公开(公告)号：US06440258B1

公开(公告)日：2002-08-27

申请号：US09400970

申请日：1999-09-22

申请人： Yasuo Imashiro ,  Takahiko Ito ,  Hideshi Tomita ,  Norimasa Nakamura

发明人： Yasuo Imashiro ,  Takahiko Ito ,  Hideshi Tomita ,  Norimasa Nakamura

IPC分类号： C09J16310

CPC分类号： H01L24/29 ,  C08L63/00 ,  C08L79/08 ,  C08L2666/20 ,  C09J7/10 ,  C09J163/00 ,  C09J179/00 ,  C09J2203/326 ,  C09J2463/00 ,  C09J2479/08 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29386 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15787 ,  H01L2924/19042 ,  H05K3/305 ,  H05K2201/0154 ,  H05K2201/0209 ,  Y02P70/613 ,  Y10T428/2817 ,  Y10T428/2839 ,  Y10T428/287 ,  Y10T428/2878 ,  Y10T428/2896 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/05442 ,  H01L2924/05432 ,  H01L2924/0532 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： The present invention provides an adhesive film for semiconductor package, which comprises a polycarbodiimide resin, an epoxy resin and an inorganic filler, wherein the polycarbodiimide resin has a polystyrene-reduced number-average molecular weight of 3,000 to 50,000 as measured by gel permeation chromatography, the epoxy resin is contained in an amount of 20 to 150 parts by weight per 100 parts by weight of the polycarbodiimide resin, and the inorganic filler is contained in an amount of 30 to 70% by weight based on the total resin content.

摘要翻译： 本发明提供了一种半导体封装用粘合膜，其包含聚碳二亚胺树脂，环氧树脂和无机填料，其中聚碳二亚胺树脂通过凝胶渗透色谱法测定的聚苯乙烯换算的数均分子量为3,000〜50,000， 相对于100重量份聚碳二亚胺树脂，环氧树脂的含量为20〜150重量份，相对于总树脂含量，含有30〜70重量％的无机填料。