公开(公告)号：US06643916B2

公开(公告)日：2003-11-11

申请号：US09860904

申请日：2001-05-18

申请人： Thane M. Larson

发明人： Thane M. Larson

IPC分类号： H01C1700

CPC分类号： H01L23/642 ,  H01L2924/0002 ,  H05K1/0231 ,  H05K1/141 ,  H05K1/162 ,  H05K3/325 ,  H05K2201/10378 ,  H05K2201/10545 ,  H05K2201/10719 ,  Y10T29/49082 ,  Y10T29/4913 ,  Y10T29/49139 ,  H01L2924/00

摘要： A method and apparatus to mount a capacitor plate to a substrate, under a component. One embodiment of the invention involves a method to assemble a capacitor plate on a substrate. A second embodiment of the invention involves a method to fabricate a capacitor plate. A third embodiment of the invention involves an assembled substrate with a capacitor plate on the second side of the assembled substrate, under an electrical contact area of a component on the first side of the assembled substrate.

摘要翻译： 一种在组件下方将电容器板安装到基板的方法和装置。 本发明的一个实施例涉及一种将电容器板组装在基板上的方法。 本发明的第二实施例涉及一种制造电容器板的方法。 本发明的第三实施例涉及在组装的衬底的第二面上的组装衬底上的组件衬底的第二侧上的组件的电接触区域。

公开(公告)号：US06588094B2

公开(公告)日：2003-07-08

申请号：US09974272

申请日：2001-10-09

申请人： Noboru Furukawa ,  Masahiko Kawase ,  Yasunori Ito

发明人： Noboru Furukawa ,  Masahiko Kawase ,  Yasunori Ito

IPC分类号： H01C1700

CPC分类号： H01C7/008 ,  H01C17/288 ,  Y10T29/49082 ,  Y10T29/49083

摘要： Thermistor chips are produced by preparing ceramic green sheets, applying an inorganic material such as a glass paste on these green sheets in areas including lines along which they are to be later cut, stacking a plurality of these green sheets one on top of another to obtain a stacked body, obtaining chips by cutting this stacked body along those pre-specified lines and subjecting these chips to a firing process to obtain sintered bodies, and forming outer electrodes on mutually opposite end surfaces of these sintered bodies. A thermistor chip thus produced has a thermistor element having outer electrodes on its mutually opposite end surfaces, and diffused layers of an inorganic material having a higher specific resistance than material of the thermistor element. These diffused layers are formed proximally to externally exposed surfaces of the thermistor element.

公开(公告)号：US06647614B1

公开(公告)日：2003-11-18

申请号：US09693765

申请日：2000-10-20

申请人： Arne W. Ballantine ,  Cyril Cabral, Jr. ,  Daniel C. Edelstein ,  Anthony K. Stamper

发明人： Arne W. Ballantine ,  Cyril Cabral, Jr. ,  Daniel C. Edelstein ,  Anthony K. Stamper

IPC分类号： H01C1700

CPC分类号： H01L28/20 ,  H01C7/006 ,  H01C17/242 ,  Y10T29/49082 ,  Y10T29/49099 ,  Y10T29/49105

摘要： A method for changing an electrical resistance of a resistor. Initially, the resistor is provided, wherein the resistor has a length L and an electrical resistance R1. A portion of the resistor is exposed to a laser radiation, wherein the portion includes a fraction F of the length L of the resistor. After the resistor has been exposed to the laser radiation, the resistor has an electrical resistance R2, wherein R2 is unequal to R1.

摘要翻译： 一种改变电阻器电阻的方法。 首先，提供电阻器，其中电阻器具有长度L和电阻R1。 电阻器的一部分暴露于激光辐射，其中该部分包括电阻器长度L的分数F. 在电阻器暴露于激光辐射之后，电阻器具有电阻R2，其中R2不等于R1。

公开(公告)号：US06622372B2

公开(公告)日：2003-09-23

申请号：US09867026

申请日：2001-05-29

申请人： Frederick W. Hintz ,  Stephen J. Postma

发明人： Frederick W. Hintz ,  Stephen J. Postma

IPC分类号： H01C1700

CPC分类号： G01D18/00 ,  G01D11/245 ,  H03K17/945 ,  H03K2217/94089 ,  Y10T29/49004 ,  Y10T29/49007 ,  Y10T29/49082 ,  Y10T29/49087 ,  Y10T29/49098 ,  Y10T29/49156

摘要： A sensor device is assembled by placing a sensor and a potentiometer within a sensor casing. An electrical connection extending from inside to outside the sensing casing has an interior portion inside the sensor casing and an exterior portion outside the sensor casing. The sensor and the potentiometer are coupled to the interior portion and are sealed within the sensor casing. A potentiometer setting apparatus is coupled to the exterior portion and is used to set the potentiometer. Then, the interior portion of the electrical connection is destroyed so that the potentiometer cannot be subsequently reset.

摘要翻译： 通过将传感器和电位器放置在传感器外壳内来组装传感器装置。 从感测壳体的内部向外部延伸的电连接件具有传感器外壳内部的内部部分和传感器外壳外部的外部部分。 传感器和电位计耦合到内部部分并被密封在传感器外壳内。 电位器设定装置与外部部分连接，用于设定电位计。 然后，电连接的内部被破坏，使得电位器不能随后复位。

公开(公告)号：US06276049B1

公开(公告)日：2001-08-21

申请号：US09167108

申请日：1998-10-06

申请人： Frederick W. Hintz ,  Stephen J. Postma

发明人： Frederick W. Hintz ,  Stephen J. Postma

IPC分类号： H01C1700

CPC分类号： G01D18/00 ,  G01D11/245 ,  H03K17/945 ,  H03K2217/94089 ,  Y10T29/49004 ,  Y10T29/49007 ,  Y10T29/49082 ,  Y10T29/49087 ,  Y10T29/49098 ,  Y10T29/49156

摘要： A sensor, such as a proximity sensor, having its components sealed within a case, has its sensitivity adjusted with a remotely settable digital potentiometer after assembly of the sensor. The adjustment connection is then destroyed.

摘要翻译： 诸如接近传感器的传感器，其组件密封在壳体内，在传感器组装之后，利用可远程设置的数字电位计调节其灵敏度。 调整连接然后被销毁。

公开(公告)号：US06757963B2

公开(公告)日：2004-07-06

申请号：US10052249

申请日：2002-01-23

申请人： Alan M. Meier ,  David R. Miller ,  Kevin R. Dickson ,  Roger S. Perkins ,  Michael M. Ramarge

发明人： Alan M. Meier ,  David R. Miller ,  Kevin R. Dickson ,  Roger S. Perkins ,  Michael M. Ramarge

IPC分类号： H01C1700

CPC分类号： H01C7/123 ,  Y10T29/43 ,  Y10T29/49082 ,  Y10T29/49098 ,  Y10T29/49163

摘要： A surface of a first ceramic component is joined to a surface of a second ceramic component using a silver-based composition. The silver-based composition is a mixture of silver metal and a metal oxide and the metal in the metal oxide is a metal other than silver. The silver-based composition is applied to the surface of the first ceramic component and to the surface of the second ceramic component. The silver-based composition applied to the first ceramic component is contacted to the silver-based composition applied to the second ceramic component. The surfaces of the first and second ceramic components are heated to melt the applied silver-based compositions. The surfaces of the first and second ceramic components are cooled to form a bond between the first and second ceramic components.

摘要翻译： 使用银基组合物将第一陶瓷部件的表面接合到第二陶瓷部件的表面。 银基组合物是银金属和金属氧化物的混合物，并且金属氧化物中的金属是除银以外的金属。 将银基组合物施加到第一陶瓷部件的表面和第二陶瓷部件的表面。 施加到第一陶瓷组分的银基组合物与施加到第二陶瓷组分的银基组合物接触。 加热第一和第二陶瓷组分的表面以熔化所施加的银基组合物。 第一和第二陶瓷部件的表面被冷却以在第一和第二陶瓷部件之间形成结合。

公开(公告)号：US06662429B1

公开(公告)日：2003-12-16

申请号：US09868949

申请日：2001-06-22

申请人： Gottfried Domorazek

发明人： Gottfried Domorazek

IPC分类号： H01C1700

CPC分类号： G01F23/22 ,  Y10T29/49004 ,  Y10T29/49082 ,  Y10T29/49083 ,  Y10T29/49155

摘要： In a device for measuring the filling level, thermoelements (20) are used which are disposed on a sheet-shaped support (25). The thermoelements (20) consist of two different materials and are disposed in two rows (71, 72) placed side by side. Two adjacent thermoelements (20) of said rows (71, 72) have a common junction point (23) that is heated. Both rows (71, 72) of thermoelements also have two additional junction points that are cold. A first group of thermoelements (20) is disposed with their supports (25) in the interior of the container and operate as measuring detectors. A second group of thermoelements (20) serves as reference sensors since they regulate the heat flow impinging upon the junctions points (23) relative to a defined reference voltage.

摘要翻译： 在用于测量填充水平的装置中，使用设置在片状支撑件（25）上的热电元件（20）。 热电偶（20）由两种不同的材料组成，并排设置成并列放置的两排（71,72）。 所述行（71,72）的两个相邻的热电元件（20）具有被加热的公共接合点（23）。 热电偶的两排（71,72）还具有两个冷的另外的连接点。 第一组热电偶（20）以其支撑件（25）设置在容器的内部并作为测量检测器操作。 第二组热电偶（20）用作参考传感器，因为它们调节相对于限定的参考电压撞击接合点（23）的热流。

公开(公告)号：US06604276B2

公开(公告)日：2003-08-12

申请号：US09839492

申请日：2001-04-23

申请人： Jun Hwan Jeong ,  Seung Chul Lee ,  Hyun Choi

发明人： Jun Hwan Jeong ,  Seung Chul Lee ,  Hyun Choi

IPC分类号： H01C1700

CPC分类号： H01C17/283 ,  H01C1/028 ,  H01C1/148 ,  H01C7/003 ,  Y10T29/43 ,  Y10T29/49082 ,  Y10T29/49085 ,  Y10T29/49099

摘要： A ceramic chip-type device having a glass coating film and a fabricating method thereof are provided, in which a coating film having an excellent acid-resistant property is formed on the surface of the ceramic chip device. Thus, the ceramic chip-type device having a glass coating film stands an attack due to a flux at the time of reflow soldering, to thereby maintain an initial insulation resistance. The ceramic chip-type device is made of a ceramic passive device chip including a pair of external electrode terminals on either end of the ceramic chip-type device, and a glass coating film of an excellent acid-resistant property formed on the surface of a ceramic body located between the pair of external electrode terminals.

摘要翻译： 提供一种具有玻璃涂膜的陶瓷芯片型器件及其制造方法，其中在陶瓷芯片器件的表面上形成了耐酸性优异的涂膜。 因此，具有玻璃涂膜的陶瓷芯片型器件由于在回流焊接时的焊剂而发生冲击，从而保持初始绝缘电阻。 陶瓷芯片型器件由陶瓷芯片型器件的两端的一对外部电极端子和陶瓷芯片型器件的表面上形成的耐酸性优异的玻璃涂膜构成， 陶瓷体位于一对外部电极端子之间。

公开(公告)号：US06820324B2

公开(公告)日：2004-11-23

申请号：US10451161

申请日：2003-06-18

申请人： Yoshifumi Matsumoto ,  Hiromi Yabutani

发明人： Yoshifumi Matsumoto ,  Hiromi Yabutani

IPC分类号： H01C1700

CPC分类号： H01C1/144 ,  H01C1/028 ,  H05K3/202 ,  H05K3/284 ,  H05K3/3442 ,  Y10S439/907 ,  Y10T29/49082 ,  Y10T29/49085 ,  Y10T29/49087 ,  Y10T29/49099

摘要： A resistor connector (C) includes a pair of parallel lead frames (1, 1), a resistor (10) with a pair of electrodes (14, 14) and a mold resin (2). Each said lead frame (1) includes a terminal portion (1a) and an electrode connection portion. Said pair of electrodes (14, 14) are electrically connected to respective said electrode connection portions of said pair of lead frames (1, 1) through solder (b). Said mold resin (2) covers said resistor (10) so as to expose said terminal portion (1a, 1a). Said lead frame (1) includes solder flow inhibit means (40, 41) between said electrode connection portion and said terminal (1a) for preventing said solder (b) to flow towards said terminal portion (1a).

摘要翻译： 电阻器连接器（C）包括一对平行引线框架（1,1），具有一对电极（14,14）和模制树脂（2）的电阻器（10）。 每个所述引线框架（1）包括端子部分（1a）和电极连接部分。 所述一对电极（14,14）通过焊料（b）电连接到所述一对引线框架（1,1）的相应的所述电极连接部分。 所述模塑树脂（2）覆盖所述电阻器（10）以暴露所述端子部分（1a，1a）。 所述引线框架（1）包括在所述电极连接部分和所述端子（1a）之间的阻止所述焊料（b）朝向所述端子部分（1a）流动的阻焊装置（40,41）。

公开(公告)号：US06751848B2

公开(公告)日：2004-06-22

申请号：US10180061

申请日：2002-06-27

申请人： Syunsuke Nagakura ,  Manabu Ooishi ,  Hisafumi Maruo

发明人： Syunsuke Nagakura ,  Manabu Ooishi ,  Hisafumi Maruo

IPC分类号： H01C1700

CPC分类号： G01F23/36 ,  H01C10/44 ,  H01C17/235 ,  Y10T29/49004 ,  Y10T29/49082 ,  Y10T29/49098 ,  Y10T29/49099

摘要： A method of adjusting a resistance value of a film resistor. The method includes defining, as a single resistive element, a portion of a resistive film formed over a first linear conductive film formed at a position at which a first resistance value is detected when an electric contact is slid thereto, and a second linear conductive film formed at a position at which a second resistance value is detected when the electric contact is slid thereto. The method also includes trimming a portion of the resistive element at opposite sides of the first linear conductive film in a longitudinal direction substantially perpendicular to the width direction to form first and second trimmed portions; and trimming a portion of the resistive element from an end of the second trimmed portion in the width direction toward the second linear conductive film to form a third trimmed portion.

摘要翻译： 调整薄膜电阻的电阻值的方法。 该方法包括将形成在第一电阻值被检测到的位置处的第一线性导电膜上形成的电阻膜的一部分定义为电触点滑动时的第一线性导电膜 形成在电触点滑动时检测到第二电阻值的位置。 该方法还包括在基本上垂直于宽度方向的纵向上修剪第一线性导电膜的相对侧的电阻元件的一部分，以形成第一和第二修剪部分; 以及从宽度方向上的第二修剪部分的端部朝向第二线性导电膜修剪电阻元件的一部分，以形成第三调整部分。