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    TIME DELAY INTEGRATION SENSOR WITH PIXELS HAVING DIFFERENT SENSING ABILITY
    2.
    发明公开
    TIME DELAY INTEGRATION SENSOR WITH PIXELS HAVING DIFFERENT SENSING ABILITY 审中-公开

    公开(公告)号：US20230353902A1

    公开(公告)日：2023-11-02

    申请号：US18350905

    申请日：2023-07-12

    Applicant: PIXART IMAGING INC.

    Inventor： Ren-Chieh LIU

    IPC: H04N25/768

    CPC classification number: H04N25/768

    Abstract: The present disclosure provides a time delay integration (TDI) sensor using a rolling shutter. The TDI sensor includes multiple pixel columns. Each pixel column includes multiple pixels arranged in an along-track direction, wherein two adjacent pixels or two adjacent pixel groups in every pixel column have a separation space therebetween. The separation space is equal to a pixel height multiplied by a time ratio of a line time difference of the rolling shutter and a frame period, or equal to a summation of at least one pixel height and a multiplication of the pixel height by the time ratio of the line time difference and the frame period. The TDI sensor generates image frames using pixels having different sensing ability for a processor to perform image combination.

    SYSTEMS AND METHODS FOR INCREASING DYNAMIC RANGE OF TIME-DELAY INTEGRATION IMAGES
    3.
    发明公开
    SYSTEMS AND METHODS FOR INCREASING DYNAMIC RANGE OF TIME-DELAY INTEGRATION IMAGES 审中-公开

    公开(公告)号：US20240357246A1

    公开(公告)日：2024-10-24

    申请号：US18758833

    申请日：2024-06-28

    Applicant: LYNX SYSTEM DEVELOPERS, INC.

    Inventor： Jeremy W. Aldridge ,  Kirk Sigel ,  Douglas DeAngelis ,  Mike E. Ciholas

    IPC: H04N23/951 ,  H04N23/741 ,  H04N25/768

    CPC classification number: H04N23/951 ,  H04N23/741 ,  H04N25/768

    Abstract: A method for increasing dynamic range of a time-delay integration (TDI) image includes assigning a value N to a line-number setting and generating each line of the TDI image by (i) selecting N lines from N corresponding images of an image sequence, and (ii) integrating the N lines. The brightness of the TDI image is evaluated, after which the line-number setting is updated to a new value. In another method, the value of a TDI pixel is initialized to the value of a corresponding pixel in a first image of the image sequence. While the TDI pixel value is less than a ceiling, a contribution is added to the TDI pixel value, the contribution being based on the value of an additional corresponding pixel in an additional image of the image sequence. After adding, the resulting TDI pixel value may be scaled based on the number of contributions.

    IMAGING UNIT AND INFORMATION PROCESSING SYSTEM
    4.
    发明公开
    IMAGING UNIT AND INFORMATION PROCESSING SYSTEM 审中-公开

    公开(公告)号：US20240323565A1

    公开(公告)日：2024-09-26

    申请号：US18574180

    申请日：2022-03-11

    Applicant: SONY SEMICONDUCTOR SOLUTIONS CORPORATION

    Inventor： TAKAFUMI TAKATSUKA ,  JUN OGI

    IPC: H04N25/768 ,  H04N25/616

    CPC classification number: H04N25/768 ,  H04N25/616

    Abstract: An imaging unit according to one aspect of the present disclosure includes a plurality of pixels disposed in a matrix form, and a controller that performs TDI control on the plurality of pixels. Each of the pixels includes a light pulse responder and a counter section. The light pulse responder generates a light pulse in response to incidence of light. The counter section includes a rewrite circuit and an adder circuit. The rewrite circuit rewrites an initial value. The adder circuit adds information corresponding to the light pulse to the initial value. The controller causes information held in the counter section to be written as the initial value into the counter section included in the pixel of a next stage in a column direction, and thereafter causes the information corresponding to the light pulse obtained from the light pulse responder to be added to the initial value.

    Imaging sensor having avalanche diode and control method of imaging sensor
    7.
    发明授权
    Imaging sensor having avalanche diode and control method of imaging sensor 有权

    公开(公告)号：US12022220B2

    公开(公告)日：2024-06-25

    申请号：US18059275

    申请日：2022-11-28

    Applicant: CANON KABUSHIKI KAISHA

    Inventor： Koki Honda

    IPC: H04N25/768 ,  H04N25/13

    CPC classification number: H04N25/768 ,  H04N25/134

    Abstract: Among a plurality of time measurement circuits configured to measure a time until a pixel counter saturates in the imaging sensor having the signal multiplication pixel structure, at least one time measurement circuit functions as a time counter that obtains a time from the pixel counter starting count of pulses until saturation and the other time measurement circuits function as a difference counter that obtains a difference between a time until a certain pixel counter saturates and a time until another pixel counter different from the certain pixel counter saturates. Then, a time from the pixel counter associated with the time measurement circuit that functions as a difference counter starting count of the pulses until saturation is found by calculation processing.

    A METHOD AND APPARATUS FOR HIGH-SPEED CHARGE-COUPLED CMOS TDI IMAGING
    8.
    发明公开
    A METHOD AND APPARATUS FOR HIGH-SPEED CHARGE-COUPLED CMOS TDI IMAGING 审中-公开

    公开(公告)号：US20240022835A1

    公开(公告)日：2024-01-18

    申请号：US18025729

    申请日：2020-09-10

    Applicant: TELEDYNE DIGITAL IMAGING, INC.

    Inventor： HYUN JUNG LEE ,  PAUL DONEGAN

    IPC: H04N25/77 ,  H04N25/75 ,  H04N25/768 ,  H04N25/78

    CPC classification number: H04N25/77 ,  H04N25/75 ,  H04N25/768 ,  H04N25/78

    Abstract: A method and apparatus (e.g. circuitry) provide high-speed charge-coupled CMOS TDI imaging based on the parallel readout operation of multiple TDI stages. A plurality (N) of output registers are reset and precharged globally in parallel ready to take charge transferred from the same number (N) of the TDI pixel registers. Each of the signal charges at respective output registers is converted to a signal voltage in parallel. Each of the analog signal voltages is then converted to a digital value in parallel by each of the number of the ADCs. The AD conversion is also performed in parallel while the next N number of the TDI registers is processed. The N output registers are linked to receive the charges from a beginning of the registers along to an end. Converting the respective signal voltages is performed by S/H capacitor array circuitry in a ping-pong fashion using CDS voltages.

    X-RAY WELD INSPECTION
    9.
    发明公开
    X-RAY WELD INSPECTION 审中-公开

    公开(公告)号：US20230349840A1

    公开(公告)日：2023-11-02

    申请号：US17571511

    申请日：2020-07-08

    Applicant: Direct Conversion AB

    Inventor： Tuomas Pantsar ,  Alex Stewart ,  Christer Ullberg

    IPC: G01N23/044 ,  G01N23/18 ,  H04N25/768

    CPC classification number: G01N23/044 ,  G01N23/18 ,  H04N25/768 ,  G01N2223/629 ,  G01N2223/3303 ,  G01N2223/306 ,  G01N2223/628

    Abstract: An x-ray weld inspection apparatus has at least one x-ray source, at least one x-ray detector, a motor arrangement configured to move the at least one x-ray source and the at least one x-ray detector substantially along a weld, and a control device. The control device comprises memory and at least one processing core, configured to control the motor arrangement to move the at least one x-ray source and the at least one x-ray detector during an x-ray weld scan substantially along the direction of the weld. At least one section of the weld is imaged at least twice during a single x-ray scan, producing at least two imaging data sets, respectively. An angle of incidence of x-rays at the at least one section of the weld is different for the imaging data sets.

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