公开(公告)号：US20130130416A1

公开(公告)日：2013-05-23

申请号：US13372292

申请日：2012-02-13

申请人： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

发明人： Andreas Bibl ,  John A. Higginson ,  Hung-Fai Stephen Law ,  Hsin-Hua Hu

IPC分类号： H01L21/306

CPC分类号： H01L24/83 ,  B32B37/025 ,  B32B37/06 ,  B32B2457/20 ,  H01L21/67144 ,  H01L21/6833 ,  H01L24/75 ,  H01L24/95 ,  H01L24/97 ,  H01L2224/75725 ,  H01L2224/7598 ,  H01L2224/83005 ,  H01L2224/97 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/1421 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/15153 ,  Y10T156/1153 ,  Y10T156/1707 ,  Y10T156/1744 ,  Y10T156/1749 ,  Y10T156/1776 ,  H01L2224/83 ,  H01L2924/00

摘要： A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate.

摘要翻译： 公开了一种微器件转印头和头阵列。 在一个实施例中，微器件转移头包括基底，具有侧壁的台面结构，形成在台面结构上的电极以及覆盖电极的电介质层。 可以将电压施加到微器件转移头和头阵列以从载体衬底拾取微器件并将微器件释放到接收衬底上。

公开(公告)号：US08402642B2

公开(公告)日：2013-03-26

申请号：US12877389

申请日：2010-09-08

申请人： Toshinori Kujuro ,  Hiroyuki Etoh

发明人： Toshinori Kujuro ,  Hiroyuki Etoh

IPC分类号： B23B31/00 ,  B65B9/06

CPC分类号： B68G9/00 ,  Y10T29/5186 ,  Y10T29/53417 ,  Y10T156/1075 ,  Y10T156/13 ,  Y10T156/1322 ,  Y10T156/1374 ,  Y10T156/1724 ,  Y10T156/1749 ,  Y10T156/1761 ,  Y10T156/1768 ,  Y10T156/1776

摘要： In a pocket coil spring structure assembling apparatus, a row-of-pocket-coil-springs auxiliary feed stock mechanism and a row-of-pocket-coil-springs delivery mechanism are connected together in series so as to form a row-of-pocket-coil-springs supply unit, a plurality of row-of-pocket-coil-springs supply units are disposed on an upstream side with respect to a sealing/cutting mechanism, a control apparatus is allowed to alternatively select a row-of-pocket-coil-springs supply unit to face the sealing/cutting mechanism from the plurality of row-of-pocket-coil-springs supply units, and a row-of-pocket-coil-springs supply unit alternatively selected is moved to face the sealing/cutting mechanism.

摘要翻译： 在袋式螺旋弹簧结构装配装置中，串行螺旋弹簧辅助送料机构和排袋式螺旋弹簧输送机构串联连接在一起， 袋式螺旋弹簧供给单元，在密封切断机构的上游侧设置有多个排袋式螺旋弹簧供给单元，控制装置可以选择排列的螺旋弹簧供给单元， 袋形螺旋弹簧供应单元面对来自多个行内袋形螺旋弹簧供应单元的密封/切割机构，并且交替地选择的行袋螺旋弹簧供应单元被移动以面对 密封/切割机构。

公开(公告)号：US08123889B2

公开(公告)日：2012-02-28

申请号：US11667859

申请日：2005-11-14

申请人： Yasuhiro Numao

发明人： Yasuhiro Numao

IPC分类号： B29C65/52 ,  B29C65/60 ,  H01M8/00

CPC分类号： H01M8/0297 ,  H01M8/0228 ,  H01M8/028 ,  H01M8/0286 ,  Y02P70/56 ,  Y10T156/1749 ,  Y10T156/1761 ,  Y10T156/1798

摘要： A second separator (2) that becomes an opposite electrode to a first separator (1) is stacked on a surface of the first separator (1), on which an adhesive (3) is coated, and a separator unit (4) as a set is formed. Then, at least two or more of the separator units (4) are stacked on one another, and the adhesive (3) is cured.

摘要翻译： 在第一隔板（1）的表面涂敷作为第一隔膜（1）的相对电极的第二隔板（2），涂布有粘接剂（3）的隔膜单元（4） 集合形成。 然后，至少两个以上的分离器单元（4）彼此堆叠，并且粘合剂（3）固化。

公开(公告)号：US07901535B2

公开(公告)日：2011-03-08

申请号：US11063764

申请日：2005-02-23

申请人： Fu-Lai Yu

发明人： Fu-Lai Yu

IPC分类号： B32B15/00

CPC分类号： B31D3/023 ,  E06B9/262 ,  E06B9/266 ,  E06B2009/2627 ,  Y10T156/1003 ,  Y10T156/1051 ,  Y10T156/1056 ,  Y10T156/1069 ,  Y10T156/1075 ,  Y10T156/13 ,  Y10T156/1749 ,  Y10T156/1751 ,  Y10T156/1798

摘要： An apparatus and method for making expandable honeycomb structures suitable for use as window coverings is provided. Material is fed to a folder and past a cutter. Adhesive is applied to the material downstream of the cutter and the material is cut to desired lengths. The cut strips of material are stacked with similarly formed strips to form the honeycomb structure.

摘要翻译： 提供一种用于制造适合用作窗帘的可膨胀蜂窝结构的装置和方法。 材料被馈送到文件夹并经过切割器。 将粘合剂施加到切割器下游的材料，并将材料切割成所需的长度。 切割的材料条被堆叠成类似形成的条形成蜂窝状结构。

公开(公告)号：US07798191B2

公开(公告)日：2010-09-21

申请号：US12116927

申请日：2008-05-07

申请人： Kia Silverbrook

发明人： Kia Silverbrook

IPC分类号： B32B7/14 ,  B41M1/02 ,  B65H3/20 ,  B65H39/10 ,  B42C13/00 ,  B41M1/14 ,  B42C19/02 ,  B42C19/06

CPC分类号： B42C1/12 ,  B41J3/44 ,  B41J3/60 ,  B41J13/106 ,  B42C9/0081 ,  B65H37/04 ,  B65H39/10 ,  Y10T156/1749 ,  Y10T156/1798

摘要： Provided is a printing arrangement having a driving station operatively driving print media along a path, an adhesive application station to apply adhesive to the print media, and a printing station to print upon the print media. The printing arrangement has a page binding support tray having a tray, a vibrator and a binding press. The tray is suspended from a frame via dampers, said tray operatively receiving the print media after printing and after the adhesive has been applied. The vibrator is arranged below a corner of the tray, and the binding press is arranged on the frame over the adhesive and configured to bind the print media by applying pressure to the adhesive.

摘要翻译： 提供了一种打印装置，其具有沿着路径操作地驱动打印介质的驱动站，将粘合剂施加到打印介质的粘合剂施加站以及在打印介质上打印的打印站。 打印装置具有带有托盘，振动器和装订机的页面装订支撑托盘。 托盘通过阻尼器从框架悬挂，所述托盘在打印之后和在粘合剂被施加之后可操作地接收打印介质。 振动器布置在托盘的角落的下方，并且捆扎机布置在框架上方的粘合剂上并且构造成通过向粘合剂施加压力来结合打印介质。

公开(公告)号：US20080008923A1

公开(公告)日：2008-01-10

申请号：US11667859

申请日：2005-11-14

申请人： Yasuhiro Numao

发明人： Yasuhiro Numao

IPC分类号： H01M2/18 ,  B32B37/12 ,  H01M2/16

CPC分类号： H01M8/0297 ,  H01M8/0228 ,  H01M8/028 ,  H01M8/0286 ,  Y02P70/56 ,  Y10T156/1749 ,  Y10T156/1761 ,  Y10T156/1798

摘要： A second separator (2) that becomes an opposite electrode to a first separator (1) is stacked on a surface of the first separator (1), on which an adhesive (3) is coated, and a separator unit (4) as a set is formed. Then, at least two or more of the separator units (4) are stacked on one another, and the adhesive (3) is cured.

摘要翻译： 在第一隔板（1）的表面涂敷作为第一隔膜（1）的相对电极的第二隔板（2），涂布有粘接剂（3）的隔膜单元（4） 集合形成。 然后，至少两个以上的分离器单元（4）彼此堆叠，并且粘合剂（3）固化。

公开(公告)号：US20070180679A1

公开(公告)日：2007-08-09

申请号：US11695868

申请日：2007-04-03

申请人： Lynn Howe ,  William Torris ,  Glynn Clements

发明人： Lynn Howe ,  William Torris ,  Glynn Clements

IPC分类号： B21D39/03 ,  B23P11/00 ,  B21B1/46 ,  B23P19/00 ,  B23P21/00 ,  B29C65/06

CPC分类号： B29C45/006 ,  B29C45/0084 ,  B29C45/1769 ,  B29C45/42 ,  B29C65/08 ,  B29C65/606 ,  B29C66/54 ,  B29C66/843 ,  Y10T29/49826 ,  Y10T29/49828 ,  Y10T29/49829 ,  Y10T29/49893 ,  Y10T29/49895 ,  Y10T29/49901 ,  Y10T29/49947 ,  Y10T29/4998 ,  Y10T29/53 ,  Y10T29/53313 ,  Y10T29/53317 ,  Y10T29/53435 ,  Y10T29/53443 ,  Y10T156/10 ,  Y10T156/1744 ,  Y10T156/1746 ,  Y10T156/1749 ,  Y10T156/1761 ,  B29C65/00

摘要： The subject invention relates to a precision injection molding of multi-piece parts and the subsequent handling and assembly of those parts produced from the mold. In an exemplary embodiment, a surgical suture package with a top part and a bottom part is molded and assembled. In such a method and system, the top parts and bottom parts are first molded utilizing a family mold and then are transferred to a stacker. The stacker is able to stack the top part and bottom part on top of one another on a pallet. The parts are then transported to a welder in order to weld the top part and bottom part together. The completed surgical suture packages are then transferred to a magazine for storage and shippage.

摘要翻译： 本发明涉及多件件的精密注射成型和随后的从模具制造的零件的处理和组装。 在示例性实施例中，具有顶部和底部的外科缝合包装被模制和组装。 在这种方法和系统中，顶部和底部首先用家庭模具模制，然后转移到堆垛机。 堆垛机能够将托盘上的顶部和底部堆叠在彼此的顶部。 然后将这些部件输送到焊工，以将顶部和底部焊接在一起。 然后将完成的手术缝合包装转移到杂志以进行储存和运送。

公开(公告)号：US07080675B2

公开(公告)日：2006-07-25

申请号：US10968131

申请日：2004-10-20

申请人： Masayuki Yamamoto

发明人： Masayuki Yamamoto

IPC分类号： H01L21/68 ,  H01L21/301 ,  H01L21/44 ,  B32B39/00

CPC分类号： H01L21/67132 ,  Y10S438/976 ,  Y10T156/17 ,  Y10T156/1744 ,  Y10T156/1749

摘要： In a method for joining an adhesive tape to a back face of a semiconductor wafer after a process of working the back face of the semiconductor wafer, the semiconductor wafer is held at a state where a face having a pattern formed thereon is directed upward, and the adhesive tape is joined to the back face of the semiconductor wafer from below.

摘要翻译： 在对半导体晶片的背面进行加工的工序之后，将粘合带接合到半导体晶片的背面的方法中，将半导体晶片保持在其上形成有图案的面朝向上方的状态， 粘合带从下方接合到半导体晶片的背面。

公开(公告)号：US07000665B2

公开(公告)日：2006-02-21

申请号：US10666045

申请日：2003-09-22

申请人： Michael Parker ,  Gilles Gagnon

发明人： Michael Parker ,  Gilles Gagnon

IPC分类号： B32B31/00

CPC分类号： B32B37/003 ,  B32B38/1858 ,  B32B38/1866 ,  B32B2457/10 ,  H01M2/266 ,  H01M6/42 ,  H01M10/0404 ,  H01M10/0413 ,  H01M10/0436 ,  H01M10/0445 ,  H01M10/052 ,  H01M10/44 ,  Y10T29/49112 ,  Y10T29/53135 ,  Y10T156/1052 ,  Y10T156/1075 ,  Y10T156/12 ,  Y10T156/13 ,  Y10T156/1322 ,  Y10T156/1744 ,  Y10T156/1749 ,  Y10T156/1761

摘要： A stacking apparatus and a method for assembly of electrochemical cells. The stacking apparatus includes at least one stacking head having an adjustable holding member adapted to hold an electrochemical laminate of a pre-determined length and means for adjusting the shape of the electrochemical laminate of the pre-determined length during stacking of a plurality of electrochemical laminates. The electrochemical laminates are assembled in a way that prevents air entrapment between the electrochemical laminates.

公开(公告)号：US20050101103A1

公开(公告)日：2005-05-12

申请号：US10968131

申请日：2004-10-20

申请人： Masayuki Yamamoto

发明人： Masayuki Yamamoto

IPC分类号： H01L21/683 ,  H01L21/00 ,  H01L21/301 ,  H01L21/44 ,  H01L21/68

CPC分类号： H01L21/67132 ,  Y10S438/976 ,  Y10T156/17 ,  Y10T156/1744 ,  Y10T156/1749

摘要： In a method for joining an adhesive tape to a back face of a semiconductor wafer after a process of working the back face of the semiconductor wafer, the semiconductor wafer is held at a state where a face having a pattern formed thereon is directed upward, and the adhesive tape is joined to the back face of the semiconductor wafer from below.

摘要翻译： 在对半导体晶片的背面进行加工的工序之后，将粘合带接合到半导体晶片的背面的方法中，将半导体晶片保持在其上形成有图案的面朝向上方的状态， 粘合带从下方接合到半导体晶片的背面。