公开(公告)号：US06848153B2

公开(公告)日：2005-02-01

申请号：US10315091

申请日：2002-12-10

申请人： Shigeru Tsuzuki ,  Kunihiro Fujii ,  Masahiro Takada ,  Satoshi Matsuo ,  Takafumi Koga ,  Kozo Murakami

发明人： Shigeru Tsuzuki ,  Kunihiro Fujii ,  Masahiro Takada ,  Satoshi Matsuo ,  Takafumi Koga ,  Kozo Murakami

IPC分类号： H03H9/25 ,  H03H3/08 ,  H03H9/10 ,  H04R17/00

CPC分类号： H03H9/1071 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/16195 ,  H03H3/08 ,  H03H9/0585 ,  H03H9/059 ,  Y10T29/42 ,  Y10T29/49117 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49789 ,  Y10T29/49798 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method of manufacture of a surface acoustic wave device which includes a step of applying a photosensitive film resist on a substrate and forming a photosensitive film resist layer over at least a portion of a surface of the substrate; a step of forming acoustic absorbers only at the two sides orthogonal to the direction of the surface acoustic wave transmission; a step of placing in a package a surface acoustic wave element obtained by cutting and dividing the substrate and electrically connecting a connection electrode of the surface acoustic wave element with an external terminal of the package; and a step of sealing an opening of the package with a lid, wherein the main surface of the acoustic absorbers is formed parallel to the surface of the substrate.

摘要翻译： 一种声表面波装置的制造方法，其特征在于，在基板的表面的至少一部分上形成感光性膜保护层， 仅在与声表面波传播方向正交的两侧形成声吸收体的步骤; 在包装中放置表示声波元件的步骤，该表面声波元件是通过切割和分割基板并将表面声波元件的连接电极与封装的外部端子电连接而获得的; 以及用盖子密封包装的开口的步骤，其中吸声器的主表面平行于基板的表面形成。

公开(公告)号：US06534901B1

公开(公告)日：2003-03-18

申请号：US09890914

申请日：2001-11-21

申请人： Shigeru Tsuzuki ,  Kunihiro Fujii ,  Masahiro Takada ,  Satoshi Matsuo ,  Takafumi Koga ,  Kozo Murakami

发明人： Shigeru Tsuzuki ,  Kunihiro Fujii ,  Masahiro Takada ,  Satoshi Matsuo ,  Takafumi Koga ,  Kozo Murakami

IPC分类号： H03H910

CPC分类号： H03H9/1071 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/14 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/16195 ,  H03H3/08 ,  H03H9/0585 ,  H03H9/059 ,  Y10T29/42 ,  Y10T29/49117 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49789 ,  Y10T29/49798 ,  H01L2924/00014 ,  H01L2924/00

摘要： A SAW element (13) is formed of a piezoelectric substrate (14), on which are provided IDT electrodes (15), connection electrodes (16), underlying metal layers (17), and acoustic materials (18) placed on the underlying metal layers (17) and having surfaces parallel to the main surface of the piezoelectric substrate (14). The SAW element is mounted in a package (10), which is provided with external terminals (11) connected with the connection electrodes (16), and the package is hermetically sealed with a lid (20) to form a SAW device. When such a SAW element (13) is mounted faceup in a package (10) using a vacuum chuck (30), its piezoelectric substrate (14) can be protected against damage. When a SAW element (13) provided with bumps (23) on its connection electrodes (16) is mounted facedown in a package (10), the failure of electrical connections can be prevented.

摘要翻译： SAW元件（13）由压电基板（14）形成，其上设有IDT电极（15），连接电极（16），下面的金属层（17）和声学材料（18）放置在下面的金属 层（17）并且具有平行于压电基板（14）的主表面的表面。 SAW元件安装在具有与连接电极（16）连接的外部端子（11）的封装（10）中，并且封装件用盖（20）气密密封以形成SAW器件。 当使用真空卡盘（30）将这样的SAW元件（13）面对面地安装在封装（10）中时，可以保护其压电基板（14）免受损坏。 当在其连接电极（16）上设置有凸起（23）的SAW元件（13）面朝下安装在封装（10）中时，可以防止电连接的故障。

公开(公告)号：US06680528B2

公开(公告)日：2004-01-20

申请号：US09897423

申请日：2001-07-03

申请人： Satoshi Matsuo ,  Kunihiro Fujii ,  Takafumi Koga ,  Kozo Murakami

发明人： Satoshi Matsuo ,  Kunihiro Fujii ,  Takafumi Koga ,  Kozo Murakami

IPC分类号： H01L2312

CPC分类号： H01L23/49805 ,  H01L23/13 ,  H01L2224/48227

摘要： An electronic component having recesses on side faces of its package for housing an electric element therein. A metal layer that does not reach the bottom end of the package is formed on the surface of the recess. The metal layer has excellent wettability to a brazing material and helps extra material flow into the recess easily. In addition, the interface between the top end face of the recess and the side face is curved to make the brazing material flow into the recess easily. When the opening of the package is sealed with a lid using the brazing material, the extra brazing material flows into the recess. This prevents the brazing material from protruding outside of the package and thus improves dimensional accuracy of the electronic component. Therefore, mounting accuracy of the electronic component can be improved and short circuit can be prevented.

摘要翻译： 一种电子部件，其在其封装的侧面上具有凹部，用于在其中容纳电气元件。 在凹部的表面上形成没有到达封装的底端的金属层。 金属层对钎焊材料具有优异的润湿性，并且有助于额外的材料容易地流入凹部。 此外，凹部的顶端面与侧面之间的界面是弯曲的，以使钎焊材料容易地流入凹部。 当使用钎焊材料用盖子密封包装的开口时，额外的钎焊材料流入凹部。 这防止钎焊材料突出到包装外部，从而提高电子部件的尺寸精度。 因此，能够提高电子部件的安装精度，能够防止短路。

公开(公告)号：US20050036278A1

公开(公告)日：2005-02-17

申请号：US10932893

申请日：2004-09-02

申请人： Kozo Murakami ,  Kunihiro Fujii ,  Satoshi Matsuo

发明人： Kozo Murakami ,  Kunihiro Fujii ,  Satoshi Matsuo

IPC分类号： H01L21/50 ,  H01L21/60 ,  H01L23/057 ,  H01L23/13 ,  H01L23/552 ,  H03H9/25 ,  H02B1/00

CPC分类号： H01L24/80 ,  H01L21/50 ,  H01L23/057 ,  H01L23/13 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83136 ,  H01L2224/8547 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/1617 ,  H01L2924/16195 ,  H01L2924/3025 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An electronic component, in which a chip can be mounted on a certain predetermined place of the package at a high accuracy level, which package having a stepped level-difference in the inner wall of a cavity. The package is provided with a stepped level-difference in the inner wall surface, and an internal contact electrode formed on the upper surface of the stepped level-difference. At the bottom of the package is a shield electrode, on which a chip is mounted via an adhesion layer. The chip and the internal contact electrode are electrically connected by an interconnection wire. Location aligning for the chip and the interconnection wire, at least either one of these, is conducted by making use of a region, which is non-electrode portion, provided on the inner bottom surface of the package.

摘要翻译： 一种电子部件，其中芯片可以以高精度水平安装在封装的某个预定位置，该封装在空腔的内壁中具有台阶级差。 该封装件在内壁表面上具有台阶级差，而形成在阶梯级差的上表面上的内部接触电极。 在封装的底部是屏蔽电极，其上通过粘合层安装芯片。 芯片和内部接触电极通过互连线电连接。 通过利用设置在封装的内底面上的非电极部分的区域来进行芯片和互连线的位置对准，其中至少任一个进行。

公开(公告)号：US07345362B2

公开(公告)日：2008-03-18

申请号：US10932893

申请日：2004-09-02

申请人： Kozo Murakami ,  Kunihiro Fujii ,  Satoshi Matsuo

发明人： Kozo Murakami ,  Kunihiro Fujii ,  Satoshi Matsuo

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/552 ,  H01L23/02 ,  H01L29/22 ,  H01L33/00 ,  H01L23/12

CPC分类号： H01L24/80 ,  H01L21/50 ,  H01L23/057 ,  H01L23/13 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83136 ,  H01L2224/8547 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/1617 ,  H01L2924/16195 ,  H01L2924/3025 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An electronic component, in which a chip can be mounted on a certain predetermined place of the package at a high accuracy level, which package having a stepped level-difference in the inner wall of a cavity. The package is provided with a stepped level-difference in the inner wall surface, and an internal contact electrode formed on the upper surface of the stepped level-difference. At the bottom of the package is a shield electrode, on which a chip is mounted via an adhesion layer. The chip and the internal contact electrode are electrically connected by an interconnection wire. Location aligning for the chip and the interconnection wire, at least either one of these, is conducted by making use of a region, which is non-electrode portion, provided on the inner bottom surface of the package.

摘要翻译： 一种电子部件，其中芯片可以以高精度水平安装在封装的某个预定位置，该封装在空腔的内壁中具有台阶级差。 该封装件在内壁表面上具有台阶级差，而形成在阶梯级差的上表面上的内部接触电极。 在封装的底部是屏蔽电极，其上通过粘合层安装芯片。 芯片和内部接触电极通过互连线电连接。 通过利用设置在封装的内底面上的非电极部分的区域来进行芯片和互连线的位置对准，其中至少任一个进行。

公开(公告)号：US06804103B1

公开(公告)日：2004-10-12

申请号：US09856822

申请日：2001-08-27

申请人： Kozo Murakami ,  Kunihiro Fujii ,  Satoshi Matsuo

发明人： Kozo Murakami ,  Kunihiro Fujii ,  Satoshi Matsuo

IPC分类号： H01H4700

CPC分类号： H01L24/80 ,  H01L21/50 ,  H01L23/057 ,  H01L23/13 ,  H01L23/552 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2224/83136 ,  H01L2224/8547 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15787 ,  H01L2924/1617 ,  H01L2924/16195 ,  H01L2924/3025 ,  H03H9/1071 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： An electronic component, in which a chip can be mounted on a certain predetermined place of the package at a high accuracy level, which package having a stepped level-difference in the inner wall of a cavity. The package 13 is provided with a stepped level-difference 26 in the inner wall surface, and an internal contact electrode 14 formed on the upper surface of the stepped level-difference 26. At the bottom of the package 13 is a shield electrode 15, on which a chip 17 is mounted via an adhesion layer 16. The chip 17 and the internal contact electrode 14 are electrically connected by an interconnection wire 19. Location aligning for the chip 17 and the interconnection wire 19, at least either one of these, is conducted by making use of a region 18a, 18b, which is non-electrode portion, provided on the inner bottom surface of the package 13.

摘要翻译： 一种电子部件，其中芯片可以以高精度水平安装在封装的某个预定位置，该封装在空腔的内壁中具有台阶级差。 封装13在内壁表面设置阶梯级差26，在台阶级差26的上表面上形成有内部接触电极14.封装13的底部是屏蔽电极15， 芯片17通过粘合层16安装在芯片17上。芯片17和内部接触电极14通过互连线19电连接。芯片17和互连线19的位置对准，这些中的至少一个， 通过利用设置在包装13的内底面上的非电极部分的区域18a，18b进行。

公开(公告)号：US06831752B1

公开(公告)日：2004-12-14

申请号：US09610655

申请日：2000-07-05

申请人： Satoshi Matsuo

发明人： Satoshi Matsuo

IPC分类号： G06K1500

CPC分类号： G06F3/1204 ,  G06F3/1205 ,  G06F3/1253 ,  G06F3/1284

摘要： The purpose of the invention is to provide a disk driver which makes it easy for users to set the settings. In a device driver which operates in the computer and has a function where each item of the device is set, when the arrangement information stored in the memory corresponding to a user is read in, the screen shows a display in accordance with it. In the arrangement settings, the user can freely arrange each of the setting items on the screen. Then the arrangement information is maintained in the computer together with the user information.

摘要翻译： 本发明的目的是提供一种磁盘驱动器，其使得用户容易设置设置。 在在计算机中操作并且具有设置设备的每个项目的功能的设备驱动器中，当存储在与用户相对应的存储器中的布置信息被读入时，屏幕显示根据它的显示。 在布置设置中，用户可以在屏幕上自由地布置每个设置项目。 然后将该配置信息与用户信息一起保存在计算机中。

公开(公告)号：US4785402A

公开(公告)日：1988-11-15

申请号：US924559

申请日：1986-10-29

申请人： Satoshi Matsuo ,  Yasuo Miyajima

发明人： Satoshi Matsuo ,  Yasuo Miyajima

IPC分类号： A61B8/06 ,  G01N29/06 ,  G01P5/24 ,  G01S15/89 ,  G06F15/42

CPC分类号： G01N29/0609 ,  A61B8/06 ,  G01P5/244 ,  G01S15/8979 ,  G01N2291/02836

摘要： An ultrasonic imaging apparatus comprises an ultrasonic transducer for emitting an ultrasonic beam onto an interest region of a living body containing a blood flow and outputting an echo signal, a correlation circuit for determining a correlation of the signals obtained from the ultrasonic transducer and a velocity calculation circuit for calculating the velocity of the blood flow from the correlation data obtained by the correlation circuit. A zero shift process circuit zero-shifts the velocity data obtained from the velocity calculation circuit and compresses the zero-shifted velocity data in correspondance with an amount of zero shift. The zero-shifted flow velocity data is displayed within a possible display range.

摘要翻译： 超声波成像装置包括超声波换能器，用于将超声波束发射到包含血流的生物体的兴趣区域并输出回波信号;相关电路，用于确定从超声换能器获得的信号与速度计算的相关性 根据由相​​关电路获得的相关数据计算血流速度的电路。 零移位处理电路对从速度计算电路获得的速度数据进行零位移动，并根据零位移量压缩零位速度数据。 零位流速数据显示在可能的显示范围内。

公开(公告)号：US07334974B2

公开(公告)日：2008-02-26

申请号：US10493524

申请日：2002-10-25

申请人： Satoshi Matsuo ,  Hidenori Kanazawa

发明人： Satoshi Matsuo ,  Hidenori Kanazawa

IPC分类号： F16B39/00 ,  C08L77/06

CPC分类号： C08G18/8074 ,  C08G18/3281 ,  C08G18/60 ,  C08G18/603 ,  C08G69/48 ,  C08G2170/80 ,  C09J175/04 ,  Y10S411/93

摘要： A composition for use as a self-locking agent is provided which comprises an aqueous dispersion of the following ingredients dissolved and dispersed in water: (a) a polyamide powder insoluble or slightly soluble in water, (b) an isocyanate compound, (c) a surfactant and (d) a water-soluble polyamide. The composition permits a polyamide resin layer of a smooth surface to be formed on a screw surface of a to-be-coated member. With use of the composition, it is possible to prevent slippage and sagging of the resin layer coated on the screw surface and improve the precision in resin coating processing.

摘要翻译： 提供一种用作自锁剂的组合物，其包含溶解并分散在水中的以下成分的水分散体：（a）不溶于或微溶于水的聚酰胺粉末，（b）异氰酸酯化合物，（c） 表面活性剂和（d）水溶性聚酰胺。 该组合物允许在待涂覆部件的螺纹表面上形成光滑表面的聚酰胺树脂层。 通过使用该组合物，可以防止涂布在螺丝表面上的树脂层的滑动和下垂，提高树脂涂布处理的精度。

公开(公告)号：US5022382A

公开(公告)日：1991-06-11

申请号：US355748

申请日：1989-05-23

申请人： Hiroshi Ohshoji ,  Fumio Ohshima ,  Satoshi Matsuo

发明人： Hiroshi Ohshoji ,  Fumio Ohshima ,  Satoshi Matsuo

IPC分类号： G02B23/24 ,  A61B1/00 ,  A61B1/04 ,  H04N5/225

CPC分类号： A61B1/042 ,  H04N2005/2255

摘要： An endoscope including a scope for observing an object, in which at least one of sucking, gas feeding and liquid feeding operations is conducted at the scope, and a time elapsed after a start of the operation is detected by a time detector, and in which the time detected by the time detector is compared with a predetermined reference value, and then the operation is canceled by a canceling device when the time detected by the detected means is at least equal to the predetermined reference value.

摘要翻译： 一种内窥镜，包括用于观察物体的观察范围，其中在该范围内进行吸气，供气和送液操作中的至少一个，并且通过时间检测器检测到在操作开始之后经过的时间，其中 将由时间检测器检测的时间与预定的参考值进行比较，然后当检测到的装置检测到的时间至少等于预定的参考值时，由取消装置取消操作。