公开(公告)号：US20180331067A1

公开(公告)日：2018-11-15

申请号：US16041765

申请日：2018-07-21

申请人： Adventive Technology Ltd.

发明人： Richard K. Williams ,  Keng-Hung Lin

IPC分类号： H01L23/00 ,  H01L21/3105 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/31 ,  H01L23/495 ,  H01L21/268

CPC分类号： H01L24/96 ,  H01L21/268 ,  H01L21/31058 ,  H01L21/4825 ,  H01L21/4828 ,  H01L21/4842 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L21/78 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/49513 ,  H01L23/4952 ,  H01L23/49551 ,  H01L23/49555 ,  H01L23/49562 ,  H01L23/49568 ,  H01L23/49582 ,  H01L24/06 ,  H01L24/32 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L24/84 ,  H01L24/97 ,  H01L2224/0603 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/37147 ,  H01L2224/40245 ,  H01L2224/4111 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4846 ,  H01L2224/48464 ,  H01L2224/49111 ,  H01L2224/49171 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： A variety of footed and leadless semiconductor packages, with either exposed or isolated die pads, are described. Some of the packages have leads with highly coplanar feet that protrude from a plastic body, facilitating mounting the packages on printed circuit boards using wave-soldering techniques.