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公开(公告)号：US08773866B2
公开(公告)日：2014-07-08
申请号：US12965402
申请日：2010-12-10
申请人： Jun-De Jin , Mei-Show Chen , Tzu-Jin Yeh
发明人： Jun-De Jin , Mei-Show Chen , Tzu-Jin Yeh
CPC分类号： H01L23/645 , H01F19/04 , H01L23/48 , H01L23/642 , H01L24/16 , H01L25/0655 , H01L2224/16225 , H01L2924/09701 , H01L2924/14211 , H01L2924/14215 , H01L2924/1422 , H01L2924/15311 , H01L2924/157 , H01L2924/15786 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19107
摘要： A device includes an interposer and a radio-frequency (RF) device bonded to a first side of the interposer. The interposer includes a first side and a second side opposite to the first side. The interposer does not have through-interposer vias formed therein. First passive devices are formed on the first side of the interposer and electrically coupled to the RF device. Second passive devices are formed on the second side of the interposer. The first and the second passive devices are configured to transmit signals wirelessly between the first passive devices and the second passive devices.
摘要翻译： 一种装置包括插入器和结合到插入器的第一侧的射频（RF）装置。 插入器包括与第一侧相对的第一侧和第二侧。 插入件没有在其中形成通孔插入孔。 第一无源器件形成在插入器的第一侧上并电耦合到RF器件。 第二无源器件形成在插入器的第二侧上。 第一和第二无源器件被配置为在第一无源器件和第二无源器件之间无线地发送信号。
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公开(公告)号：US09780442B2
公开(公告)日：2017-10-03
申请号：US14735199
申请日：2015-06-10
CPC分类号： H01Q1/38 , H01L21/563 , H01L23/66 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2223/6677 , H01L2224/16227 , H01L2224/16237 , H01L2224/27416 , H01L2224/27618 , H01L2224/29011 , H01L2224/2919 , H01L2224/32225 , H01L2224/73103 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81203 , H01L2224/81815 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83862 , H01L2224/94 , H01L2924/1421 , H01L2924/14215 , H01L2924/1422 , H01L2924/1426 , H01L2924/20271 , H01Q1/2283 , H01L2924/00014 , H01L2924/00012 , H01L2224/11 , H01L2224/27 , H01L2924/0665
摘要： A joined structure which is configured such that a space between adjacent substrates is filled with a filling material. The joined structure includes a first substrate having a first conductor formed on a surface of the first substrate, a second substrate having a second conductor formed on a surface of the second substrate, arranged so that a surface of the first substrate faces a surface of the second substrate, a connecting conductor which electrically connects the first conductor and the second conductor, and a filling material between the first substrate and the second substrate. The filling material is formed into such a shape that a space is provided which corresponds to at least one of the first conductor, the second and the connecting conductor.
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公开(公告)号：US20150380813A1
公开(公告)日：2015-12-31
申请号：US14735199
申请日：2015-06-10
CPC分类号： H01Q1/38 , H01L21/563 , H01L23/66 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2223/6677 , H01L2224/16227 , H01L2224/16237 , H01L2224/27416 , H01L2224/27618 , H01L2224/29011 , H01L2224/2919 , H01L2224/32225 , H01L2224/73103 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81203 , H01L2224/81815 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83862 , H01L2224/94 , H01L2924/1421 , H01L2924/14215 , H01L2924/1422 , H01L2924/1426 , H01L2924/20271 , H01Q1/2283 , H01L2924/00014 , H01L2924/00012 , H01L2224/11 , H01L2224/27 , H01L2924/0665
摘要： A joined structure which is configured such that a space between adjacent substrates is filled with a filling material. The joined structure includes a first substrate having a first conductor formed on a surface of the first substrate, a second substrate having a second conductor formed on a surface of the second substrate, arranged so that a surface of the first substrate faces a surface of the second substrate, a connecting conductor which electrically connects the first conductor and the second conductor, and a filling material between the first substrate and the second substrate. The filling material is formed into such a shape that a space is provided which corresponds to at least one of the first conductor, the second and the connecting conductor.
摘要翻译： 一种接合结构，其被构造成使得相邻基板之间的空间填充有填充材料。 所述接合结构包括具有形成在所述第一基板的表面上的第一导体的第一基板，具有形成在所述第二基板的表面上的第二导体的第二基板，所述第二基板被布置成使得所述第一基板的表面面向所述第二基板的表面， 第二基板，电连接第一导体和第二导体的连接导体，以及在第一基板和第二基板之间的填充材料。 填充材料形成为与第一导体，第二导体和连接导体中的至少一个对应的空间。
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公开(公告)号：US20170309998A1
公开(公告)日：2017-10-26
申请号：US15645553
申请日：2017-07-10
CPC分类号： H01Q1/38 , H01L21/563 , H01L23/66 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/81 , H01L24/83 , H01L2223/6677 , H01L2224/16227 , H01L2224/16237 , H01L2224/27416 , H01L2224/27618 , H01L2224/29011 , H01L2224/2919 , H01L2224/32225 , H01L2224/73103 , H01L2224/73104 , H01L2224/73203 , H01L2224/73204 , H01L2224/81191 , H01L2224/81203 , H01L2224/81815 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/83862 , H01L2224/94 , H01L2924/1421 , H01L2924/14215 , H01L2924/1422 , H01L2924/1426 , H01L2924/20271 , H01Q1/2283 , H01L2924/00014 , H01L2924/00012 , H01L2224/11 , H01L2224/27 , H01L2924/0665
摘要： A joined structure which is configured such that a space between adjacent substrates is filled with a filling material. The joined structure includes a first substrate having a first conductor formed on a surface of the first substrate, a second substrate having a second conductor formed on a surface of the second substrate, arranged so that a surface of the first substrate faces a surface of the second substrate, a connecting conductor which electrically connects the first conductor and the second conductor, and a filling material between the first substrate and the second substrate. The filling material is formed into such a shape that a space is provided which corresponds to at least one of the first conductor, the second and the connecting conductor.
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公开(公告)号：US20120147578A1
公开(公告)日：2012-06-14
申请号：US12965402
申请日：2010-12-10
申请人： Jun-De Jin , Mei-Show Chen , Tzu-Jin Yeh
发明人： Jun-De Jin , Mei-Show Chen , Tzu-Jin Yeh
CPC分类号： H01L23/645 , H01F19/04 , H01L23/48 , H01L23/642 , H01L24/16 , H01L25/0655 , H01L2224/16225 , H01L2924/09701 , H01L2924/14211 , H01L2924/14215 , H01L2924/1422 , H01L2924/15311 , H01L2924/157 , H01L2924/15786 , H01L2924/15787 , H01L2924/15788 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19107
摘要： A device includes an interposer and a radio-frequency (RF) device bonded to a first side of the interposer. The interposer includes a first side and a second side opposite to the first side. The interposer does not have through-interposer vias formed therein. First passive devices are formed on the first side of the interposer and electrically coupled to the RF device. Second passive devices are formed on the second side of the interposer. The first and the second passive devices are configured to transmit signals wirelessly between the first passive devices and the second passive devices.
摘要翻译： 一种装置包括插入器和结合到插入器的第一侧的射频（RF）装置。 插入器包括与第一侧相对的第一侧和第二侧。 插入件没有在其中形成通孔插入孔。 第一无源器件形成在插入器的第一侧上并电耦合到RF器件。 第二无源器件形成在插入器的第二侧上。 第一和第二无源器件被配置为在第一无源器件和第二无源器件之间无线地发送信号。
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