电连接到集成电路的多个双材料互连互连，并且具有第一部件，该第一部件包括具有第一热膨胀系数的导电第一材料，第二部件包括具有第二材料的第二部件， 第二热膨胀系数。 第一和第二部件被连接和成形，使得当双材料互连件的温度改变时，互连件每个朝着第一或第二部件弯曲。 当第二基板的温度升高时，第二基板从其中心部分扩展。 双材料互连布置成使得双材料互连件远离第二基板的中心部分弯曲。
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公开(公告)号：US20130020711A1
公开(公告)日：2013-01-24
申请号：US13187694
申请日：2011-07-21
申请人： Zhongping Bao , James D. Burrell , Shiqun Gu
发明人： Zhongping Bao , James D. Burrell , Shiqun Gu
IPC分类号： H01L23/488 , C23C16/44 , B32B37/14 , H01L21/28
CPC分类号： H01L24/14 , H01L24/03 , H01L24/05 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/742 , H01L24/81 , H01L2224/0345 , H01L2224/0401 , H01L2224/05011 , H01L2224/05015 , H01L2224/05017 , H01L2224/05558 , H01L2224/056 , H01L2224/1146 , H01L2224/13012 , H01L2224/13013 , H01L2224/13014 , H01L2224/13015 , H01L2224/13017 , H01L2224/13018 , H01L2224/13082 , H01L2224/131 , H01L2224/13139 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/1403 , H01L2224/14051 , H01L2224/141 , H01L2224/14142 , H01L2224/16057 , H01L2224/17051 , H01L2224/81211 , H01L2224/814 , H01L2224/81801 , H01L2924/01006 , H01L2924/01029 , H01L2924/014 , H01L2924/3512 , H01L2924/00015 , H01L2924/00014 , H01L2924/00012
摘要： Pillars having a directed compliance geometry are arranged to couple a semiconductor die to a substrate. The direction of maximum compliance of each pillar may be aligned with the direction of maximum stress caused by unequal thermal expansion and contraction of the semiconductor die and substrate. Pillars may be designed and constructed with various shapes having particular compliance characteristics and particular directions of maximum compliance. The shape and orientation of the pillars may be selected as a function of their location on a die to accommodate the direction and magnitude of stress at their location. A method includes fabricating pillars with particular shapes by patterning to increase surface of materials upon which the pillar is plated or deposited.
摘要翻译： 具有定向柔性几何形状的支柱布置成将半导体管芯耦合到衬底。 每个支柱的最大顺应性的方向可以与由半导体管芯和衬底的不等的热膨胀和收缩引起的最大应力的方向一致。 支柱可以被设计和构造成各种形状，具有特定的顺应特性和最大顺应性的特定方向。 可以选择支柱的形状和取向作为它们在模具上的位置的函数，以适应其位置处的应力的方向和大小。 一种方法包括通过图案化来制造具有特定形状的柱，以增加柱被镀或沉积的材料的表面。
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公开(公告)号：US07183493B2
公开(公告)日：2007-02-27
申请号：US10883433
申请日：2004-06-30
申请人： Jason A. Garcia , John J. Beatty
发明人： Jason A. Garcia , John J. Beatty
IPC分类号： H05K1/09
CPC分类号： H05K3/3436 , H01L24/13 , H01L24/14 , H01L24/17 , H01L24/81 , H01L2224/0401 , H01L2224/05554 , H01L2224/05647 , H01L2224/13013 , H01L2224/13014 , H01L2224/13015 , H01L2224/13078 , H01L2224/13099 , H01L2224/13111 , H01L2224/14051 , H01L2224/14141 , H01L2224/14142 , H01L2224/14145 , H01L2224/14146 , H01L2224/14177 , H01L2224/14505 , H01L2224/16 , H01L2224/16227 , H01L2224/81801 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15312 , H01L2924/3511 , H05K3/3426 , H05K2201/068 , H05K2201/10242 , H05K2201/10909 , Y02P70/613 , Y10T29/49126 , Y10T29/49147 , Y10T29/49149 , Y10T29/49204 , Y10T29/49222 , H01L2924/00014
摘要： According to one aspect of the invention, an electronic assembly is provided. The electronic assembly includes a first substrate having an integrated circuit formed therein and a second substrate. The first and second substrates are interconnected by a plurality of bi-material interconnects that are electrically connected to the integrated circuit and have a first component comprising a conductive first material with a first coefficient of thermal expansion and a second component comprising a second material with a second coefficient of thermal expansion. The first and second components are connected and shaped such that when the temperature of the bi-material interconnects changes the interconnects each bend towards the first or second component. When the temperature of the second substrate increases, the second substrate expands away from a central portion thereof. The bi-material interconnects are arranged such that the bi-material interconnects bend away from the central portion of the second substrate.
摘要翻译： 根据本发明的一个方面，提供一种电子组件。 电子组件包括其中形成有集成电路的第一基板和第二基板。 第一和第二基板通过电连接到集成电路的多个双材料互连互连，并且具有第一部件，该第一部件包括具有第一热膨胀系数的导电第一材料，第二部件包括具有第二材料的第二部件， 第二热膨胀系数。 第一和第二部件被连接和成形，使得当双材料互连件的温度改变时，互连件每个朝着第一或第二部件弯曲。 当第二基板的温度升高时，第二基板从其中心部分扩展。 双材料互连布置成使得双材料互连件远离第二基板的中心部分弯曲。
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公开(公告)号：US20060001159A1
公开(公告)日：2006-01-05
申请号：US10883433
申请日：2004-06-30
申请人： Jason Garcia , John Beatty
发明人： Jason Garcia , John Beatty
CPC分类号： H05K3/3436 , H01L24/13 , H01L24/14 , H01L24/17 , H01L24/81 , H01L2224/0401 , H01L2224/05554 , H01L2224/05647 , H01L2224/13013 , H01L2224/13014 , H01L2224/13015 , H01L2224/13078 , H01L2224/13099 , H01L2224/13111 , H01L2224/14051 , H01L2224/14141 , H01L2224/14142 , H01L2224/14145 , H01L2224/14146 , H01L2224/14177 , H01L2224/14505 , H01L2224/16 , H01L2224/16227 , H01L2224/81801 , H01L2924/01006 , H01L2924/01013 , H01L2924/01022 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/0105 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15312 , H01L2924/3511 , H05K3/3426 , H05K2201/068 , H05K2201/10242 , H05K2201/10909 , Y02P70/613 , Y10T29/49126 , Y10T29/49147 , Y10T29/49149 , Y10T29/49204 , Y10T29/49222 , H01L2924/00014
摘要： According to one aspect of the invention, an electronic assembly is provided. The electronic assembly includes a first substrate having an integrated circuit formed therein and a second substrate. The first and second substrates are interconnected by a plurality of bi-material interconnects that are electrically connected to the integrated circuit and have a first component comprising a conductive first material with a first coefficient of thermal expansion and a second component comprising a second material with a second coefficient of thermal expansion. The first and second components are connected and shaped such that when the temperature of the bi-material interconnects changes the interconnects each bend towards the first or second component. When the temperature of the second substrate increases, the second substrate expands away from a central portion thereof. The bi-material interconnects are arranged such that the bi-material interconnects bend away from the central portion of the second substrate.
摘要翻译： 根据本发明的一个方面，提供一种电子组件。 电子组件包括其中形成有集成电路的第一基板和第二基板。 第一和第二基板通过电连接到集成电路的多个双材料互连互连，并且具有第一部件，该第一部件包括具有第一热膨胀系数的导电第一材料，第二部件包括具有第二材料的第二部件， 第二热膨胀系数。 第一和第二部件被连接和成形，使得当双材料互连件的温度改变时，互连件每个朝着第一或第二部件弯曲。 当第二基板的温度升高时，第二基板从其中心部分扩展。 双材料互连布置成使得双材料互连件远离第二基板的中心部分弯曲。
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